Mitsui Minings & Melting Co., Ltd.

Rikagaku Kenkyusho

Akiko Sugimoto

Makoto Dobashi

Junshi Yoshioka

Sakiko Taenaka

Ken-ichiro Iwakiri

Shinichi Obata

Yutaka Hirasawa

Naotomi Takahashi

Susumu Takahashi

Takuya Yamamoto

Yasuhide Yamaguchi

Naohiko Abe

Kenichiro Iwakiri

Hiromu Watanabe

Ryoma Tsukuda

Tsutomu Higuchi

Akitoshi Takanashi

Kenichi Amitani

Yusaburo Segawa

Yukio Nobe

Susumu Nanba

Pil H Kim

In this fuel cell electrode catalyst layer, a catalyst is supported on a carrier comprising inorganic oxide particles. The fuel cell electrode catalyst layer is provided with a porous structure. When a mercury penetration method is used to measure the pore size distribution of the porous structure, a peak is observed in the range spanning from 0.005 &#x3bc;m to 0.1 &#x3bc;m inclusive, and a peak is also observed in the range spanning from over 0.1 &#x3bc;m to not more than 1 &#x3bc;m. When P1 represents the peak intensity in the range spanning from 0.005 &#x3bc;m to 0.1 &#x3bc;m inclusive, and P2 represents the peak intensity in the range spanning from over 0.1 &#x3bc;m to not more than 1 &#x3bc;m, the value of P2/P1 is 0.2-10 inclusive. It is preferable that the inorganic oxide be tin oxide.

Fuel cell electrode catalyst layer, production method therefor, membrane electrode assembly, and solid polymer fuel cell

The object is to provide a method of manufacturing electrodeposited copper foil with a carrier foil for high-temperature heat-resistance in which the peeling of the carrier foil is easy even by press working at temperatures of not less than 200&#xb0;C. For this purpose are adopted 'a method of manufacturing electrodeposited copper foil with a carrier foil for high-temperature heat-resistance in which an organic adhesive interface layer is formed on a surface of carrier foil by use of an organic agent, and an electrodeposited copper foil layer is formed on the organic adhesive interface layer, characterized in that the formation of the organic adhesive interface layer on the surface of the carrier foil is performed by acid pickling the surface of the carrier foil by use of an acid pickling solution containing 50 ppm to 2000 ppm of organic agent used in the formation of the adhesive interface layer and by simultaneously causing the organic agent to be adsorbed whereby an acid pickled and adsorbed organic film is formed' and others.

Method of manufacturing electrodeposited copper foil with carrier foil for high-temperature heat-resistance and electrodeposited copper foil with carrier foil for high-temperature heat-resistance obtained by the manufacturing method

An object is the provision of a peelable electrodeposited copper foil with carrier foil that stabilizes the peel strength between the carrier foil and the electrodeposited copper foil layer even when used in manufacture of the printed wiring boards that requires pressing at the temperatures of 200&#xb0; C. or higher. For the purpose of achieving the object, the electrodeposited copper foil with carrier foil, which includes an adhesive interface layerarranged on one face of the carrier foiland an electrodeposited copper foil layerarranged on the adhesive interface layer, characterized in that the adhesive interface layeris composed of a metal oxide layer ML and an organic material layer OL, and the like are used.

Electrolyte copper foil having carrier foil, manufacturing method thereof, and layered plate using the electrolyte copper foil having carrier foil

An object of the present invention is to reduce and to stabilize peel strength of a carrier foil in an electrodeposited copper foil with carrier employing an organic adhesive interface, thereby facilitating peeling of the carrier foil. The electrodeposited copper foil with carrier of the present invention contains a carrier foil layer, an organic adhesive interface layer formed on the carrier foil layer, and an electrodeposited copper foil layer formed on the organic adhesive interface layer, wherein the difference between the coefficient of thermal expansion of material forming the carrier foil layer at a certain temperature and that of material forming the electrodeposited copper foil at the same temperature is 4&times;10 /deg.C or more.

Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foil

The present invention provides electrodeposited copper foil with carrier which has an organic adhesive interface layer permitting control of the lower limit of peel strength between a carrier foil and an electrodeposited copper foil and to a method for producing the electrodeposited copper foil with carrier. In the electrodeposited copper foil with carrier including a carrier foil, an adhesive interface layer formed on the carrier foil, and an electrodeposited copper foil formed on the adhesive interface layer, the carrier foil is formed of a copper foil and the adhesive interface layer contains an organic agent and metallic particles, the organic agent and the metallic particles being in an intermingled state.

Electolytic copper foil with carrier foil and method for manufacturing the same

To provide an electrodeposited copper foil with carrier, in which electrical connection holes such as through holes (PTH), interstitial via holes (IVH), and blind via holes (BVH) can be readily formed. The invention provides an electrodeposited copper foil with carrier comprising a carrier foil, an organic release interface layer formed on a surface of the carrier foil, and an electrodeposited copper foil layer deposited on the release interface layer, wherein copper microparticles are deposited on the surface of the carrier foil onto which the organic release interface layer and the electrodeposited copper layer are formed.

Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil

In a method for manufacturing forsterite single crystals containing tetravalent chromium as luminescent ions, the method which comprises the use of chromium dioxide or comprises the use of a sintered body obtained either by sintering in a non-reducing atmosphere chromium trioxide or a mixture of at least 30 wt. % of chromium trioxide with up to 70 wt. % of dichromium trioxide, together with other oxide materials for forsterite, or by firing in an oxidizing atmosphere a mixture of more than 70 wt. % of dichromium trioxide with less than 30 wt. % of chromium trioxide, together with other oxide materials for forsterite. This invention also relates to forsterite single crystals obtained by each of the above methods.

Forsterite single crystal and method for the manufacture of the same

A chrysoberyl solid state laser comprising:

Chrysoberyl solid state lasers

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Ageo, Japan

Akiko Sugimoto