Dic Corporation

Osaka City University

Akinori Morino

Koujirou Tanaka

Akikazu Matsumoto

Eriko Sato

Koji Hayashi

Naoki Kato

Shota Tanii

Sumio Shimooka

Tsunenori Hashiguchi

Atsuko Tsujikawa

An object of the present invention relates to a thermosetting adhesive sheet that, without the use of a metal reinforcement sheet, which is regarded as a major factor responsible for an increase in thickness of electronic devices and other devices, reinforces a flexible printed circuit to such a level that detachment of mounted components, for example, is prevented, prevents warping, and has good electrical conductivity. The present invention relates to a thermosetting adhesive sheet configured to be used to reinforce a flexible printed circuit. The thermosetting adhesive sheet includes a woven fabric, a nonwoven fabric, or a metal base of 50 &#x3bc;m or less thickness and a thermosetting adhesive layer adjacent to at least one surface of the woven fabric, the nonwoven fabric, or the metal base of 50 &#x3bc;m or less thickness.

Thermosetting adhesive sheet, reinforcement-part-equipped flexible printed circuit, method for manufacturing reinforcement-part-equipped flexible printed circuit, and electronic device

An easily dismantlable adhesive composition containing: an acrylic block polymer having a poly(meth)acrylate chain (A) formed of a carboxyl precursor group-containing (meth)acrylate monomer (a) and a poly(meth)acrylate chain (B) that contains, as monomer components, a (meth)acrylate (b) having an alkyl group having 1 to 14 carbon atoms and a polar group-containing monomer (c); and either an acid catalyst or an acid generator, makes it possible to achieve favorable adhesiveness and dismantlability and suppress stick-slip at the time of dismantlement.

Easily dismantlable adhesive composition and easily dismantlable adhesive tape

Suitable adhesive properties and dismantling properties can be obtained, and an interface between an adherent/an adhesive layer or an adhesive layer/a substrate can be suitably dismantlable by the easily dismantlable adhesive composition including an acrylate polymer including a (meth)acrylate monomer having a carboxyl precursor group, 2-ethyl hexyl acrylate, and a monomer having a polar group as a monomer, and an acid catalyst or an acid generator.

Easily dismantlable adhesive agent composition and easily dismantlable adhesive tape

An easily dismantlable adhesive composition is provided containing: an acrylic polymer; and either an acid catalyst or an acid generator, the acrylic polymer containing: as monomer components, a carboxyl-precursor-group-containing-(meth)acrylate monomer; an n-butyl acrylate; and a polar-group-containing monomer, the content of the polar-group-containing monomer being 5 to 30% by mass, relative to the total mass of the monomer components composing the acrylic polymer, makes it possible to realize favorable adhesion- and dismantling properties and favorable delamination at an interface between an adherend and a substrate or an interface between an adhesive agent layer and an adherend when dismantled.

An aqueous dispersion-type acrylic pressure-sensitive adhesive composition includes acrylic copolymer emulsion particles dispersed in an aqueous medium. The acrylic copolymer emulsion particles has a ratio (AN)/(AN) of 1 or more, wherein (AN) is an amount of acid groups in the acrylic copolymer emulsion particles, and (AN) is an amount of acid groups on the surfaces of the acrylic copolymer emulsion particles, (AN) and (AN) being calculated from a titration curve of potentiometric titration performed by adding an inorganic base solution to an acidic sample dispersion solution containing the acrylic copolymer emulsion particles dispersed in ion exchange water. A pressure-sensitive adhesive tape which strongly adheres to an adherend and has excellent removability can be formed using the aqueous dispersion-type acrylic pressure-sensitive adhesive composition.

Growing community of inventors

Kita-adachi-gun, Japan

Akinori Morino