Other

Shin-Etsu Handotai Co., Ltd.

Mimasu Semiconductor Industry Co., Ltd.

Ohtomo Chemical Ind., Corp.

Hitachi Zosen Metal Works Co., Ltd.

Akio Ashida

Etsuo Kiuchi

Shingo Kaburagi

Kohei Toyama

Kazuo Hayakawa

Hiroshi Oishi

Keiichiro Asakawa

Junichi Matsuzaki

Kuniaki Noami

Takara Ito

Slurry useful for wire-saw slicing has viscosity adjusted to 400-700 mPa&middot;second at a shear speed of 2/second and of 50-300 mPa&middot;second at a shear speed of 380/second. The viscosity of slurry is measured using a cone and plate type viscometer which can measure viscosity at different shear speeds. Since the slurry sufficiently flows into inner parts of grooves formed in an ingot and consumed for wire-saw slicing due to the viscosity controlled in response to the shear speed, the ingot can be efficiently sliced to wafers or discs.

Slurry useful for wire-saw slicing and evaluation of slurry

An aqueous cutting fluid which can reduce the impact on working environment and the global environment, and can achieve both preventing precipitates from becoming a hard cake and keeping high dispersibility for abrasive grains is provided. Such an aqueous cutting fluid is obtained by a method comprising dispersing abrasive grains (G) in an aqueous composition comprising a dispersion medium (M) containing a hydrophilic alcohol compound such as ethylene glycol, a lipophilic alcohol compound such as propylene glycol and water, and silica colloid particles dispersed stably in the medium. The dispersion medium (M) is odorless and not flammable. The abrasive grains (G) may settle out after a time, but they do not closely contact with one another, and therefore the resulting precipitates do not become a hard cake, which allows the re-dispersion and reuse of precipitated grains. The instant aqueous cutting fluid is inherently low viscous, and the reduction of viscosity owing to the contamination of water and the increase of viscosity owing to contamination of shavings are both moderate. As a result, the cutting fluid has a long life. And articles which have been cut using the cutting fluid can be washed with water. Further, as the dispersion medium (M) is a biodegradable low molecular weight organic compound, a waste liquid from a process using the cutting fluid can be disposed with an activated sludge.

Aqueous compositions, aqueous cutting fluid using the same, method for preparation thereof, and cutting method using the cutting fluid

A system for reusing water soluble slurry waste fluid wherein separated available abrasive grains and extracted water soluble coolant are reused. This system is capable of reducing a disposal cost due to a reduction of a load to a waste water disposal plant by effectively reusing water soluble slurry waste fluid, and making a contribution to a reduction of a total slicing cost by reusing abrasive grains and water soluble coolant.

Recovery of coolant and abrasive grains used in slicing semiconductor

A water-soluble cutting fluid is produced by dissolving a polymer fatty acid triglyceride imidazole, 2-methyl-1-stearate, and boric acid imidazole in the dispersion of inorganic bentonite in water thereby preparing a main component and adding oleic acid (agent for enhancing the lubricity), Na salt of ethylenediamine tetraacetic acid (metallic ion adsorbent), benzotriazole (rust-preventing auxiliary agent), and a silicone type defoaming agent to the main component.

Cutting fluid, method for production thereof, and method for cutting

Growing community of inventors

Tokyo, Japan

Akio Ashida