Other

Akiko Iwano

Yuji Kawamata

Toshihiko Taguchi

Hisayuki Abe

A soldering flux suitable for soldering of small electronic components comprises 0.1-50 mass percent of an organic acid, 5-40 mass percent of a solvent, and 10-95 mass percent of a thermosetting resin (including a curing agent), which is preferably a bisphenol A epoxy resin and an acid anhydride or amine curing agent. This flux can be used to prepare a solder paste by mixing with solder powder. This soldering flux can secure an electronic component simultaneously by soldering and by the resin, simply by a soldering operation at a soldering temperature of at least 150&deg; C., and cleaning after soldering is no longer necessary.

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Mouka, Japan

Akiko Iwano