Denso Corporation

Akinori Kanda

Tetsuo Yoshioka

Takashige Nagao

Shuntaro Yamada

Kouichi Miyashita

In a manufacturing method of a semiconductor device including a substrate having a front surface and a rear surface, and a film attached to the rear surface, the film is attached on the rear surface, a rear surface side groove is provided by half-cutting the substrate from the rear surface together with the film, a protective member is attached to the film after the rear surface side groove is provided, and a front surface side groove connected to the rear surface side groove is provided by dicing the substrate from the front surface after the protective member is attached.

Growing community of inventors

Kariya, Japan

Akinori Kanda