Hitachi Displays, Ltd.

Akiko Yasukawa

Masato Ito

Shoichi Uchino

Nobuaki Hayashi

Emiko Yamada

A manufacturing method of organic electroluminescence display device according to the present invention performs (1) a first step for forming a non-affinity region in a surface of an anode provided in each of pixels arranged on a glass substrate by exposing the glass substrate in a saturated vapor pressure of an organic solvent, (2) a second step for forming an affinity region in a central portion of the anode surface spaced from its edges by irradiating the central portion of the anode surface with ultraviolet light, and (3) a third step for forming polymer material layers which constitute an organic electroluminescent element in the each of the pixels in the affinity region by blowing off polymer material solutions onto the affinity region of the anode in the each of the pixels, in this order, to simplify entire steps in, to reduce cost for, and to improve productivity of the manufacturing process of the organic electroluminescence display device thereby.

Manufacturing method of organic electroluminescence display device

In an organic EL display device having at least one electrode, a light emitting material layer and another electrode that are stacked in each pixel region formed on a surface of a substrate, wherein the light emitting material layer is formed in an opening portion of a bank film which separates the pixel region from other pixel regions arranged close to the pixel region so that the inside of the opening portion of the bank film is filled with the light emitting material layer, a light reflection function is imparted to at least a side wall surface of the opening portion of the bank film, so that the light take-out efficiency of the organic EL display device is enhanced.

Organic EL display device

In an organic EL (electroluminescent) display device, which has a substrate having a first principal surface and a second principal surface opposed to the first principal surface and a light emitting material layer formed at the first principal surface of the substrate, a light absorption layer is provided for absorbing light in a wavelength band lying between 350 nm and 410 nm. This light absorption layer is provided at the second principal surface of the substrate opposite to the light emitting material layer and operates to shield the light emitting material layer from the light of the aforementioned wavelength band, which is selectively absorbed by the light emitting material layer. In this way, deterioration of the light emitting material layer can be avoided, so that the organic EL display device can maintain a sufficient display brightness even after being irradiated with excessive external light.

Growing community of inventors

Kokubunji, Japan

Akiko Yasukawa