Kabushiki Kaisha Toshiba

Toshiba Lighting & Technology Corporation

Other

Nof Corporation

Tama Chemicals Co., Ltd.

Akiko Saito

Tadahiko Kobayashi

Masashi Sahashi

Tsuyoshi Oyaizu

Seiko Kawashima

Hideyuki Tsuji

Nobuhiko Betsuda

Hitoshi Iwasaki

Hideaki Fukuzawa

Yuzo Kamiguchi

Kazuo Egawa

Yuichiro Takahara

Masahiro Izumi

Hiroki Tamai

Takeshi Arimura

Shiori Kaji

Kiyoshi Nishimura

Naoaki Sakurai

Hideaki Hirabayashi

Kazuhiro Saito

Hitoshi Kawano

Yusuke Shibahara

Hiroaki Yoda

Katsuhiko Koui

Shinya Sakurada

Keiichi Shimizu

Takao Sawa

Naoya Hayamizu

Kozo Ogawa

Nobuo Shibano

Tomohiro Sanpei

Akihiko Tsutai

Haruki Takei

Takumi Suwa

Makoto Bessho

Susumu Hashimoto

Masatoshi Yoshikawa

Hiromi Yuasa

Akihiro Kasahara

Takuya Takahashi

Katsumi Hisano

Akihiro Koga

Tomoko Eguchi

Norihiro Tomimatsu

Hideo Iwasaki

Akimichi Takahashi

Hiroshi Fujita

Soichi Shibusawa

Koji Sato

Toshitsura Cho

Shumpei Shimizu

Shinji Nogi

Takahiko Wakatsuki

Toshihide Hayashi

Yukinobu Nishibe

Tomiho Yamada

Katsuhiro Kato

Yuichi Ohsawa

Tomohiro Yamashita

Yukihiro Shibata

Takashi Kuboki

Toshiro Hiraoka

Masaya Hagiwara

Hiromi Fuke

Wu Mei

Takahiro Kawamoto

Masami Okamura

Toshiya Tanaka

Koichi Harada

Michihiko Inaba

Masahiro Ishidoya

Yoichi Tokai

Masaki Endo

Ryosuke Yagi

Akira Kawakatsu

Jun Momma

Ryotaro Matsuda

Aiko Takahashi

Ariyoshi Ishizaki

Yumiko Hayashida

Hideo Oota

Kiyoshi Otani

Kazuaki Fukamichi

Toshiya Sakamoto

Yoji Yuge

Junya Murata

Tsutomu Makino

Yoshihiro Oshibe

Asaya Fujita

Yoshiaki Iijima

Ryoutarou Matsuda

Masahi Sahashi

Yukiko Nishiyama

A heat regenerating material particle according to an embodiment includes a plurality of heat regenerating substance particles having a maximum volume specific heat value of 0.3 J/cm&#xb7;K or more at a temperature of 20 K or lower, and a binder bonding the heat regenerating substance particles, the binder containing water insoluble resin. The heat regenerating material particle has a particle diameter of 500 &#x3bc;m or less.

Heat regenerating material, regenerator, refrigerator, superconducting magnet, nuclear magnetic resonance imaging apparatus, nuclear magnetic resonance apparatus, cryopump, and magnetic field application type single crystal pulling apparatus

One embodiment provides a cryogenic regenerator material containing as the main constituent at least one compound (A) containing at least one metallic element M and at least one non-metallic element X selected from O, S, N and F. The compound (A) in the cryogenic regenerator material has a half width of a main peak of 0.2 degrees or more obtained by the powder X-ray diffraction measurement.

Cryocooler regenerator material, cryogenic regenerator, regenerative cryocooler and system comprising regenerative cryocooler

According to an embodiment, a cryogenic regenerator material contains a silver oxide. A molar ratio of silver atoms to oxygen atoms contained in the cryogenic regenerator material: Ag/O is 1.0 or more and 4.0 or less. The cryogenic regenerator material contains at least one selected from AgO, AgO and AgO as the silver oxide.

Cryogenic regenerator material, regenerative cryocooler, and system including regenerative cryocooler

The magnetic refrigerating device according to one embodiment includes a fixed container filled with a refrigerant, the fixed container including a magnetic material container that is filled with a magnetic material and that can move in the fixed container and an elastic member provided at the end of the magnetic material container. The magnetic refrigerating device also includes a magnetic-field applying/removing mechanism that is provided at the outside of the fixed container, and that can apply and remove a magnetic field to and from the magnetic material and can generate a magnetic torque to the magnetic material container in moving direction of the magnetic material container.

Magnetic refrigerating device and magnetic refrigerating system

Magnetic materials, having: a composition represented by a general formula:(RX)(FeM)where, R is at least one of element selected from the group consisting of La, Ce, Pr, Nd, Sm, Gd, Tb, Dy, Ho, Er, Tm, Yb and Y, X is at least one of element selected from the group consisting of Ti, Zr and Hf, M is at least one of element selected from the group consisting of V, Cr, Mn, Ni, Cu, Zn, Nb, Mo, Ta, W, Al, Si, Ga and Ge, x is a value satisfying 4&#x2266;x&#x2266;20 atomic %, y is a value satisfying 0.01&#x2266;y&#x2266;0.9, and a is a value satisfying 0&#x2266;a&#x2266;0.2, wherein the magnetic material includes a ThNicrystal phase or a TbCucrystal phase as a main phase, that are useful for magnetic refrigeration.

