Komatsu Corporation

Kelk Ltd.

Akio Konishi

Katsushi Fukuda

Kenichi Tomita

Takeshi Kajihara

Kiyoharu Sasaki

Takeji Kajiura

Yasunori Sato

Kousuke Terauchi

Yong Hoon Lee

Masataka Yamanashi

Mitsuoki Konnai

Hideyuki Ishikawa

Keisuke Ikeda

A thermoelectric element includes a p-type/n-type semiconductor element having an upper end surface and a lower end surface, a lower electrode that is joined to the lower end surface of the p-type/n-type semiconductor element to connect the p-type/n-type semiconductor element and another n-type/p-type semiconductor element adjacently thereto and has an area less than that of the lower end surface in a joint region therebetween. A joint portion is made of a solder and has a surface joint part joining the lower end surface of the p-type/n-type semiconductor element and a surface of the lower electrode while the lower end surface of the p-type/n-type semiconductor element and the surface of the lower electrode are opposed to each other A fillet part is formed to fill a space produced between intersecting surfaces, i.e., the lower end surface and a lateral side of the lower electrode, and composes a step part formed by the lower end surface and the lower electrode.

Thermoelectric element and thermoelectric module provided with same

A Peltier module for laser diode that can be mounted with high melting point solder is provided. A Peltier module for laser diode includes: a heat dissipation-side substrate; a heat dissipation-side electrode; a p-type thermoelectric conversion element and an n-type thermoelectric conversion element; a solder joint layer; and Ni-containing layers. The solder joint layer is disposed between the heat dissipation-side electrode and each of the p-type and n-type thermoelectric conversion elements, and includes Ni intermetallic compound containing Au and Sn, AuSn intermetallic compound, and a eutectic composition including AuSn intermetallic compound and AuSn intermetallic compound. The Ni-containing layer is disposed between the solder joint layer and the heat dissipation-side electrode and between the solder joint layer and each of the p-type and n-type thermoelectric conversion elements. The solder joint layer has a eutectic ratio of 15.1% or less.

Peltier module for laser diode

An apparatus for fabricating a powdery thermoelectric material comprising a rotating disk having durability to thermal shock, having no reactivity with raw material and capable of high speed rotation, the apparatus comprising a container for mixing raw material of predetermined composition and heating and melting the same, a funnel or a pouring port for pouring the molten metal of the heat-melted raw material and a rotating disk made of silicon nitride or a material containing silicon nitride for scattering the poured molten metal.

Apparatus for fabricating powdery thermoelectric material and method of fabricating powdery thermoelectric material using the same

A method of fabricating a thermoelectric element of enhanced thermoelectric performance is provided by improving the preparation of thermoelectric material and employing hot plastic working in combination. The method comprises the step (a) of mixing and heat-melting a raw material of a predetermined composition; the step (b) of turning the heat-melted material into microglobules by either of scattering and spraying, and then quenching the microglobules, thereby providing a globular powdery thermoelectric material; and the step (c) of plastically deforming the thermoelectric material in a hot condition, thereby to bring crystal grains of the thermoelectric material into a crystal orientation affording an excellent figure of merit.

Thermoelectric element, method of fabricating the same, and thermoelectric module employing the same

Thermoelectric semiconductor material and method of manufacturing the same

Powder of a semiconductor material and solvent are packed into a rubber tube and both ends of the rubber tube are fixed by fixing rings in a condition with sealing in the vertical direction effected by an upper cover and a lower cover. After this, the rubber tube is immersed in an oil bath and pressure is applied uniformly from the side faces to the semiconductor material within the rubber tube, using hydraulic pressure. An extrusion molding of rectangular shape and of smaller cross sectional area than before molding is formed by extrusion from an extrusion port of rectangular solid shape of a die (extrusion mold) in which pressure is applied in an extrusion direction D by a punch to a rectangular solid sintered body of thermoelectric semiconductor material.

Thermoelectric semiconductor material, thermoelectric element, method of manufacturing these and method of manufacturing thermoelectric module and device for manufacturing thermoelectric semiconductor material

Thermoelectric semiconductor material and method of manufacturing same

Growing community of inventors

Hiratsuka, Japan

Akio Konishi