Osaka University

Yamato Scientific Co., Ltd.

Akio Shimoyama

Katsuaki Suganuma

Shijo Nagao

Kazutaka Takeshita

Dongjin Kim

Naoki Wakasugi

Shinya Seki

Wakasugi Naoki

A substrate evaluation chip is used to perform a test for evaluating a thermal characteristic of a mounting substrate that is mountable a power semiconductor. The substrate evaluation chip includes an insulating substrate bonded with the mounting substrate, and a heating pattern that is formed on a surface of the insulating substrate by a metallic film and is arranged by having a predetermined shape that is optimized to beat the insulating substrate more uniformly. The insulating substrate is a substrate in which an insulating film is formed on a surface of a single crystal substrate having a thermal conductivity of 250 [W/mK] or more.

Substrate evaluation chip and substrate evaluation device

A bonding device () bonds at least one component (C) to a substrate (B) using a metal material (M). The bonding device () includes a wall section (), at least one pressing section (), and a rotational shaft (). The rotational shaft () is fixed to the wall section (). Each pressing section () has an arm () and a presser () or a substrate supporting member (). The arm () extends from the rotational shaft (). The arm () pivots about the rotational shaft (). The presser () presses the component (C). The substrate supporting member () is disposed on a reference surface (). The substrate supporting member () supports the substrate (B). The component (C) is bonded to the substrate (B) through point contact of the presser () with the component (C) or point contact of the substrate supporting member () with the reference surface ().

Bonding device

Growing community of inventors

Suita, Japan

Akio Shimoyama