Shin-etsu Chemical Co., Ltd.

Ngk Insulators, Inc.

Akio Suzuki

Shouhei Kozakai

Toshio Shiobara

Nobuhiro Ichiroku

Kunihiko Mita

Ikuo Sakurai

Hironao Fujiki

Hirofumi Kishita

Tomoyuki Fujii

Kazuhiko Tomaru

Tsutomu Yoneyama

Takeshi Hashimoto

Hiroshi Takei

Shigehisa Sonegawa

Masaaki Matumura

Takeshi Hoashimoto

Masaaki Matsumura

Hiroshi Endo

Naoki Fuse

The bonding material is formed of a cured sheet composed of an addition curable silicone adhesive agent, and the addition curable silicone adhesive agent contains an organopolysiloxane containing two or more vinyl groups per molecule; an organopolysiloxane resin containing a unit (hereinafter, 'M') represented by RSiO(R is a monovalent hydrocarbon group having 1 to 6 carbon atoms and containing no aliphatic unsaturated bond) and a unit (hereinafter, 'Q') represented by SiOin a molar ratio (M/Q ratio) equal to or more than 0.6 to equal to or less than 0.6 to 1.6; an organohydrogenpolysiloxane containing a silicon atom-bonding hydrogen atom; a platinum catalyst; and a heat conductive filler whose content falls within the range equal to or more than 20 vol % to equal to or less than to 50 vol %.

Bonding material and semiconductor supporting device

The present invention provides a heat conductive silicone rubber composite sheet that is suitable as a heat dissipating member provided between a heat generating electronic component and a heat dissipating component such as a heat dissipating fin, wherein the heat conductive silicone rubber composite sheet has a laminated structure with good electrical insulation and thermal conductivity, as well as excellent strength, flexibility, and particularly superior interlayer adhesion. The laminated structure has an intermediate layer and a pair of outer layers laminated to both surfaces of the intermediate layer, wherein

Heat conductive silicone rubber composite sheet

An electromagnetic wave absorbing heat conductive composition is used to form an electromagnetic wave absorbing heat dissipating article that is placed between a heat generating electronic component which, when operated, generates heat, reaches a temperature higher than room temperature and acts as an electromagnetic wave generating source, and a heat dissipating component. The composition is non-fluid at room temperature prior to operation of the electronic component, but acquires a low viscosity, softens or melts under heat generation during operation of the electronic component, to fluidize at least a surface of the composition so that the composition substantially fills any gaps between the electronic component and the heat-dissipating component.

Electromagnetic wave absorbing thermally conductive composition and thermosoftening electromagnetic wave absorbing heat dissipation sheet and method of heat dissipation work

An adhesive composition is provided comprising (A) a polyimide resin containing a diorganopolysiloxane linkage having vinyl groups as organic substituent groups on the backbone, (B) an epoxy resin, and (C) an epoxy resin-curing catalyst. An adhesive film prepared from the adhesive composition has a high bond strength to various substrates and to encapsulating resins when thermocompression bonded and heat cured thereto, and possesses a low modulus of elasticity and high heat resistance, ensuring manufacture of resin packaged semiconductor devices with high reliability.

Adhesive composition and adhesive film

A silicone adhesive having (A) an organopolysiloxane partial condensate of (i) a diorganopolysiloxane end-capped with a hydroxyl radical and (ii) an organopolysiloxane copolymer having hydroxyl radicals and having RSiOunits and SiOunits wherein Ris hydroxyl or a monovalent hydrocarbon radical, (B) a silane or siloxane compound having a silicon atom-bonded alkoxy radical and/or an epoxy radical, and (C) a crosslinking agent exhibits pressure-sensitive adhesion and permanent adhesion.

Silicone adhesive and adhesive film

A dicing/die bonding adhesion tape includes a substrate, a silicone adhesive layer, and a bonding layer. A tack strength of 0.2&#x2013;2.0 N/25 mm is developed between the silicone adhesive layer and the bonding layer. The bonding layer is formed of a bonding composition comprising (A) a polyimide resin, (B) an epoxy resin, and (C) an epoxy resin curing catalyst.

Dicing/die bonding adhesion tape

A silicone adhesive comprises (A) a reaction mixture obtained by subjecting a partially condensed mixture of (i) a hydroxy-terminated diorganopolysiloxane and (ii) an organopolysiloxane copolymer having hydroxyl and alkenyl radicals and comprising RSiOunits and SiOunits, and (iii) a silicon compound having a silicon atom-bonded hydrogen atom and a silicon atom-bonded alkoxy radical to addition reaction in the presence of a platinum catalyst and (B) a crosslinking agent. The silicone adhesive exhibits at the initial a tackiness sufficient to fixedly secure a substrate. By press bonding another substrate to the adhesive-bearing substrate and heating them, the substrates can be firmly bonded together.

Silicone adhesive and silicone adhesive film

A heat dissipating structure is provided which lowers the thermal contact resistance between a heat generating electronic component and a heat dissipating component, and markedly improves the heat radiation. The heat dissipating structure comprises a graphite sheet and a heat conducting material layer provided on at least one surface of the graphite sheet, and is positioned between the electronic component and the heat dissipating component. The heat conducting material has no fluidity at room temperature when the electronic component is not operating, but undergoes a reduction in viscosity, softens or melts, under the influence of heat generated during operation of the electronic component.

Heat dissipating structure

A silicone rubber composition comprising a soft magnetic powder, an optional heat conductive powder, and a surface treating agent selected from (a) an organopolysiloxane containing at least one alkoxy radical, hydroxyl radical or functional organic radical in a molecule, (b) a titanate coupling agent, and (c) an aluminum coupling agent is easily workable and flexible and has an ability to absorb electromagnetic waves and optionally, a heat transfer ability. Placement of the composition in an electronic equipment suppresses electromagnetic noise.

Electromagnetic wave absorbing silicone rubber compositions

A silicone rubber composition loaded with a soft magnetic metal powder and optionally, a heat conductive filler and having in the cured state a thermal conductivity of at least 2.0 w/mK is suitable for forming heat dissipating sheets having both a heat transfer function and a noise attenuation function, which are effective for preventing malfunction of CPU.

Electromagnetic wave absorbing, heat conductive silicone rubber compositions

This invention discloses a method of manufacturing a product of one-piece construction wherein silicone rubber has been made to adhere, characterized in that a substrate is immersed in a primer comprising:

Method of manufacturing a product of one-piece construction wherein

An eyeglass member, typically a nose pad or a temple end piece, which maintains its aesthetic appearance and close fit over long periods of service. The member has a cured coating of a fluorine-containing silicone on its surface or is made of a fluorine-containing silicone.

Growing community of inventors

Gunma-ken, Japan

Akio Suzuki