Seiren Company, Ltd

Akimitsu Bamba

Kouichi Kugimiya

Hideyuki Yamada

Kazuhisa Tsujimoto

Takuya Arita

Hiroyuki Hayashi

The present invention relates to a polyimide resin surface modifier which modifies the surface of a polyimide resin to permit easy absorption of metal ions, and a surface-modifying method for polyimide resins using the same. The surface modifier contains an alkali component, an organic solvent having hydroxy groups and a boiling point of 120&#xb0; C. or higher, and a water content of 0-10% by weight. The surface-modifying method includes a printing process wherein a predetermined pattern is printed on the surface of a polyimide resin substrate using the polyimide resin surface modifier, an organic solvent-removing process wherein an organic solvent in the polyimide resin surface modifier pattern-printed on the surface of said polyimide resin substrate is removed and a water-treatment process wherein said polyimide resin surface modifier after removing the organic solvent is brought into contact with water.

Surface modifier for polyimide resin and surface-modifying method for polyimide resin

The purpose of the present invention is to provide a method for using a metal ion solution of low concentration to efficiently form a metal film pattern of excellent accuracy and reliable adhesion on a resin substrate. A resin substrate having a metal film pattern formed thereon is produced by a method that includes the following steps (a) to (e): (a) a step for pattern-printing of a latent image agent () onto the surface of a resin substrate () ; (b) a step for bringing the area imprinted with the latent image agent () into contact with a solution containing metal ions, and forming a metal salt (); (c) a step for bringing the metal salt () into contact with an acidic treatment liquid containing a reducing agent, and reducing the metal salt; (d) a step for forming an electroless nickel plating film () on the area imprinted with the latent image agent; and (e) a step for precipitating an electroless copper plating () onto the surface of the nickel plating film ().

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Fukui, Japan

Akimitsu Bamba