Kabushiki Kaisha Toshiba

Akio Kosaka

Hidehiro Watanabe

Kenji Masui

A substrate cleaning apparatus is provided that includes a cleaning cup for receiving a to-be-cleaned substrate, a table in the cleaning cup, a first, second, and third nozzles, a pure water heating mechanism configured to supply hot pure water, a branch line, a control mechanism, and an open/close valve, provided between the branch line and the pipe, wherein the open/close valve is configured to interrupt emission of hot water from the third nozzle by opening the open/close valve to lower the pressure in the pipe.

Substrate cleaning method and substrate cleaning apparatus

A to-be-cleaned substrate is cleaned by use of an acid liquid agent in a cleaning cup, the remaining acid liquid agent is washed out by use of pure water, then an alkaline liquid agent is emitted to the surface of the to-be-cleaned substrate in the same cleaning cup to remove the acid liquid agent remaining on the to-be-cleaned substrate. A neutralization reaction between the acid and alkali is caused by emitting the alkaline liquid agent to the surface of the to-be-cleaned substrate so as to efficiently remove the acid liquid agent remaining on the surface of the to-be-cleaned substrate.

This specification discloses an invention directed to an ultrasonic cleaning apparatus for cleaning a cleaning target. The ultrasonic cleaning apparatus includes a liquid discharge nozzle having a discharge port to discharge a liquid therethrough, an ultrasonic vibrator for applying ultrasonic vibrations to the liquid which is to be supplied to the nozzle, and a cleaning member which is mounted on the discharge port of the nozzle, vibrates while holding therein the liquid discharged through the discharge port, and comes into contact with the cleaning target with a predetermined area, thereby scrub-cleaning the surface of the cleaning target.

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Kawasaki, Japan

Akio Kosaka