Hitachi High-tech Instruments Company, Ltd.

Graham Packaging Company, L.p.

Akio Watanabe

Kazuyoshi Oyama

Akihiro Kawai

Makio Kameda

Tetsuji Ono

Kazuyoshi Ieizumi

Yasuhiro Sato

Masaru Kimura

Yoshiharu Fukushima

Takuya Imoto

Shunzo Miyazaki

The present invention provides a method and device for producing a content filling bottle including a bottom part that is inverted between a concave shape and a convex shape to prevent a body part from being subjected to reduced pressure deformation, the method and device being capable of efficiently producing a sanitary and high-quality content filling bottle. Contents are filled into an empty bottlewith an inversion partprojecting outwardly from the body part. A capis fitted onto an opening of the bottleto seal the bottle. An auxiliary toolis then installed on the bottom partof the bottle. Then, the bottom part of the bottlewith the auxiliary toolinstalled thereon is supported via the auxiliary tool. The downwardly projecting inversion partis pressed up so as to be inverted and recessed inwardly into the bottle. Subsequently, with the opening of the bottlegripped, the auxiliary toolis separated from the bottle

Method and device for producing content filling bottle

The invention is directed to an unfailing pickup operation of an electronic component from a component storage portion at a seam of storage tapes connected even using a connection tape and prevention of reduction in a pickup rate of an electronic component. A CPU sends a feeding command to a component feeding unit to perform a component feeding operation or the like. Then, when the CPU judges that a connection tape reaches a pickup position, the CPU drives an X axis drive motor and a Y axis drive motor to move a board recognition camera to the pickup position of the feeding unit, the camera takes an image of a storage portion of a storage tape, and a recognition processing device performs recognition processing. A correction value based on a result of this recognition processing is stored in a RAM, and a suction nozzle is moved taking this correction value into account and lowers to pick up an electronic component.

Electronic component mounting apparatus

A method of mounting electronic components on a printed board includes providing a storage tape including a first portion and a second portion that are connected by a connection tape and containing electronic components stored therein, advancing the storage tape so that an electronic component is advanced to a component pickup position where electronic components are picked up by a suction nozzle, picking up the advanced electronic component at the component pickup position by the suction nozzle, and mounting the picked up electronic component on a printed board. The advancing of the storage tape, the picking up of the electronic component and the mounting of the electronic component are repeated, and the component pickup position is adjusted when the second portion of the storage tape is advanced to the component pickup position.

Electronic component mounting method

The invention prevents reduction of a pickup rate even when a storage tape in use and a new storage tape are connected to each other with a connection tape. A component recognition camera takes an image of an electronic component held by a suction nozzle, and a recognition processing device performs recognition processing. When a positional shifting amount calculated by CPU based on the recognition processing result is more than &#x3b1;, a board recognition camera takes an image of a storage portion of a storage tape storing a next electronic component to be picked up. When a positional shifting amount of the storage portion calculated based on the recognition processing result is more than &#x3b2;, the CPU enables seam passage processing. Based on the image taking of the storage portion by the board recognition camera and the recognition processing by the recognition processing device which are performed each time the storage tape is fed N times, the CPU controls correction of a pickup position.

Growing community of inventors

Gunma, Japan

Akio Watanabe