Kaijo Corporation

Akio Sugito

Mami Kushima

Riki Jindo

Susumu Majima

Provided is a method for bonding an insulated coating wire, which is capable of stably bonding a metal wire in an insulated coating wire and an electrode. One aspect of the present invention provides a method for bonding an insulated coating wire for electrically connecting a first electrodeand a second electrode to each other by an insulated coating wirein which a metal wire is coated with an organic substance, the method including: a step (a) for placing the insulated coating wireonto the first electrode; a step (b) for exposing a metal wire from the insulated coating wire; and a step (c) for forming a first bump over the exposed metal wire and the first electrode to electrically connect the metal wire to the first electrode.

Method for bonding insulated coating wire, connection structure, method for stripping insulated coating wire and bonding apparatus

To provide a wire bonding apparatus, which is insusceptible to a bonding state at a second bonding point due to a wire cut error or the like, or to members such as a capillary and a wire, and is capable of automatically protruding the wire from a leading end of the capillary, provided is a wire bonding apparatus including: a capillary () having a through hole through which a wire () is to be inserted; a holding unit, which is provided above the capillary (), and is configured to hold the wire () inserted through the capillary (); and a vibrating unit configured to vertically vibrate the capillary (). Under a state in which the holding unit holds the wire (), the vibrating unit vertically vibrates the capillary () so that the wire () is protruded from the leading end of the capillary.

Method of vertically vibrating a bonding arm

[Problem] To provide a bonding device capable of adequately controlling a leading end of a capillary when a ball formed at a leading end of a wire is pressed and bonded to an electrode of a semiconductor chip with scrub vibration. [Solution] The bonding device is provided with a vibration driving portion (), the vibration driving portion () including a plurality of piezoelectric elements () that are expanded and contracted along an axial direction of a bonding arm () respectively with one end thereof fixed to a leading end of the bonding arm (), a plurality of capillary holding portions () that are in contact respectively with a circumferential face of a capillary () at a base end side thereof as being fixed correspondingly to the other end of the piezoelectric elements (), and a pressing-holding portion () that sandwiches the capillary () as pressing the capillary () to the capillary holding portions () with at least one end side fixed to the bonding arm () and the other end side being in contact with the circumferential face of the capillary () at the base end side thereof on a side opposite to the capillary holding portions (). Here, functional operation of amplitude, phase, frequency, or waveform is performed on drive voltage waveform to the respective piezoelectric elements.

Bonding device

[Problem] To provide a bonding device in which a capillary can perform stable vibration from a low frequency to a high frequency while achieving lightening and downsizing of a load to be driven by a piezoelectric element and in which stable vibration can be transmitted to the capillary without disturbing operation of expansion and contraction of the piezoelectric element as keeping preliminary pressure to the capillary constant. [Solution] The bonding device is provided with a vibration driving portion (), the vibration driving portion () including a piezoelectric element () that is expanded and contracted along an axial direction of a bonding arm () with one end thereof fixed to a leading end of the bonding arm (), a capillary holding portion () that is in contact with a circumferential face of a capillary () at a base end side thereof as being fixed to the other end of the piezoelectric element (), a string-like member () that is wound to a half circumferential face of the capillary () at the base end side on a side opposite to the capillary holding portion (), and a tension mechanism () that is arranged at the bonding arm () side to press and hold the capillary () to the capillary holding portion () by exerting tensile force on the string-like member ().

To provide a bonding device capable of adequately controlling a leading end of a capillary when a ball formed at a leading end of a wire is pressed and bonded to an electrode of a semiconductor chip with scrub vibration. The bonding device is provided with a vibration driving portion (), the vibration driving portion () including a plurality of piezoelectric elements () that are expanded and contracted along an axial direction of a bonding arm () respectively with one end thereof fixed to a leading end of the bonding arm (), a plurality of capillary holding portions () that are in contact respectively with a circumferential face of a capillary () at a base end side thereof as being fixed correspondingly to the other end of the piezoelectric elements (), and a pressing-holding portion () that sandwiches the capillary () as pressing the capillary () to the capillary holding portions () with at least one end side fixed to the bonding arm () and the other end side being in contact with the circumferential face of the capillary () at the base end side thereof on a side opposite to the capillary holding portions (). Here, functional operation of amplitude, phase, frequency, or waveform is performed on drive voltage waveform to the respective piezoelectric elements.

To provide a bonding apparatus capable of bonding at a high speed without performing a height measurement of a bonding point before a searching operation and the bonding. A confocal optical system mounted on a bonding arm pivotable upward and downward and configured to perform detection of a focus of a bonding point located on a surface of a bonded part, a bonding tool configured to be movable integrally with the bonding arm and perform bonding, and position detecting means configured to detect the position of the bonding tool, wherein the bonding tool is configured to move downward by a predetermined distance from a position of the bonding tool detected by the position detecting means by focus detection by the confocal optical system to a preset bonding point (amount of downward movement from a focus) during the downward movement of the bonding tool to the bonding point and stop on the bonding point.

Growing community of inventors

Tokyo, Japan

Akio Sugito