Magnetic material for magnetic refrigeration

There are provided a magnetic material for magnetic refrigeration improving a magnetic refrigeration efficiency by including a wide operation temperature range and a magnetic refrigeration apparatus and a magnetic refrigeration system using the magnetic material. The magnetically refrigerating magnetic material is formed of a magnetic material shown by a composition formula of GdZrY, wherein 0&#x3c;x&#x3c;3.4 as well as 0&#x2266;y&#x2266;13.5, and the magnetic refrigeration apparatus and the magnetic refrigeration system uses the magnetic material. It is preferable that the magnetic material be approximately spherical magnetic particles having a maximum diameter of 0.3 mm or more to 2 mm or less.

Magnetically refrigerating magnetic material, magnetic refrigeration apparatus, and magnetic refrigeration system

A light-emitting module may be configured to have improved light emission efficiency and light distribution characteristics. A light-emitting module may include a substrate having a front surface side as a component mounting surface and a rear surface side as a flat heat dissipating surface, a plurality of light-emitting elements arranged in a manner protruding at a central portion of the component mounting surface of the substrate. The light-emitting elements may radiate light at least in an upper surface direction and in a direction along the component mounting surface. The module may further include one or more lighting circuit components electrically connected to the light emitting elements by a wiring pattern arranged on the substrate and which is arranged closer to the peripheral edge side of the substrate than the light emitting elements on the component mounting surface of the substrate, and a connector for power supply connection.

Light-emitting module and lighting apparatus

According to one embodiment, a magnetic refrigeration device includes magnetic bodies, a magnetic field application unit, a thermal storage medium, and a heat transfer unit. The magnetic bodies are arrayed at an interval. The application unit applies and removes a magnetic field to and from the magnetic bodies, respectively. The medium is arranged to face at least one of the magnetic bodies. The medium has no Curie point within a range of a temperature change of the magnetic bodies and removal. The heat transfer unit selectively brings the medium into thermal contact with the magnetic bodies or thermally isolates the medium from the magnetic bodies, and transfers heat from the magnetic bodies to the medium or from the medium to the magnetic bodies in synchronism with magnetic field application and removal.

Magnetic refrigeration device and magnetic refrigeration system

A heat exchanger unit according to an exemplary embodiment includes: a plurality of heat exchangers that includes magnetic particles therein; and a connection section that is provided between the heat exchangers to connect the heat exchangers, the connection section including a solid-core member, a porous body or a combined substance of the solid-core member and the porous body. In the heat exchanger unit, the connection section invades partially into an inside of the heat exchanger connected thereto.

Heat exchanger unit and thermal cycling unit

A light emitting module () comprises a module substrate (), a light emitting diode string (), and a sealing member (). The light emitting diode string () includes light emitting diode elements () and bonding wires () which connect the light emitting diode elements (). The light emitting diode element () has a pair of element electrodes () and has a rectangular shape extending in a direction along which the element electrodes () are aligned. The sealing member () is laminated on the module substrate () to seal the light emitting diode string (). The light emitting diode elements () are arranged at intervals in a direction crossing the direction along which the element electrodes () are aligned, and the element electrodes () with the same polarity are aligned to be adjacent to each other in an arrangement direction of the light emitting diode elements () between the light emitting diode elements () adjacent to each other. Each bonding wire () is obliquely wired with respect to the arrangement direction of the light emitting diode elements () to connect the element electrodes () with different polarities of the light emitting diode elements () adjacent to each other.

Light emitting module and illumination apparatus

A magnetic refrigeration material includes: at least one selected from the group consisting of Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm and Tb by a range of 4 to 15 atomic percentages; at least one selected from the group consisting of Fe, Co, Ni, Mn and Cr by a range of 60 to 93 atomic percentages; at least one selected from the group consisting of Si, C, Ge, Al, Ga and In by a range of 2.9 to 23.5 atomic percentages; and at least one selected from the group consisting of Ta, Nb and W by a range of 1.5 atomic percentages or less, wherein the magnetic refrigeration material includes a NaZntype crystal structure as a main phase.

Magnetic refrigerating material and magnetic refrigerating device

According to one embodiment, a light-emitting device includes a substrate including an insulating surface, a plurality of light-emitting elements mounted on the surface of the substrate and electrically connected to each other, a positive power feeding conductor and a negative power feeding conductor mounted on the surface of the substrate to feed power to the light-emitting elements, lead-out terminals leading from the power feeding conductors, to the outside of an mounting area of the light-emitting elements, and an anti-noise part connected to the lead-out terminals and arranged outside the mounting area.

Light-emitting device and lighting apparatus provided with the same

The light source unit is provided with a substrate and a decorative cover having thermal conductivity. The substrate includes a circuit pattern area, in which a plurality of LED chips are disposed, at the middle part thereof, has thermal conductivity, and transmits heat from the circuit pattern area to an area in the outer circumferential direction thereof. The decorative cover encloses the substrate, is electrically insulated from the circuit pattern area, and is thermally coupled to the surface side of the substrate at the periphery of the circuit pattern area by being face-contacted thereto. Heat of the substrate can be radiated by the decorative cover while securing an electric insulation property with respect to the circuit pattern area.

Light source unit and lighting system

A lighting device may include a substrate attached to one edge side of a radiator and a cover may be attached to cover the substrate. Heat-radiating fins may be provided on the other edge side of the radiator and an air-cooling unit may be rotatably provided inside the heat-radiating fins, thereby enabling freely rotation. In one or more examples, a case storing a circuit part is attached to the other edge side of the radiator and a cap is provided to the case. By the air flow from the air-cooling unit, the heat-radiating fins are caused to be a part of the ventilation path to allow for ventilation of the inside of the radiator.

Lighting device

Growing community of inventors

Kawasaki, Japan

Akiko Saito