Hitachi, Ltd.

Hitachi Chemical Company, Ltd.

Other

Central Glass Company, Limited

Hitachi Powdered Metals Co., Ltd.

Akio Takahashi

Akira Nagai

Motoyo Wajima

Haruo Akahoshi

Yuichi Satsu

Masao Suzuki

Toshikazu Narahara

Junichi Katagiri

Masahiro Suzuki

Katuo Sugawara

Hirosada Morishita

Akio Mukoh

Shin Nishimura

Mineo Kawamoto

Takao Miwa

Takeyuki Itabashi

Satoru Amou

Takumi Ueno

Tokihito Suwa

Kunio Miyazaki

Toshiya Satoh

Masahiko Ogino

Toshiaki Ishii

Naotaka Tanaka

Shuji Eguchi

Hiroaki Miyata

Tadashi Fujieda

Kazuhiro Suzuki

Masanori Segawa

Fumiyuki Kobayashi

Akishi Nakaso

Noboru Baba

Chio Ishihara

Hitoshi Suzuki

Shunichi Numata

Hideaki Katayama

Kanji Murakami

Ryo Hiraga

Shigeo Amagi

Hiroshi Yamazaki

Yutaka Sugita

Kazuji Yamada

Takao Ishikawa

Tadahiko Miyoshi

Satoru Ogihara

Koji Suzuki

Akira Kageyama

Yoshinori Ejiri

Masahiro Ono

Takeshi Shimazaki

Ritsuro Tada

Osamu Miura

Ryuji Watanabe

Masashi Miyazaki

Harukazu Nakai

Yuzo Ito

Yutaka Itoh

Kenji Tsukanishi

Shinji Yamada

Tsutomu Imai

Shiro Kobayashi

Mitsuo Yokota

Masanori Nemoto

Katsuo Sugawara

Hiroyuki Fukai

Yoshinori Kawai

Yukio Ookoshi

Shunya Yokozawa

Keiko Tawara

Toshiaki Ishimaru

Kazuo Asaka

Akio Nishikawa

Toru Koyama

Yoshiaki Okabe

Kazuhiro Satou

Yoshihiro Suzuki

Chikara Tanaka

Kiyonori Kogawa

Morimichi Umino

Keiji Fukushi

Koo Honjo

Ichirou Anjou

Akira Masaki

Takeshi Nojiri

Hirokazu Inoue

Minoru Yamada

Haruhiko Matsuyama

Yoshihiro Nomura

Shinji Tsuchikawa

Keiichirou Nakanishi

Kiyoshi Hasegawa

Masamichi Maruta

Kenji Takai

Takahiro Suzuki

Toshiyasu Kawai

Toyofusa Yoshimura

Mina Ishida

Shinji Iioka

Tadashi Narita

Akio Nakano

A high dielectric composite material obtained by subjecting submicron particles of an inorganic filler containing a metal as its essential component to an insulating treatment such as a chemical treatment, further subjecting to a surface treatment for improving their compatibility with organic resins, and then dispersing in an organic resin, has a dielectric constant of 15 or above, with its dielectric loss tangent in the frequency region of from 100 MHz to 80 GHz being 0.1 or less, and can therefore be used effectively for multilayer wiring boards and module substrates.

High dielectric constant composite material and multilayer wiring board using the same

An electronic device for high frequency signals having a small dielectric loss and a high efficiency is provided, in which a low dielectric loss tangent resin composition is used, for coping with high frequency signals, as an insulating layer. The electronic device is fabricated using an insulating layer containing a crosslinked structure of a crosslinking ingredient represented by the following general formula (I): (where R represents a hydrocarbon skeleton, R, which may be identical or different from each other, represents a hydrogen atom or a hydrocarbon group of 1 to 20 carbon atoms, R, Rand R, which may be identical or different from each other, each represents a hydrogen atom or a hydrocarbon group of 1 to 6 carbon atoms, m is an integer of 1 to 4 and n is an integer of 2 or greater).

Electronic device using low dielectric loss tangent insulators for high frequency signals

A thermosetting resin composition is produced by heat treating a mixture of a polyaddition thermosetting resin, a silicic compound of the formula wherein R is an organic group containing a functional group that causes an addition reaction with the curing agent and Rand Rare independently a methyl group or an ethyl group, and water and adding a curing agent of the polyaddition thermosetting resin to the mixture that has undergone heat treatment.

Thermosetting resin composition

An organic polymer film of low dielectric constant and high heating resistance which is applicable as an insulating layer of a semiconductor devices is provided, as well as a manufacturing method for the film and a semiconductor device incorporating the film.

Polyparaxylylene film, production method therefor and semiconductor device

A solvent-free thermosetting resin composition which comprises an epoxy resin (a) and a product (b) of the reaction of an organosilicon compound, represented by the general formula (1) (where R is an organic group containing a functional group reactive with an epoxy resin by addition reaction; and R1 is a methyl or ethyl group), with water, the product (b) containing organosilicon compound polycondensates formed in the epoxy resin (a) and having a degree of polycondensation of 2 or higher, and which has a low viscosity at a room temperature (25&#xb0; C.) and gives a cured resin having intact material properties, especially intact high-temperature mechanical properties; a process for producing the resin composition; and a product obtained by applying the composition.

