Sumitomo Bakelite Company Limited

Sumitomo Baeklite Company Limited

Akiko Okubo

Sumiya Miyake

Yoshiyuki Go

Hiroshi Nagata

Minoru Kobayashi

Hiromi Honda

Hirotaka Nonaka

Hiroshi Hirose

Yoshihito Akiyama

Yoshiyuki Goh

Maki Sugawara

A curing accelerator which is suitable for various curable resin compositions, an epoxy resin composition having excellent curability, storage stability and fluidity, and a semiconductor device having excellent solder cracking resistance and moisture resistance reliability are provided. The epoxy resin composition includes a compound (A) having two or more epoxy groups in one molecule, a compound (B) having two or more phenolic hydroxyl groups in one molecule, trisubstituted phosphoniophenolate or a salt thereof as a curing accelerator (C), and an inorganic filler (D).

Composition of epoxy resin, polyphenolic compound and trisubstituted phosphonionphenolate salt

Curing accelerator, epoxy resin composition, and semiconductor device

This invention provides a latent catalyst having a structure of phosphonium borate consisting of a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and a monovalent anion portion in which four specific groups are bonded to the boron atom, and a latent catalyst having a structure wherein the above phosphonium borate is the recurring unit and at least two of said recurring unit are connected through at least one of the four specific groups bonded to the boron atom. This invention also provides a thermo-setting resin composition comprising such a latent catalyst and an epoxy resin molding material comprising such a latent catalyst and further provides a semiconductor device in which a semiconductor is encapsulated with said epoxy resin molding material.

Latent catalyst

This invention provides a latent catalyst having a structure of phosphonium borate consisting of a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and a monovalent anion portion in which four specific groups are bonded to the boron atom, and a latent catalyst having a structure wherein the above phosphonium borate is the recurring unit and at least two of said recurring unit are connected through at least one of the four specific groups bonded to the boron atom. This invention also provides a thermosetting resin composition comprising such a latent catalyst and an epoxy resin molding material comprising such a latent catalyst and further provides a semiconductor device in which a semiconductor is encapsulated with said epoxy resin molding material.

Thermosetting resin and tetraorganophosphonium dicyclic tetraorganoborane catalyst

Tetraorganophosponium dicyclic tetraorganoborate catalyst

The moisture resistance reliability of a latent catalyst is evaluated for a phosphonium borate wherein at least one group pendant on the boron atom is a group formed when a proton donor having at least one proton capable of being liberated out of the molecule has liberated one or at least two protons, the evaluation comprising (1) mixing one gram of the proton donor wherefrom the latent catalyst is derived with 50 grams of purified water to obtain an aqueous mixture, (3) subjecting the aqueous mixture to pressure cooker treatment at a temperature of 125&deg; C. for 20 hours in a pressure cooker vessel to obtain an extraction mixture, and (4) measuring the electrical conductivity of the extraction mixture wherein the acceptable electrical conductivity of the extraction mixture is no greater than 1,000 &mgr;S/cm.

Evaluating moisture resistance reliability of phosphonium borate catalyst

Growing community of inventors

Kawasaki, Japan

Akiko Okubo