Mitsubishi Electric Corporation

Akimichi Hirota

Naofumi Yoneda

Hideharu Yoshioka

Takeshi Oshima

Tetsu Owada

Takashi Maruyama

Yasuo Morimoto

Yukihiro Tahara

Kazuya Yamamoto

Tomohiro Takahashi

Hidenori Ishibashi

Shinsuke Watanabe

Takeshi Yuasa

Jun Nishihara

Kazuhiro Iyomasa

Tomokazu Hamada

Hiroyuki Nonomura

Toru Takahashi

Makoto Kimura

Satoshi Yamaguchi

Yuji Sakai

Tomohiro Mizuno

Shintaro Shinjo

Hikaru Watanabe

Masataka Otsuka

Hiromasa Nakajima

Shigeo Udagawa

Kiyoshi Ishida

Yukinobu Tarui

Mitsuru Kirita

Tetsuya Oba

Hiroyuki Mizutani

Hideki Morishige

Takuma Ishibashi

Kazuyoshi Yamashita

Tsuyoshi Hatate

Isamu Ryokawa

To obtain a downsized dielectric filter suitable for a laminating structure, a dielectric filter is configured with use of a dielectric waveguide formed of a conductor pattern and vias in a laminating direction within a multilayer dielectric substrate, two strip lines formed in a planar direction of the multilayer dielectric substrate, and two strip line-waveguide converters each configured to perform transmission line conversion between the dielectric waveguide and each strip line. In this manner, it is possible to provide a dielectric filter for which an area to be occupied in the planar direction of the multilayer dielectric substrate is suppressed.

Dielectric filter, array antenna device

A hollow-waveguide-to-planar-waveguide transition circuit includes: strip conductors formed on a first main surface of a dielectric substrate; a ground conductor formed on the back side, facing the strip conductors; a slot formed in the ground conductor; and a coupling conductor formed at a position to be electrically coupled with the strip conductors. The coupling conductor has: a main body portion electrically coupled with the strip conductors; and protruding portions protruding from the main body portion. The protruding portions are formed so as to face an end portion of the slot.

Hollow-waveguide-to-planar-waveguide transition circuit comprising a coupling conductor disposed over slots in a ground conductor

A coaxial-waveguide-to-hollow-waveguide transition circuit () includes a hollow waveguide (), a coaxial waveguide () having an end coupled to a wide wall () of the hollow waveguide (), and a strip conductor () located inside the internal path () of the hollow waveguide (). The coaxial waveguide () includes a conducting core wire () extending into the internal path () of the hollow waveguide (). The strip conductor () is located so as to make a short-circuit connection between the conducting core wire () of the coaxial waveguide () and a termination surface () of the hollow waveguide ().

Coaxial-waveguide-to-hollow- waveguide transition circuit

Provided is a structure configured to electrically connect multi-layer dielectric waveguides, each including a dielectric waveguide formed of conductor patterns and vias in a laminating direction of the multi-layer dielectric substrate, in which the vias for forming part of a waveguide wall of each of the dielectric waveguides are arranged in a staggered pattern in the multi-layer dielectric substrate side having choke structures formed so as to electrically connect the waveguides to each other.

First and second dielectric waveguides disposed in respective multi-layer substrates which are connected by a connection structure having choke structures therein

A semiconductor package includes a package main body. The package main body includes: a lead frame that includes first terminals and a die pad; two or more integrated circuit chips that are disposed on the die pad; one or more electrically conductive members that are disposed on the die pad; wires that connect the first terminals and the integrated circuit chips electrically; and a molded member that seals the lead frame, the integrated circuit chips, the electrically conductive member, and the wires. An upper surface, a bottom surface, and side surfaces of the package main body are formed by the molded member. The electrically conductive member is exposed through the upper surface of the package main body, and the die pad is exposed through the bottom surface of the package main body.

Semiconductor package and module

Provided is a power divider/combiner capable of improving reflection characteristics and isolation characteristics. The power divider/combiner is formed by a multilayer board, and a strip conductor is arranged in an inner layer of the multilayer board and a chip resistor is arranged on an outer surface of the multilayer board. The power divider/combiner includes vias, which connect the strip conductor and the chip resistor, and includes stubs mounted between input/output terminals and the vias. With this configuration, it is possible to adjust induction mainly during an odd mode of an even/odd mode operation and to consequently improve reflection characteristics of the input/output terminals and isolation characteristics between the input/output terminals.

Power divider/combiner

A hollow-waveguide-to-planar-waveguide transition circuit includes: a dielectric substrate; strip conductors formed on a first main surface of the dielectric substrate; a ground conductor formed on a second main surface of the dielectric substrate, facing the strip conductors in the thickness direction; a slot formed in the ground conductor; a coupling conductor formed at a position to be electrically coupled with the strip conductors on the first main surface; and branch conductor lines formed on the first main surface. Each of the branch conductor lines includes a base portion branching from the coupling conductor and a tip portion that is electrically open.