Solvent-free thermosetting resin composition, process for producing the same, and product therefrom

A solvent-free thermosetting resin composition which comprises an epoxy resin (a) and a product (b) of the reaction of an organosilicon compound, represented by the general formula (1) (where R is an organic group containing a functional group reactive with an epoxy resin by addition reaction; and R1 is a methyl or ethyl group), with water, the product (b) containing organosilicon compound polycondensates formed in the epoxy resin (a) and having a degree of polycondensation of 2 or higher, and which has a low viscosity at a room temperature (25&deg; C.) and gives a cured resin having intact material properties, especially intact high-temperature mechanical properties; a process for producing the resin composition; and a product obtained by applying the composition.

The present invention is aimed to provide an electroless gold plating solution which requires less amount of a reducing agent, retains a sufficient deposition rate for a practical use, and has an excellent stability as a plating solution; and a method for carrying out an electroless gold plating. The present invention provides an electroless gold plating solution comprising a gold salt, a phenyl compound based reducing agent and a water-soluble amine and a method for plating using the gold plating solution.

Electroless gold plating solution and method for electroless plating

A device allows for continuous regulation of the composition of a fluid mixture that includes at least two components of different polarities. The device is designed, for example, to be inserted in a separation system that the device supplies with a carrier fluid of stabilized composition. The device includes a storage tank ( ) receiving a mixture coming from the separation system and at least one auxiliary vessel ( ) containing one of the components of the mixture. To control the transfer of this component from auxiliary vessel ( ) to storage tank ( ), the device further includes at least one tubular capacitive sonde (CS) totally immersed in the fluid mixture, a sonde (TS) for measuring the temperature of the mixture, and a sondc (LS) for measuring the mixture level in storage tank ( ). A regulating unit ( ) is connected to the various sondes to determine the volume of the component to be transferred to storage tank ( ) from the at least one auxiliary vessel in order to restore a set composition for the mixture. The device can be used, for example, for the control of simulated moving beds, of distillation columns, etc.

Thermal stable low elastic modulus material and device using the same

A resin composition useful as an adhesive film and insulating material for a multilayer wiring substrate or electronic parts comprises (A) a polymer containing a quinoline ring represented by the formula (1) in the structure such as 6,6&prime;-bis(2-(4-fluorophenyl)-4-phenylquinoline) and 4,4&prime;-(1,1,1,3,3,3-hexafluoro-2,2-propylidene)bisphenol, and (B) a bismaleimide compound represented by the formula (2) such as 2,2-bis((4-maleimidophenoxy)phenyl)propane.

Adhesive film of quinoline polymer and bismaleimide

A method of forming a semiconductor device having a multi-layered wiring structure that includes a conductor layer to be electrically connected to a packaging substrate, with the multi-layered wiring structure being provided on a circuit formation surface of a semiconductor chip. Ball-like terminals are formed, disposed in a grid array on the surface of the multi-layered wiring structure on the packaging substrate side. The multi-layered wiring structure is formed to include a buffer layer for relieving a thermal stress provided between the semiconductor chip and the packaging substrate, due to the packaging procedure. In the semiconductor device formed, the wiring distance is shorter than that of a conventional semiconductor device, so that an inductance component becomes smaller, to thereby increase signal speed. The distance between a ground layer and a power supply layer is shortened, to reduce noise produced upon operation, and also a thermal stress upon packaging is relieved by the buffer layer of the multi-layered wiring structure, resulting in improved connection reliability, and the number of terminals per unit can be increased, because of elimination of wire bonding. The buffer layer can be made of an elastomer, and can have a modulus of elasticity of 10 kg/mm or less.

Method of making a semiconductor device having a stress relieving mechanism

The present invention provides a soft magnetic powder composite core for an electric apparatus produced with soft magnetic particles having electric insulating layers on the surfaces thereof, wherein said electric insulating layers are formed by mixing said soft magnetic particles with an insulating layer-forming solution which comprises a phosphating solution and a rust inhibitor, which is an organic compound containing at least one of nitrogen or sulfur having a lone pair of electrons suppressing the formation of iron oxide and surfactant, and drying the treated soft magnetic particles at a predetermined temperature. The soft magnetic powder composite core is excellent in iron loss and magnetic flux density.

Treatment solution for forming insulating layers on magnetic particles process for forming the insulating layers, and electric device with a soft magnetic powder composite core

A thin-film multilayer wiring board with first and second metallic wiring layers formed on a substrate and an organic insulating layer interposed between the metallic wiring layers. The insulating layer has the first metallic wiring layer and via holes in a thickness of the insulating layer. The lands of the first and second metallic wiring layers are electrically connected by via studs which are made of a conductive metal filled in the via holes.

Thin-film multilayer wiring board with wiring and via holes in a thickness of an insulating layer

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Hitachiota, Japan

Akio Takahashi