Murata Manufacturing Co., Ltd.

Akio Katsube

Hideo Nakagoshi

Koichi Kanryo

Hiroki Kitayama

Hidemasa Kawai

Yoshitaka Matsukawa

Akira Tanaka

Tadashi Nomura

Shinji Otani

Issei Yamamoto

Yoichi Takagi

Hideki Shinkai

Yuta Morimoto

Koji Murata

Yoshitaka Echikawa

Minoru Komiyama

Takehito Ishihara

Shunsuke Kitamura

Kouji Ishikawa

Takeshi Ono

An electronic component module includes a substrate, a connector, an electronic component, a conductor wall, an insulating resin, and a conductive shield film. The connector and the electronic component are mounted on a first main surface of the substrate. The conductor wall has a cylindrical shape, is mounted on the first main surface of the substrate, and includes an interior space in which the connector is disposed. The insulating resin is provided on the first main surface. The conductive shield film is provided on a surface of the insulating resin. The insulating resin covers the electronic component and is disposed outside the conductor wall except the interior space of the conductor wall.

Electronic component module

A module includes: a wiring board as a ceramic board having a first main surface; a first component and a second component that are mounted on the first main surface; at least one conductive member disposed on the first main surface between the first component and the second component; a sealing resin that seals the first component, the second component, and the conductive member; and a shield film that covers an upper surface and a side surface of the sealing resin and a side surface of the wiring board. The shield film is electrically connected to a ground conductor. The conductive member is formed by firing simultaneously with the wiring board, and electrically connected to the ground conductor and electrically connected to the shield film.

Module and method of manufacturing the same

An electronic component module () includes a module board () having electronic components () mounted on at least one of a first surface (front surface) () and a second surface (back surface) (), mold portions (and), and a shield (). The mold portions (and) cover the mounted electronic components (). The shield () covers at least a part of the mold portions (and) and the side surfaces of the module board (). Protrusions () protruding from the side surfaces are formed on the module board (). The shield () is separated by the protrusions ().

Electronic component module and method for manufacturing electronic component module

An electronic component package () includes a resin layer (), an electronic component (), a grounding member (), and a conductor film (). The grounding member () includes a multilayer body () and an outer conductor () disposed at an end portion of the multilayer body () in a lamination direction. The multilayer body () includes at least one resin film () and at least one pattern conductor () laminated one on another, and at least one via conductor () extending in the lamination direction and connected to the outer conductor (). In the multilayer body (), at least one of the pattern conductor () has at least part of a circumference connected to a conductor film () and electrically connected to the via conductor (). Part of an external terminal and part of the outer conductor () are exposed from an identical surface of the resin layer ().

Electronic component package and method for manufacturing the same

A module includes a substrate, a plurality of components on an upper surface of the substrate, a component on a lower surface of the substrate, solder balls on the lower surface, sealing resin layers stacked on the upper surface and the lower surface of the substrate, and a shield film covering a side surface and an upper surface of the module. Part of each solder ball is exposed from a surface of the sealing resin layer, and the exposed parts are shaped to protrude from the sealing resin layer. The module can be connected to a mother substrate by connecting the protruding parts of the solder balls. There are gaps between the solder balls and the sealing resin layer, and the occurrence of cracks in the solder balls can be suppressed by reducing stress arising from a difference in thermal expansion coefficient between the solder and the resin.

Module and method of manufacturing module

An electronic component that includes an electronic element; a base member having an upper surface on which the electronic element is mounted; and a lid member bonded to the base member via a bonding member such that the electronic element is hermetically sealed therebetween. The bonding member is made of an insulating material containing a first metal. The lid member has an outermost layer formed on at least a surface of the lid member facing the base member. The outermost layer of the lid member has a solid solution layer of the first metal and a second metal at at least a portion of the outermost layer.

Electronic component and method of manufacturing the same

A high frequency moduleincludes a wiring board, multiple componentstomounted on an upper surfaceof the wiring board, a shield componentmounted between the componentand the component, a sealing resin layerthat covers the componentstoand the shield component, and a shield filmthat covers the surface of the sealing resin layer. A recessis formed in an upper surfaceof the sealing resin layerso as to expose the shield component. The recessis formed within a region surrounded by edges of the sealing resin layerso as not to reach the side surfaces of the sealing resin layer. The shield filmfurther covers wall surfacesof the recessand part of the shield componentexposed through the recess

High frequency module

A solid electrolytic capacitor that includes a capacitor element; an exterior resin; an anode lead terminal; and a cathode lead terminal. The anode lead terminal has a Cu base material, and an Au-plating layer formed thereon, and includes an Au region where the Au-plating layer as a surface layer is formed, and a Cu region where the Au-plating layer is not formed. The cathode lead terminal includes a base material, and an Au-plating layer as a surface layer of the cathode lead terminal, which is formed on the base material, and an anode section of the capacitor element is connected to the Cu region of the anode lead terminal.

Solid electrolytic capacitor, electronic component module, method for producing solid electrolytic capacitor and method for producing electronic component module

A method of manufacturing an electronic component module includes sealing a surface of an aggregate substrate on which a plurality of electronic components are mounted with a sealing resin and cutting boundary portions between electronic component modules from an outer surface of the sealing resin to a position at least partially through the aggregate substrate to form first grooves. A shield layer is formed by coating the outer surface of the sealing resin with a conductive resin and filling the first grooves with the conductive resin, and recesses are formed at positions on the shield layer where the first grooves are formed. The boundary portions between electronic component modules are cut along the corresponding recesses so that second grooves each having a width smaller than the width of a corresponding one of the recesses are formed, and the aggregate substrate is singulated into the individual electronic component modules.

Method of manufacturing electronic component module and electronic component module

In a solid electrolytic capacitor, resistance welding is carried out to bond a valve metal substrate and a spacer together while controlling a welding current so that only a bonding material provided in spacers and having a relatively low melting point is melted. At least a portion of the bonding material provided in the spacer penetrates an etching part of the valve metal substrate, and thickness Ta of a core part located at a positive electrode part in the valve metal substrate and thickness Tc of the core part located at a negative electrode part satisfy the requirement of |Tc&#x2212;Ta|/Tc&#xd7;100&#x2266;10[%].

Solid electrolyte capacitor and method for manufacturing the same

An elastic material, in which at least the surface thereof is adhesive and conductive, is provided on a plate, and while a substrate constituting a component of an electronic part is held on the surface of the elastic material by the adhesiveness of the elastic material, an element such as a semiconductor chip is mounted at a fixed location on the substrate.

Holding jig for electronic parts

A method for manufacturing an electronic component module is performed such that a shield layer can be formed as a thin film and an electronic component can be effectively shielded. A collective substrate including a plurality of electronic component modules including a plurality of electronic components is batch-sealed with a resin. A cut section is formed from a top surface of the sealed resin to a position that reaches a grounding electrode arranged in the substrate at a boundary section of the electronic component module so as to expose the grounding electrode. A conductive paste is applied on side surfaces and the top surface. Then, a conductive thin film is formed by spin coating, and the electronic component module is cut.

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Kyoto, Japan

Akio Katsube