Matsushita Electric Industrial Co., Ltd.

Akinobu Katayama

Takaaki Higashida

Yoshio Maruyama

Shinji Kadoriku

Kiyoshi Mayahara

Toshiyuki Fujioka

Hiroshi Yutani

Toshikazu Kozono

Tokiharu Nakagawa

It is an object to provide an optical recording medium (disk) bonding apparatus which eliminates the warpage of a disk during bonding and has high precision in the bonding. There are provided means for bonding two substrates and then irradiating radioactive rays from both sides of the substrates when carrying out radiation curing, and a mechanism for shifting the irradiation starts of both radioactive rays to control an amount of warpage of each substrate after the curing.

Disk bonding apparatus and disk bonding method

A molding apparatus for light-permeable articles which includes a nozzle that is movable up and down. A suction path and a suction device connected to the suction path are provided so as to suck a gas at a contact face of a sprue bush and its vicinity during the up/down movement of the nozzle. Accordingly, foreign substances, invading the mold can be sucked up before the apparatus performs a molding operation. Therefore, foreign substances are prevented from being mixed into the molded product. The molded product is accordingly improved in quality and yield.

Molding apparatus and molding method for light-permeable articles

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Kyoto, Japan

Akinobu Katayama