Toyota Jidosha Kabushiki Kaisha

Hitachi Chemical Company, Ltd.

Akihito Goto

Akihiro Kimura

Fukashi Andoh

Hidenori Yabushita

Yoshihiro Okumatsu

Fuminori Saito

Takeshi Nishida

Reoto Uetake

Atsunori Kobayashi

Masaki Yamaguchi

Masahiro Sakata

A conveyance robot system according to the present disclosure includes a conveyance robot, and a robot control unit configured to control an operation of picking up an object performed by the conveyance robot, wherein the robot control unit determines that a movable range area, which is an area outside a safety cover where a robot arm is operated, satisfies a safety ensuring condition that can regard safety of the movable range area as equivalent to the safety inside the safety cover and allow the robot arm to perform a work while projecting toward the shelf.

Conveyance robot system, method for controlling conveyance robot and non-transitory computer readable storage medium storing a robot control program

A conveyance robot system according to the present disclosure includes an intrusion detection sensor that detects an intrusion of an object into the arm opening, and a distance sensor that measures a clearance distance indicating a distance between an arm entry/exit surface and a shelf, the arm entry/exit surface being a surface of the conveyance robot in which the arm opening is provided from among surfaces of the conveyance robotconstituting the safety cover, and the object being stored in the shelf. The distance sensor is disposed at a fixed height of the shelf in a horizontal direction and at a height of the shelf corresponding to a part to be measured.

Conveyance robot system, method of controlling a conveyance robot and non-transitory computer readable storage medium storing a robot control program

A laminated substrate includes: a first substrate; a second substrate having a through-hole; a third substrate; a first adhesive layer bonding a rear surface of the first substrate and a front surface of the second substrate; a second adhesive layer bonding a rear surface of the second substrate and a front surface of the third substrate; a first post penetrating through the first adhesive layer, electrically connecting the first substrate to the second substrate, and made of an alloy of a high melting point metal and a low melting point metal; a second post penetrating through the second adhesive layer, electrically connecting the second substrate to the third substrate, and made of an alloy of the high melting point metal and the low melting point metal; and an electronic component fixed to the front surface of the third substrate and disposed in the through-hole of the second substrate.

Laminated substrate and method of manufacturing laminated substrate

Growing community of inventors

Nagoya, Japan

Akihito Goto