Sumitomo Metal Mining Company, Ltd.

Nippon Telegraph and Telephone Public Corporation

Nippon Telecommunication Engineering Company

Akio Miyoshi

Toshio Takahashi

Kishio Arita

Mitsushi Ishida

Akira Fukami

Hajime Izumimori

A hermetic sealing cover assembly for a semiconductor device, etc. has a seal ring and a metallic cover joined thereto. The seal ring has a thin layer of gold, silver, platinum or palladium. The cover has a film of a material of high solderability, such as gold or nickel, formed at least on the peripheral edge of its surface facing the seal ring. The ring is joined in its entirety to the peripheral edge of the cover so that the layer on the ring may be bonded to the film on the cover. A method of producing such a sealing cover assembly is also disclosed.

Hermetic sealing cover and a method of producing the same

A copper alloy which is high in strength and electroconductivity is manufactured by casting, without chill casting, a copper alloy mass substantially consisting of copper and containing 0.2 to 1.5% by weight of chromium and 0.01 to 0.5% by weight of tin, hot working the cast copper alloy mass, then cooling, not slowly, the hot worked alloy mass without being subjected to any solid solution treatment, further cold working the cooled alloy mass, and thereafter subjecting the cold worked alloy mass to an aging treatment.

Method for manufacture of high-strength high-electroconductivity copper

Growing community of inventors

Ichikawa, Japan

Akio Miyoshi