Kokusai Electric Corporation

Hitachi-kokusai Electric Inc.

Kokusai Electric Co., Ltd.

Kokusia Electric Corporation

Akinari Hayashi

Makoto Hirano

Makoto Tsuri

Haruyuki Miyata

A substrate processing apparatus includes a plurality of placement parts on which a substrate container is placed, a driving part configured to move the plurality of placement parts, a transport mechanism configured to load the substrate container into one of the plurality of placement parts and to unload the substrate container from one of the plurality of placement parts, and a controller configured to control the driving part and the transport mechanism so that by raising or lowering the transport mechanism while keeping a support of the transport mechanism unmoved in an initial position, the substrate container is delivered from one of the plurality of placement parts to the support of the transport mechanism, and the substrate container is delivered from the support of the transport mechanism to one of the plurality of placement parts.

Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium

A transfer machine that charges a substrate contained in a substrate container to a substrate holder; a drive member that operates the transfer machine; and an operation controller that monitors whether a torque value detected from the drive member is kept within a torque limit value of the transfer machine by comparing the torque value with the torque limit value which is set individually for each of an interference area and a non-interference area excluding the interference area relative to conveyance operation in which the transfer machine is moved toward at least one of the substrate container and the substrate holder. The torque limit value in the non-interference area is set larger than the torque limit value in the interference area where a part of the transfer machine interferes with at least one of the substrate container and the substrate holder.

Substrate transfer unit, and substrate processing apparatus

A substrate processing apparatus includes a plurality of placement parts on which a substrate container is placed, a driving part configured to move the plurality of placement parts, a transport mechanism configured to load the substrate container into one of the plurality of placement parts and to unload the substrate container from one of the plurality of placement parts, and a controller configured to control the driving pan and the transport mechanism so that by raising or lowering the transport mechanism while keeping a support of the transport mechanism unmoved in an initial position, the substrate container is delivered from one of the plurality of placement parts to the support of the transport mechanism, and the substrate container is delivered from the support of the transport mechanism to one of the plurality of placement parts.

Substrate processing apparatus, substrate container transport system and operation mechanism

There is provided a technique that includes: a reaction chamber that processes a substrate on a substrate support; a transfer chamber; a gate that opens and closes an opening and is formed in the transfer chamber; a transfer device; a clean unit supplying a clean atmosphere to the transfer chamber; an inert gas supplier supplying an inert gas to the transfer chamber; and a controller controlling the inert gas supplier such that, after the loading of the substrate from a substrate container to the substrate support by the transfer device is completed and the gate is closed, the inert gas supplier supplies the inert gas during a time period until the gate is opened again and does not supply the inert gas in another time period, and control the transfer chamber to be kept at a positive pressure by an air atmosphere.

Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium

A substrate processing apparatus includes a processing vessel configured to process a substrate; a first purging part configured to perform a first purge to supply inert gas at a first flow rate into a substrate container accommodating the substrate; and a second purging part configured to perform a second purge to supply inert gas at a second flow rate into the substrate container, the second flow rate being lower than the first flow rate.

Substrate processing apparatus, purging apparatus, method of manufacturing semiconductor device, and recording medium

Adverse effects when a carrier is open, such as particles adhesion to the substrate or natural oxidation film deposits on the substrate, as well as a rise in oxygen concentration and contamination of the substrate transfer chamber are prevented. Semiconductor manufacturing apparatus includes a carrier in which a cover unit is provided on a substrate loading/unloading opening for loading and unloading a substrate, a carrier open/close chamber continuously arranged to the carrier, a substrate transfer chamber continuously arranged to the carrier open/close chamber, a substrate processing chamber continuously arranged to the substrate transfer chamber, an exhaust means for exhausting the atmosphere in the carrier open/close chamber by suction, and an exhaust quantity adjuster means for adjusting the suction exhaust quantity of the exhaust means.

Semiconductor manufacturing apparatus and semiconductor device manufacturing method

A substrate processing apparatus includes a rotation accommodating shelf and a transfer machine. The rotation accommodating shelf is capable of accommodating a plurality of accommodating containers in which substrates are to be loaded. The transfer machine is for transferring the plurality of accommodating containers to the rotation accommodating shelf. The plurality of accommodating containers are respectively disposed on radial lines, which radiate from a rotation center of the rotation accommodating shelf, such that each accommodating container is respectively inclined in a horizontal plane in a same fixed direction with respect to a radial line.

Growing community of inventors

Toyama, Japan

Akinari Hayashi