Mitsui Minings & Melting Co., Ltd.

Akiko Sugioka

Takahiro Sato

Yunosuke Nakahara

Yutaka Hirasawa

Susumu Takahashi

Naohiko Abe

Takuya Yamamoto

Takashi Kataoka

Isamu Yashima

Junshi Yoshioka

Kenichiro Iwakiri

Hiromu Watanabe

Michitaka Yamaguchi

Yuichi Senoo

Takahito Asanuma

Makoto Higuchi

Akihiro Kanno

Hirotake Nakashima

Noriyuki Takahashi

Akiyoshi Mikami

Kousuke Terada

A catalyst for exhaust gas purification having superior exhaust gas purification performance is provided. Disclosed is a catalyst containing, as a catalyst support, a composite phosphate containing yttrium and phosphorus and having a composition ratio of yttrium to phosphorus (Y/P) of greater than 1 as a molar ratio.

Catalyst

An object of the present invention is to provide a material for forming a capacitor layer comprising a dielectric layer formed by any one of a sol-gel method, an MOCVD method, and a sputtering deposition method. The material can reduce a leakage current of a capacitor circuit. In order to achieve the object, a material for forming a capacitor layer comprising a dielectric layer between a first conductive layer to be used for forming a top electrode and a second conductive layer to be used for forming a bottom electrode, characterized in that the dielectric layer is a dielectric oxide film formed by any one of a sol-gel method, an MOCVD method, and a sputtering deposition method; and particles constituting the dielectric oxide film are impregnated with a resin component is employed. In addition, a manufacturing method characterized in that the dielectric oxide film is formed on the surface of a material to be the bottom electrode by any one of a sol-gel method, an MOCVD method, and a sputtering deposition method; a resin varnish is impregnated into a surface of the dielectric oxide film; the resin is dried and cured to form the dielectric layer; and then a top electrode constituting layer is provided on the dielectric layer is employed.

Material for forming capacitor layer and method for manufacturing the material for forming capacitor layer

The object is to provide a material for forming a capacitor layer which is excellent in adhesion within a dielectric layer and a bottom electrode of a capacitor circuit. And to provide a material for forming a capacitor layer which has a new conductive layer for forming a bottom electrode capable of being used as an electrode serving also as a resistance circuit and the like. To solve the problem, the invention provides a conductive layer in which a pure nickel layer and a nickel-phosphorus alloy layer are deposited in order on a surface of a copper layer or a nickel-phosphorus alloy layer, a pure nickel layer and a nickel-phosphorus alloy layer are deposited in order on a surface of a copper layer, to assure excellent adhesion within the bottom electrode of a capacitor circuit and the dielectric layer in a printed wiring board having a dielectric layer between an top electrode and a bottom electrode.

Materials for forming capacitor layer and printed wiring board having embedded capacitor circuit obtained by using the same

This invention provides a composite foil comprising an organic release layer between a metal carrier layer and an ultra-thin copper foil, and a process for producing such composite foils comprising the steps of depositing the organic release layer on the metal carrier layer and then forming an ultra-thin copper foil layer on said organic release layer by electrodeposition. The organic release layer preferably is a nitrogen-containing compound, a sulfur-containing compound, or a carboxylic acid, which provides a uniform bond strength which is adequate to prevent separation of the carrier and ultra-thin copper foil during handling and lamination, but which is significantly lower than the peel strength of a copper/substrate bond, so that the carrier can easily be removed after lamination of the composite foil to an insulating substrate. The invention also includes laminates made from such composite foils and printed wiring boards made from such laminates.

Making and using an ultra-thin copper foil

A thin film electro-luminescence composition comprising an alkaline earth metal thiogallate represented by the following compositional formula: ##EQU1## wherein M.sup.1 is Sr or Ba; RE is a lanthanoid element; a and b are integers which are different from each other; and wherein x is 0.001 to 0.1 with the proviso that ##EQU2## is excluded or comprising an alkaline earth metal thioaluminate represented by the following compositional formula: ##EQU3## wherein M.sup.2 is Ca, Sr or Ba; RE is a lanthanoid element; c and d are integers which may be different from each other; and wherein y is 0.001 to 0.1, and a thin film electro-luminescence device comprising said thin film electro-luminescence composition as a luminescence layer.

Thin film electro-luminescence device

Growing community of inventors

Ageo, Japan

Akiko Sugioka