Kabushiki Kaisha Toshiba

J-devices Corporation

Ricoh Company, Ltd.

Akio Katsumata

Shigenori Sawachi

Hiroshi Inoue

Osamu Yamagata

Mitsuo Hasebe

Takuya Takahashi

Satoru Itakura

Kotaro Yonenaga

Kenji Kojima

Toshio Watanabe

Shinetsu Fujieda

Takayuki Maruta

Setsuo Soga

Itaru Matsuda

Hiroshi Hosaka

Tadao Koike

Yoshihiro Mitekura

Kenichirou Asada

Yoshihiko Ikemoto

Yasumori Nagahara

Tomoshige Chikai

Yoshiaki Kanmoto

Seiichi Hirata

Kiyoto Nagasawa

Takanobu Fujioka

Hiroshi Shimozawa

Sakae Ota

Masaaki Kogure

Toshiaki Kameyama

Kimihiro Ikebe

Yukari Imaizumi

Masafumi Toyofuku

Junichiro Abe

Masahiko Hori

Fumihiko Taniguchi

Goshi Kawazu

Isao Kudo

Yoichi Hiruta

Akihiro Umeki

Yasushi Shiraishi

The present invention is to provide a semiconductor device in which the generation of the eddy current in a metal flat plate is reduced, and the Q value of the RF circuit of the semiconductor device is improved even using the metal flat plate as a support.

Semiconductor device

A method of manufacturing a semiconductor device having an insulating substrate, a semiconductor element which is mounted on one main surface of the insulating substrate via adhesive, with an element circuit surface of the semiconductor element facing upwards, a first insulating material layer (A) which seals the element circuit surface of the semiconductor element and the insulating substrate peripheral thereto, a first metal thin film wire layer provided on the first insulating material layer (A) and a portion of which is exposed to an external surface, a first insulating material layer (B) provided on the first metal thin film wire layer, a second insulating material layer provided on a main surface of the insulating substrate where the semiconductor element is not mounted, a second metal thin film wire layer provided inside the second insulating material layer.

Semiconductor device, semiconductor stacked module structure, stacked module structure and method of manufacturing same

A semiconductor device, having an insulating substrate; a semiconductor element which is mounted on one main surface of the insulating substrate via adhesive, with an element circuit surface of the semiconductor element facing upwards; a first insulating material layer which seals the element circuit surface of the semiconductor element and the insulating substrate peripheral thereto; a first metal thin film wire layer which is provided on the first insulating material layer (A) and a portion of which is exposed to an external surface; a first insulating material layer (B) which is provided on the first metal thin film wire layer; a second insulating material layer which is provided on a main surface of the insulating substrate where the semiconductor element is not mounted; and a second metal thin film wire layer which is provided inside the second insulating material layer.

A semiconductor device which includes a substrate, a semiconductor element arranged on the substrate, a heat dissipation component arranged on the semiconductor element, and a mold component covering an upper part of the substrate, the semiconductor element and the heat dissipation component, wherein an area of a surface on the semiconductor element of the heat dissipation component is larger than an area of a surface on which the heat dissipation component of the semiconductor element is arranged.

A semiconductor storage deviceincludes a controller packagehaving a BGA terminal on a bottom surface thereof; and one or a plurality of memory packageseach including a plurality of semiconductor storage elements and mounted on the controller package. The controller package includes a bottom substrate having the BGA terminal on a bottom surface thereof; a power supply IC, mounted on the bottom substrate, for supplying a plurality of power supplies; and a controller mounted on the bottom substrate and operable by the plurality of power supplies supplied from the power supply IC. The controller provides an interface with an external system via the BGA terminal and controls a read operation from the semiconductor storage elements and a write operation to the semiconductor storage elements.

Semiconductor storage device and method for producing the same

A semiconductor device containing: a semiconductor element; a support substrate; an insulating material layer for sealing the semiconductor element and a periphery thereof; a metal thin film wiring layer provided in the insulating material layer, with a part thereof being exposed on an external surface; and metal vias provided in the insulating material layer and electrically connected to the metal thin film wiring layer. The semiconductor element is provided in a plurality of units and the respective semiconductor elements are stacked via an insulating material such that a circuit surface of each semiconductor element faces the metal thin film wiring layer, and electrode pads of each semiconductor element are exposed without being hidden by the semiconductor element stacked thereabove.

Semiconductor device and manufacturing method thereof

There is provided a semiconductor device having a chip-size package structure comprising a semiconductor pellet including semiconductor elements, wires, a plurality of electrode pads, and final protection film, an insulation layer serving also as a sealing layer formed to cover the entire surface of the semiconductor pellet having a via hole portion above each of the electrode pads in association therewith, a plurality of wiring patterns formed with a via hole wiring portion electrically connected to the electrode pad at the bottom of each of the via hole portions of the insulation layer and formed with a land portion connected thereto and located in a position offset from the via hole portion, and an external electrode in the form of a ball provided on the land portion of each of the wiring patterns. This makes it possible to provide a semiconductor device in a chip-size package structure in which the length of wires led out from electrode pads is shortened as much as possible to lead out wires from electrode pads near the center of the pellet easily and to allow a pellet having an increased number of external electrodes to be accommodated.

