Toyota Jidosha Kabushiki Kaisha

Yazaki Corporation

Denso Corporation

Aisin Aw Co., Ltd.

Nippon Soken, Inc.

Kabushiki Kaisha Toyota Jidoshokki

Akio Kitami

Tadafumi Yoshida

Hideomi Adachi

Hidehiko Kuboshima

Yasuhiro Tanaka

Satoshi Iguchi

Tatsuyuki Uechi

Masataka Deguchi

Naoki Hakamada

Yasushi Yamada

Kenshi Yamanaka

Kengo Machida

Kazunori Uchiyama

Hiroshi Osada

Takayoshi Hirakawa

Hiromichi Kuno

Takeshi Okada

Kunihiro Iwata

Tomo Sasaki

Nobuki Shinohara

Takashi Atsumi

Takashi Hamatani

Norifumi Furuta

Gentaro Yamanaka

Keitaro Ishikawa

A connection terminal includes a terminal main body, a contact member, a locking structure, and a position adjustment structure. The terminal main body is electrically conductive and includes a female connector. The contact member is disposed, in a first region of an internal space of the female connector, to face an inner circumferential surface of the female connector. The locking structure holds the contact member at a position thereof after completion of housing of the contact member in the internal space. The position adjustment structure adjusts the position of the contact member in the internal space. The position adjustment structure includes a locked holder disposed in the contact member and a locking holder disposed in the terminal main body.

Connection terminal

A semiconductor device includes a semiconductor module. The semiconductor module includes a package made of resin. The package contains a semiconductor element and a heat sink. The heat sink has a thermal conductive surface exposed on a part of one surface of the package. The semiconductor device includes an insulating plate, which is a part of a cooler, facing the thermal conductive surface of the heat sink and a resin surface around the thermal conductive surface, and pressed against the semiconductor module. At least a part of the thermal conductive surface comprises a recessed region recessed with respect to the resin surface. A solid heat transfer layer is interposed between the recessed region of the thermal conductive surface and the insulating plate, and is not interposed between the resin surface and the insulating plate.

Semiconductor device and manufacturing method thereof

A manufacturing method of a reactor includes: assembling an assembly constituted by a coil and a bobbin by inserting the bobbin, which includes a tube portion and a flange portion, through the coil so that a tip of the tube portion protrudes from the coil; forming a cavity by installing the assembly in a first die so that a portion of a coil lateral face comes into contact with a cavity face of the first die, and closing a second die so that the second die is opposed to the first die; and extending first press rods from a cavity face of the second die toward the bobbin in the cavity, and injecting a resin into the cavity while pressing both ends of the bobbin in an axial direction of the coil from an opposite side to the portion of the coil lateral face.

Manufacturing method of a reactor

Two opening through which a refrigerant runs are connected by a first connecting pipe and a second connecting pipe. One end of the first connecting pipe is connected to a first opening by a planar seal. Another end of the first connecting pipe is connected to one end of a second connecting pipe by a shaft seal. Another end of the second connecting pipe is connected to a second opening by a planar seal. An axial direction of a shaft seal is perpendicular to a plane that includes the first opening.

Connection structure and inverter

A wiring harness can include a plurality of high-voltage electrical conduction paths, a motor connector provided at one ends of the high-voltage electrical conduction paths, and an inverter connector provided at the other ends of the high-voltage electrical conduction paths. An extra-length portion can be provided at an intermediate portion of the conductor. The extra-length portion can be configured to absorb displacement caused by a force acting upon the wiring harness and forcing it to be extended. The extra-length portion can take a folded shape obtained by folding the conductor.

Electrical conduction path structure and wiring harness incorporating the same

An automobile includes: a controller for controlling a motor; a main battery for supplying electric power to the motor via the controller; a normally open relay interposed in an electric power supply path extending from the main battery to the controller; and a sub-battery for supplying the electric power to the relay. The controller is mounted with a terminal cover that covers an output terminal for connection with a power supply cable to the motor. The sub-battery is disposed adjacent to the controller so as to interfere with the removal of the terminal cover by a worker.

Automobile having electric vehicle drive motor

A power module includes a pair of power devices that are stacked with a plate-shaped output electrode arranged therebetween, and an N-electrode and a P-electrode that are stacked with the pair of power devices arranged therebetween. The output electrode is anisotropic such that the thermal conductivity in a direction orthogonal to the stacking direction is greater than the thermal conductivity in the stacking direction. Also, the output electrode extends in the orthogonal direction from a stacked area where the pair of power devices are stacked. The N-electrode and the P-electrode extend in the orthogonal direction while maintaining an opposing positional relationship.

Power module

Growing community of inventors

Toyota, Japan

Akio Kitami