Omron Corporation

Omron Healthcare Company Ltd.

Akio Sumiya

Kazuyoshi Nishikawa

Satoshi Hirono

Tomoyuki Hakata

Makoto Tabata

Seiji Nakajima

Junji Kawamoto

Yuka Tanioka

Naoto Inoue

Ryo Sugihara

Shintaro Hara

Naoki Masutani

Tomohiro Fukuhara

Fumiaki Tanaka

Shota Akinaga

Shingo Yamamoto

Yasuo Matsuda

Hiroshige Uematsu

Makoto Tami

A method for producing a mesh including a resin mesh main body, and a resin reinforcing member configured to reinforce the mesh main body includes: a step of forming a plurality of through-holes using a laser beam in a mesh formation region of a first film material made of resin; a step of forming an opening portion in a second film material made of resin; a step of layering the first film material and the second film material so that the mesh formation region and the opening portion are arranged at positions that conform to each other; and a step of joining the first film material and the second film material to each other through laser welding at a portion surrounding the opening portion.

Method for producing mesh, and mesh

A bonding structure manufacturing method for manufacturing a bonding structure in which a first member and a second member are bonded is provided with: a step for forming a perforation with an opening in the surface of the first member and forming a protrusion that protrudes into the inner circumferential surface of the perforation; a step for disposing the region of the first member where the perforation is formed adjacent to the second member; and step for filling and curing the second member in the perforation of the first member by irradiating a laser on the region of the first member where the perforation is formed from the second member side.

Manufacturing method of bonding structure and bonding structure

A bonded structure is made of a first member and a second member which are bonded to each other. At least one bore having an opening is formed in a surface of the first member, and the second member is filled in the bore of the first member. The bore is defined by a diameter-increasing portion whose opening size increases in a depth direction from a surface side toward a bottom of the first member, and a first diameter-decreasing portion whose opening size decreases in the depth direction from the surface side toward the bottom. The diameter-increasing portion is formed on the surface side, and the first diameter-decreasing portion is formed on a bottom side.

Bonded structure and method for producing bonded structure

A method for assembling an apparatus including a display sheet having a non-transparent part in at least a part of the display sheet, has a bonding step of bonding the display sheet to a housing. The bonding step has a first step of attaching the display sheet to the housing via a UV curable adhesive, and a second step of causing an ultraviolet light emitting apparatus to irradiate, from an external surface side of the display sheet. The display sheet is attached to the housing with ultraviolet light after the first step so that the ultraviolet light passes through at least a part of the non-transparent part of the display sheet and cures the UV curable adhesive.

Method for assembling apparatus including display sheet and apparatus including display sheet

A power module can prevent damages due to cracking or breakage of an insulating substrate when molding even if a heat plate constituting a power module pre-product is made areally smaller than the insulating substrate, and can also sufficiently satisfy demand for minimization. Specifically, the power module pre-product is sealed by a molding resin layer in a state where externally exposed end portion on one end side in both external connecting terminals and the other surface side of a heat plate are each exposed to the outside. The power module substrate constituting a multilayer substrate body includes an aligning hole, into which an aligning pin is inserted, the pin being included in a lower molding die constituting a molding die with an upper molding die that molds a molding resin layer, so as to position the power module pre-product inside a cavity.

Power module

Growing community of inventors

Kusatsu, Japan

Akio Sumiya