Mitsubishi Electric Corporation

Akio Shirasaki

Norio Okada

Tatsuki Otani

Nobuo Ohata

This optical module comprises: a semiconductor laser, an optical receiver, and a lens that are mounted on a carrier; an optical fiber; and a control circuit that controls the injection current of the laser such that the output current is kept constant. The lens and at least a part of the receiver are respectively fixed on the carrier with resin bonding materials that undergo thermosetting shrinkage. Initial positions in the laser, a tip end part of the optical fiber, the receiver, and the lens with respect to a reference as the rear surface of the carrier are determined such that change trends of the optical coupling efficiency characteristics between the laser and the receiver and between the laser and the optical fiber are to be the same with respect to an exposure time during which the optical module is exposed to environmental temperature higher than room temperature.

Optical module

An optical module includes: a stem including a first surface and a second surface opposite to the first surface; a thermoelectric cooler including a heat-releasing substrate fixed to the first surface; a semiconductor laser element attached to the thermoelectric cooler; a cap fixed to the first surface and covering the thermoelectric cooler and the semiconductor laser element; a lens fixed to the cap; and a restriction body fixed to the second surface. The linear thermal expansion coefficients of the heat-releasing substrate and the restriction body are smaller than the linear thermal expansion coefficient of the stem.

Optical module having restriction body fixed to stem and having a linear thermal expansion coefficient smaller than that of the stem

Provided is an optical module comprising a plate-like metal stem and a semiconductor optical modulation element mounted to a dielectric substrate provided on one side of the metal stem, wherein the metal stem has a metal stem penetration section in which a metal lead pin is inserted coaxially in a penetration hole which is formed in the metal stem and a dielectric member is provided to fill the penetration hole around the outer circumference of the lead pin, and a signal for modulation is supplied to the semiconductor optical modulation element connected in parallel with a terminal matching circuit, from the other side of the metal stem via the metal stem penetration section, wherein the terminal matching circuit is configured by a series connecting body which is comprised of a first resistor and a parallel body which is comprised of a second resistor and a capacitor.

Optical module and optical transmitter

An optical module includes: a stem; a temperature control module; a carrier; a light emitting element fixed on a light emitting element fixing surface of the carrier, having a front surface and a rear surface opposite to each other, emitting signal light from a first emission point in the front surface, and emitting back light from a second emission point in the rear surface; a light receiving element fixed on the carrier by a light receiving element fixing surface; a lens cap; and a lens, wherein a reflecting surface is provided on the carrier, the light receiving element receives the back light reflected by the reflecting surface, and a center of a light receiving surface of the light receiving element is positioned between the front surface and the rear surface in an optical axis direction of the signal light.

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Tokyo, Japan

Akio Shirasaki