Renesas Technology Corp.

Other

Hitachi Tohbu Semiconductor, Ltd.

Renesas Eastern Japan Semiconductor, Inc.

Akio Ishizu

Tsutomu Ida

Yoshihiko Kobayashi

Susumu Takada

Norinaga Arai

Kazutoshi Takashima

Shigeru Haga

Iwamichi Koujiro

Yuji Kakegawa

Shiro Oba

Yoshinori Shiokawa

Kenji Hanada

Masakazu Hashizume

Isao Hagiwara

In a method of manufacturing a camera module having a CMOS image sensor, a semiconductor chip to serve as a light sensor is mounted on a optical-component-mounting face of a wiring substrate mother board and, after bonding wires are connected to the semiconductor chip, a lens barrel is joined to the wiring substrate mother board so as to cover the semiconductor chip. A position adjustment pin and a through hole are provided on the lens barrel and the wiring substrate mother board respectively outside a junction face between the lens barrel and the wiring substrate mother board to be used for adjusting the position of the lens barrel with respect to the wiring substrate mother board by inserting the position adjustment pin into the through hole.

Manufacturing method of solid-state image sensing device

A method of manufacturing a semiconductor device able to reduce the number of manufacturing steps and attain the rationalization of a manufacturing line is disclosed. The semiconductor device is a high-frequency module assembled by mounting chip parts () and semiconductor pellets () onto each of wiring substrates () formed on a matrix substrate () after inspection. A defect mark () is affixed to a wiring substrate () as a block judged to be defective in the inspection of the matrix substrate (), then in a series of subsequent assembling steps the defect mark (e) is recognized and the assembling work for the wiring substrate () with the defect mark () thereon is omitted to attain the rationalization of a manufacturing line.

Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device

Semiconductor device fabrication method and semiconductor device fabrication apparatus

In a method of manufacturing a high frequency module to be assembled by providing, on a wiring board, a chip part and a semiconductor pellet to be bare chip mounted and then mounting the chip part and the semiconductor pellet through soldering, the wiring board is separated from a heat block with the semiconductor pellet pressurized against the wiring board in a main heating portion heating and melting a reflow solder, thereby cooling a soldering portion. Consequently, the generation of a void in the soldering portion can be prevented and the connecting reliability of the soldering portion can be enhanced. In addition, a degree of mounting horizontality of the semiconductor pellet on the wiring board can be enhanced.

Method of manufacturing semiconductor integrated circuit device

Growing community of inventors

Maruko, Japan

Akio Ishizu