Hollow-waveguide-to-planar-waveguide transition including a coupling conductor having one or more conductors branching therefrom

A microwave module includes an RF device and a multilayer resin substrate. The device includes a metal cover covering at least an internal circuit. The substrate includes a first end face on a side of the device, a second end face on a side opposite to the first end face, a signal through-holes surrounding the circuit and connected to the circuit, ground through-holes surrounding the signal through-holes and connected to the cover, a first surface ground provided on the first end face and connected to the cover, an inner layer surface ground connected to ground through-holes, and an RF transmission line surrounded by the ground through-holes, the first surface ground, and the inner layer surface ground, and connected to the signal through-hole.

Microwave module

A waveguide circuit () includes a first waveguide tube (), a second waveguide tube (), and a third waveguide tube (). The first waveguide tube (), the second waveguide tube (), and the third waveguide tube () have cross-sectional shapes to allow propagation of TE modes. The tube axis of the second waveguide tube () is parallel to the tube axis of the first waveguide tube (). One of the narrow sidewalls of the second waveguide tube () faces a narrow sidewall () of the first waveguide tube (). The third waveguide tube () includes a coupler that connects a hollow guide of the third waveguide tube () to a hollow guide of the first waveguide tube () and a hollow guide of the second waveguide tube ().

Waveguide circuit

An object of the present invention is to vary the directivity of an antenna () while reducing the signal loss by switching circuits (-) in a splitter circuit. The switching circuits (-) in the splitter circuit connect or disconnect n (n is an integer of 2 or more) second lines () connected in parallel with a first line () to/from output terminals () connected to n antenna elements () having different directivities of signals. If m (m is an integer ranging from 1 to n&#x2212;1) switching circuits () arbitrarily selected from the n switching circuits (-) are switched to on-states, the characteristic impedance of each of the n second lines () is set to a product between the characteristic impedance of the first line () and the number m of switching circuits (and) switched to on-states.

Splitter circuit and antenna

A feeder circuit includes: a first linehaving first and second ends; a second linehaving first and second ends; a third linehaving first and second ends; a first combinerconfigured to combine signals output from the second ends of the first and second linesand; a first coupling portionconfigured to electrically couple portions of the first and third lines to each other; and a second coupling portionconfigured to electrically couple portions of the second and third lines to each other in a manner that allows a signal reaching the first combiner from the first end of the third line through the first coupling portion and a signal reaching the first combiner from the first end of the third line through the second coupling portion, to be cancelled out.

Feeder circuit

A recess in a metal housing accommodating a high frequency package includes a first space and a second space and has a winners podium shape in cross-sectional view. A thermally conductive material is sandwiched between the metal housing having heat dissipating fins and the high frequency package.

Electromagnetic shield structure of high frequency circuit and high frequency module

The waveguide device, in which first/second openings are formed at end parts of a waveguide path, comprises a waveguide path obtained by uniting first/second waveguides. The first waveguide is provided with a first recessed part which has an opening with a same shape as the first opening and has a bottom part formed in a first direction as seen from the opening. The second waveguide is provided with a second recessed part which has an opening with a same shape as the second opening and has a bottom part formed in a second direction as seen from the opening. The first/second waveguides are united in a manner such that, positions of the bottom parts of the first/second recessed parts are different from each other in a direction differing from the first/second directions, and the first/second recessed parts connect with each other at the respective bottom parts.

Waveguide device

An antenna device includes: a cavity partcomposed of a metal conductor having an opening closed in a bottom; a first excitation circuitsuperposed and disposed on the upper surface of the cavity part, and including inside thereof a first power feeding probeand a first transmission linethat feeds electric power to the first power feeding probe, and radiating a radio wave of a first polarized wave; and a second cavity partand a third cavity partsuperposed and disposed on the upper surface of the first excitation circuit, and composed of a metal conductor having open holes, and further includes, above the first excitation circuit, a matching elementcomposed of a conductor.

Antenna device and array antenna device

Openings are formed by removing part of a ground conductor, and a differential signal line including signal line conductors is configured with some of the openings. In addition, a metal block is mounted thereon to cover the opening to thus configure a waveguide using the metal block and ground conductor as wall surfaces. A planar circuit to waveguide transition according to the above can achieve traveling wave conversions from a waveguide mode to a slot mode, and from the slot mode to a differential mode without utilizing resonance, which makes it possible to align a dominant direction of an electric field by the three ones; thus, a wider bandwidth can be expected. Thus, the wider bandwidth can be achieved with a simple layer structure.

Growing community of inventors

Tokyo, Japan

Akimichi Hirota