Sanwa Electronics USA Corporation

Sanwa Technologies, Inc.

Ball Semiconductor Corporation

Akihito Ishikawa

Takashi Sato

Tomoaki Kaga

Nobuo Takeda

Masataka Yoshida

Tomoki Tanaka

A fiber optic connector may include a body, at least one input coupling configured to receive at least one fiber optic input cable, at least one output coupling configured to receive at least one fiber optic output cable, and at least one shuttle. The shuttle may be movable within the body between a connected position and a disconnected position, wherein the at least one fiber optic input cable and the at least one fiber optic output cable are optically connected when the at least one shuttle is in the connected position, and wherein the at least one fiber optic input cable and the at least one fiber optic output cable are not optically connected when the at least one shuttle is in the disconnected position.

Optical connector switches, systems, and methods

Reversible optical connectors, and associated devices and methods are provided. In one embodiment, a connector for a communication cable includes a housing comprising a cavity, and a first plug and a second plug coupled to a distal portion of the housing. The first and second plugs are connected to the housing such that the first and second plugs are independently rotatable with respect to the housing. The connector further includes a latch actuator coupled to the housing and configured to disengage one or more latches from an outlet. By rotating the plugs 180 degrees and turning the connector over, the relative arrangement or position of the two plugs can be switched or reversed. The plugs can be rotated or reversed without completely disassembling the connector, in some embodiments. Accordingly, embodiments of the present disclosure can improve workflows for a user or operator that in a high-density networking setting.

Reversible optical connectors and associated devices, systems, and methods

A system and method is disclosed for coating a conventional wafer or a spherical shaped semiconductor substrate with liquid material such as photoresist by utilizing a &ldquo;drop on demand&rdquo; piezo driven dispense nozzle, a bubble-jet dispense nozzle, or a continuous piezo jet with charging electrodes. The proposed system and method will greatly reduce, and in some cases virtually eliminate, the waste of photoresist in the process.

Jet coating method for semiconductor processing

Growing community of inventors

Allen, TX, United States of America

Akihito Ishikawa