Semiconductor device manufacturing method

Semiconductor device and method for manufacturing the same

A semiconductor device for reducing the mounting area of semiconductor chips on the mounting substrate includes a first base substrate made of an insulating material, a semiconductor chip mounted on the first base substrate, a plurality of internal wiring elements disposed on the first base substrate, and a plurality of bonding elements respectively connecting the semiconductor chip and the internal wiring elements. A second base substrate made of an insulating material is disposed on the first base substrate, and a resin seals the semiconductor chip and the bonding elements. A plurality of lower electrodes are formed on a lower surface of the first base substrate, a plurality upper electrodes are formed on an upper surface of the second base substrates, and a plurality of through holes respectively connecting one of the lower electrodes to one of the upper electrodes are formed on an external side surface of the first and second base substrate.

Stacked semiconductor device having peripheral through holes

A memory IC having an SOJ type package is mounted on a metal wiring layer on the surface of the outer layer of a multilevel interconnection board. Protecting portions are formed on the package of the memory IC. The protecting portions contact the surface of the metal wiring layer when the memory IC is mounted on the multilevel level interconnection board. The shape of the projecting portions can be of various types, e.g., circular cylinders or prisms. Heat generated within the memory IC is transmitted to the metal wiring layer through the projecting portions. A first insulating layer has first and second surfaces. Wiring layers are formed on each of the first and second surfaces of the first insulating layer, and first and second semiconductor chips are connected to those wiring layers. First and second resin layers cover the whole surface of the outermost wiring layers and the first and second semiconductor chips.

Semiconductor module having multiple insulation and wiring layers

TCP (tape carrier package) type semiconductor memory elements, each having a thickness less than that of the conventional package, are provided on the front and rear surface of a print circuit board in a stacking manner. Close to the semiconductor memory elements stacked, provided are TCP type semiconductor memory elements stacked one on another. Each TCP type semiconductor memory element has outer leads on its one side surface. The outer leads having the same function are arranged in a straight line on the front or rear surface of the print substrate. The outer leads arranged in the straight line are connected with each other via a straight wiring pattern.

Memory card including stacked semiconductor memory elements located on a

A plastic molded semiconductor device having a semiconductor chip mounted on a die pad supported by hanging pins. The semiconductor chip is encapsulated by mold plastic where the semiconductor chip has a lead portion protruding to a side, and in which practically the entire periphery of the semiconductor chip is covered by aluminum or some other moistureproof material that stops the entry of moisture.

Plastic molded semiconductor device having waterproof cap

An image forming apparatus includes a fixing speed setting unit for selectively setting the fixing speed in accordance with a desired mode of operation, a fixing unit for fixing a reproduced image of an original formed on a image forming medium at a variable fixing speed in accordance with the fixing speed setting unit, and a scanning unit provided with opto-electrical elements arranged in one line extended laterally to a predetermined scanning direction for optically receving an image of the original through the opto-electrical elements. The opto-electrical elements are carrying out a scanning operation in the predetermined scanning direction with varied scanning speed by changing a sweep spacing of an image data with averaging every N line of the image data in accordance with the operation mode with using every N-1 lines of the image data to reproduce the image of the original on the image forming medium.

Image reproducing apparatus

An image forming apparatus of the type producing a single composite color image on a paper which is transported by a belt by transferring image components of different colors to the paper in register with each other. The apparatus reduces with a simple construction the positional deviation of the image components which occurs in an intended direction of paper transport. Recording devices individually adapted for black, cyan, magenta and yellow are arranged side by side. Pattern images for measurement each being associated with a respective one of those colors are formed on the belt. A timing at which each of the pattern images arrives is sensed and counted. The count is compared with a reference value to calculate an amount of deviation. Write start timing signals each being associated with a particular color are generated which are individually variable on the basis of the deviation calculated. The pattern images of the respective colors are each generated by using a write start timing associated with the color as a reference, and the pattern to be provided by any of the recording devices is outputted on a downstream side of the belt relative to the pattern to be provided by another recording device which is located downstream of the first-mentioned recording device.

Color image forming apparatus

A paper feeder is disclosed which has a plurality of trays arranged one above another and a paper feed unit movable up and down to one of the trays selected. To control paper transport speed, a paper sensor is actuated prior to a level sensor during movement of the paper feed unit to a paper feed position, and a paper feed unit drive motor begins to be decelerated in response to an 'on' signal of the paper sensor. The amount of papers remaining in any of the trays is detected by counting drive pulses applied to a pulse motor, which is adapted to drive the paper feed unit. After a power source has been turned on, the amounts of remaining papers in all the trays are detected and displayed prior to a copying operation.

Paper feeder usable with a copier and others

Growing community of inventors

Yokohama, Japan

Akio Katsumata