Mitsubishi Denki Kabushiki Kaisha

Akinobu Tamaki

Shinobu Takahama

Satoshi Hirakawa

Teruki Hyougatani

Hitoshi Yamano

Takeshi Kawakami

Takashi Takahama

Kunito Sakai

Ken Kimura

Masao Irie

There is disclosed a semiconductor device wherein electrode terminals (2), elements (6) and wires (7) are disposed on a base plate (5) of a case (4) filled with only epoxy resin (1). The epoxy resin (1) contains impurities such as halogen and alkaline metallic salts in an amount of not more than 5 ppm and has a linear expansion coefficient of 5.times.10.sup.-6 to 25.times.10.sup.-6 when hardened. The semiconductor device provides for direct sealing of the components, whereby its size and cost are reduced.

Semiconductor device and resin for sealing a semiconductor device

A semiconductor device where electrode terminals (2), elements (6) and wires (7) are disposed on a base plate (5) of a case (4) filled with only epoxy resin (1). The epoxy resin (1) contains impurities such as halogen and alkaline metallic salts in an amount of not more than 5 ppm and has a linear expansion coefficient of 5.times.10.sup.-6 to 25.times.10.sup.-6 when hardened. The semiconductor device provides for direct sealing of the components, its size and cost are therefore reduced.

Semiconductor device, resin for sealing same and method of fabricating

A semiconductor device includes an electronic component in a hollow portion provided between two packing members each comprising a laminated structure. A laminated structure has a metallic layer and an insulating layer. The laminated structure can further have a reinforcing layer. One end surface of the laminated structure is an insulating layer. The insulating layers of these laminated structures oppose each other with peripheral portions thereof hermetically connected, so that the hollow portion containing the electronic component is airtight. A metallic layer is formed of a metal such as aluminum or an alloy thereof, an insulating layer is formed of organic material and the like and a reinforcing layer is formed of a fiber, a thermosetting resin, a thermoplastic resin and the like. The electronic component contained in the hollow portion is positioned to avoid contact with the packing members. The electronic component is electrically connected to the exterior through lead wires interposed between the contact surfaces of the two packing members.

Semiconductor device

A method for insulating a coil of a rotary electric machine resulting in improved insulating properties at critical coil ends. A mica sheet or mica tape is wound around a part of each coil to be inserted into a slot cut in an iron core of the rotary electric machine to thus form a first insulating layer. The coils thus treated are inserted into respective slots and are connected together and to external terminals as required. Each coil end is then covered in its entirety with a thermosetting resin. The thermosetting resin is hardened by heating to form a second insulating layer.

Growing community of inventors

Sanda, Japan

Akinobu Tamaki