Fujitsu Corporation

Fujitsu Limied

Akiko Matsui

Tetsuro Yamada

Yoshiyuki Hiroshima

Kohei Choraku

Takahide Mukoyama

Mitsuhiko Sugane

Takahiro Ooi

Naoki Nakamura

Yoshihiro Morita

Kazuki Takahashi

Mitsunori Abe

Shigeo Iriguchi

Takahiro Kitagawa

Yoshio Kobayashi

Takahide Mukouyama

Misuhiko Sugane

Sotaro Kobayashi

A specific conductivity measurement method includes: performing first measurement to obtain a resonance frequency fthat is outputted to a measuring device when the first and second dielectric flat plates each have a thickness t, and an unloaded Qthat corresponds to the resonance frequency f; performing second measurement to obtain a resonance frequency fthat is outputted to the measuring device when the first and second dielectric flat plates each have a thickness tthat is different from the thickness t, and an unloaded Qthat corresponds to the resonance frequency f; and calculating a specific conductivity &#x3c3;of the copper foil and the first and second conductor flat plates based on an arithmetic equation that includes the resonance frequency the unloaded Q, the resonance frequency f, and the unloaded Q.

Specific conductivity measurement method, recording medium recording specific conductivity calculation program, and specific conductivity measurement system

An electronic component includes: a first terminal that is inserted into a first through hole in a substrate; and a second terminal that is inserted into a second through hole in the substrate, wherein a length of the first terminal from a first end that is inserted into the first through hole to a second end is longer than a length of the second terminal from a third end that is inserted into the second through hole to a fourth end, and a cross sectional area of a portion of the first terminal positioned on a side of the second end with respect to a first joined portion is larger than a cross sectional area of a portion of the second terminal positioned on a side of the fourth end with respect to a second joined portion.

Electronic component and substrate

A recording medium recording a program for a process, the process includes: calculating an amount of distortion in a via of a printed circuit board based on an expression using coefficient m, &#x394;&#x3b5;={(L&#xd7;&#x3b1;&#xd7;&#x394;t&#xd7;E)/(D&#xd7;T)}&#xd7;m, where &#x394;&#x3b5; is the amount of distortion, L is a length of the via, &#x3b1; is a thermal expansion coefficient of a base material, &#x394;t is a temperature change of an environment, E is a Young's modulus, D is a diameter of the via, and T is a thickness of plating in the via; and calculating a lifetime of the via based on an expression, M=N/(n&#xd7;365), where M is the lifetime of the via, n is a frequency of the temperature change, and N is the number of cycles of the lifetime satisfying an expression N=C/&#x394;&#x3b5;.

Recording medium recording via lifetime calculation program, via lifetime calculation method, and information processing device

An optical waveguide substrate includes a substrate that includes a recess, a buffer layer disposed on a bottom surface and a wall surface of the recess, and an optical waveguide disposed inside the recess with the buffer layer interposed therebetween and having a cladding layer disposed on the buffer layer and a core layer disposed inside the cladding layer.

Optical waveguide substrate, method of manufacturing optical waveguide substrate, and method of repairing optical waveguide substrate

An information processing device includes a processor that calculates a distortion amount that represents an amount of distortion generated in a via of a printed circuit board based on a following equation, &#x394;&#x3b5;={(L&#xd7;&#x3b1;&#xd7;&#x394;t&#xd7;E)/(D&#xd7;T)}&#xd7;m&#xd7;&#x3b2;&#xd7;&#x3b3;&#xd7;&#x3b7;; calculates a lifetime of the via based on a following equation, M=N/(n&#xd7;365); changes, when the calculated lifetime is outside a first setting range, at least two design values of the via length, the thermal expansion coefficient, the Young's modulus, the via diameter, or the plating thickness within a second setting range corresponding to the at least two design values respectively; gives points of two perspectives affected by the change and outputs a graph that indicates an impact degree according to the points of the two perspectives for each combination of the at least two design values.

Method for outputting impact degree and information processing device

A wiring board manufacturing method includes forming a conductor pattern within a waste board section of a wiring board including a product section and the waste board section, the conductor pattern in which a plurality of polygonal lands made of a conductor are arranged along a first direction and a second direction crossing the first direction, each of the plurality of polygonal lands making contact with an adjacent one of the plurality of polygonal lands at each apex of the plurality of polygonal lands; and selectively removing the conductor at the apex of at least part of the plurality of polygonal lands.

Wiring board manufacturing method

A light emitting element bonded board includes an optical waveguide formed within a board, a hollowed portion in the board, a light emitting element installed in the hollowed portion, and a conductive portion formed in an upper layer and/or a lower layer of the optical waveguide, wherein an optical axis of the light emitting element coincides with a center line of the optical waveguide, and a bonding portion of the light emitting element is bonded to the conductive portion.

Light emitting element bonded board and method of manufacturing light emitting element bonded board

A printed circuit board includes a power feeding layer to which a power supply voltage is applied, a plurality of power feeding terminals that is disposed in an area, in which an electronic component is mounted, and supplies current based on the power supply voltage to the electronic component, and a plurality of vias that electrically interconnects the plurality of power feeding terminals and the power feeding layer, and is formed such that a via coupled to a power feeding terminal disposed closer to an end of the area has a smaller via-diameter.

Printed circuit board and electric device

A wiring board includes: a first substrate that includes signal wiring; a second substrate that includes a conductor with an area larger than an area of the signal wiring, and projection formed on a face of the conductor and constituted of an insulator with a pattern corresponding to a pattern of the signal wiring, the second substrate being arranged so that the face of the conductor on which the projection is formed faces the signal wiring; and an intermediate layer that is arranged between the signal wiring and the conductor and includes a fibrous member.

Wiring board, electronic apparatus, and manufacturing method of wiring board

An optical axis adjustment method for optical interconnection, includes: providing, on a substrate, an optical transmitter including light sources and a mark for acquiring a position of each of the light sources; providing, on the substrate, an optical waveguide including cores each allowing light emitted from the respective light sources to propagate through the core; determining a first position based on the mark as a position of each of the light sources; and forming, at a second position in the optical waveguide corresponding to the first position, first mirrors configured to reflect the light emitted from the respective light sources and make the light propagate through the respective cores.

Optical interconnection substrate including optical transmitter with light source and mark or optical receiver with light receiving unit and mark

A circuit board disclosed herein includes: two substrates opposed to each other, where a dielectric being interposed between the two substrates; a through hole formed in each of the two substrates and filled with the dielectric; a first conductor film formed on an inner surface of the through hole; and a second conductor film covering the through hole on a main surface of each of the two substrates on an opposite side to the dielectric, the second conductor film being connected to the first conductor film on the main surface side.

Circuit board and method of manufacturing the same

A printed circuit board includes: a first electrode made of a tubular electric conductor formed on an inner wall of a first hole formed in the printed circuit board; a dielectric body disposed inside the first electrode; and a second electrode made of a tubular electric conductor formed on an inner wall of a second hole extending through the dielectric body, the second electrode having a center axis concentric with the first electrode.

Printed circuit board, electronic device, and manufacturing method

Optical axis adjustment method for optical interconnection, and optical interconnection substrate

A placement apparatus for an optical component includes: a suction nozzle that includes a nozzle main body having a suction surface having a suction port, an optical component being sucked to the suction port, a plurality of nozzle electrodes disposed on the suction surface, each of the nozzle electrodes being brought into contact with a corresponding one of a plurality of component electrodes provided on the optical component so as to establish electrical conduction between each of the plurality of nozzle electrodes and a corresponding one of the plurality of component electrodes.

Growing community of inventors

Meguro, Japan

Akiko Matsui