Nitto-denko Corporation

Nitto Denko Cororation

Akihisa Murata

Murata Welding Laboratories, Incorporated

Yukio Arimitsu

Kazuyuki Kiuchi

Toshiyuki Oshima

Shinji Inokuchi

Yoshio Terada

Takahiro Nonaka

Yasuyuki Tokunaga

Masahiro Ohura

Daisuke Uenda

Yasuhiro Amano

Yasunori Sugihara

Naoyuki Nishiyama

Masaaki Sato

Koichi Hashimoto

Takashi Yamaoka

Toshitsugu Hosokawa

Yuichi Abe

Takeshi Yamanaka

Shinji Hoshino

Takamasa Hirayama

Manabu Tanaka

Tomoko Kishimoto

Hiraku Yamamoto

Shigeru Nakayama

Katsuhito Kamiya

Tadasuke Murata

The present invention enables even a beginner to acquire the technique easily and perform suitable spot welding, and achieves improved workability, improved welding quality, improved productivity, and the like. The present invention includes a torch bodyfor passing a shielding gas, a tungsten electrode rodinserted into the torch bodyand connected to a cathode, a constricted nozzlefor supporting a distal end portion of the tungsten electrode rodconcentrically, defining a gas passagebetween the tungsten electrode rodand the constricted nozzlefor flowing a shielding gas G, and discharging the shielding gas G from the constricted nozzleat a higher speed than the shielding gas G discharged from the distal end of the torch body, and a cylindrical electrode nozzlehaving conductivity arranged concentrically with the tungsten electrode rodon the outer circumference of the constricted nozzle, connected to the anode via a ground cable, and configured to have a tapered shape at a distal end portion, wherein the tapered distal end portion is located further outside than the distal end portion of the tungsten electrode rod, gas vent portsandof the shielding gas G are provided on the electrode nozzle

TIG welding torch equipped with narrow nozzle for spot welding, and electrode nozzle used in same

A protective member for an acoustic component includes a sound-transmissive sheet composed of an elastomer. The protective member for an acoustic component may further include an adhesive layer disposed on an edge region of the sound-transmissive sheet. The sound-transmissive sheet in the protective member may have waterproofness, and may be used with a waterproof case.

Protective member for acoustic component and waterproof case

The constricting nozzle of the present invention includes (i) a cylindrical nozzle body disposed around the forward end of the tungsten electrode rod concentrically with the tungsten electrode rod and defines an annular high-speed gas passage between the nozzle body and the outer peripheral surface of the forward end of the tungsten electrode rod, (ii) a plurality of positioning projections that are protrudently formed on the inner peripheral surface of the nozzle body with predetermined intervals in the circumferential direction and that are arranged along the longitudinal direction of the nozzle body to hold the tungsten electrode rod in the center position of the nozzle body, and (iii) a plurality of gas-flow regulating grooves formed between the positioning projections and that extend in parallel in the longitudinal direction of the nozzle body and regulate the shielding gas (G) flowing through the high-speed gas passage.

Constricting nozzle and TIG welding torch using this nozzle

A cleaning sheet including a cleaning layer which has a microasperity shape having an arithmetic average roughness Ra of 0.05 &#x3bc;m or less and a maximum height Rz of 1.0 &#x3bc;m or less. Preferably, a substantial surface area of the cleaning layer per a flat surface of 1 mm2 is 150% or more of a substantial surface area of a silicon wafer mirror surface per a flat area of 1 mm2. The cleaning sheet may be provided on at least one surface of a transfer member so that the transfer member has a cleaning function. When the cleaning sheet or the transfer member having a cleaning function is transferred in a substrate processing apparatus in place of a substrate to be processed therein, the cleaning sheet contacts and cleans a site of the substrate processing apparatus.

Cleaning sheet, transfer member provided with cleaning function, and method for cleaning substrate processing apparatus

A cleaning sheet including a cleaning layer which has a microasperity shape having an arithmetic average roughness Ra of 0.05 &#x3bc;m or less and a maximum height Rz of 1.0 &#x3bc;m or less. Preferably, a substantial surface area of the cleaning layer per a flat surface of 1 mmis 150% or more of a substantial surface area of a silicon wafer mirror surface per a flat area of 1 mm. The cleaning sheet may be provided on at least one surface of a transfer member so that the transfer member has a cleaning function. When the cleaning sheet or the transfer member having a cleaning function is transferred in a substrate processing apparatus in place of a substrate to be processed therein, the cleaning sheet contacts and cleans a site of the substrate processing apparatus.

The present invention is intended to solve the following problems with a method for fabricating a substrateless semiconductor package using an adhesive sheet as a temporary fixing supporter. A chip can be displaced from a specified position by pressure during resin encapsulation because the chip is not properly held by the adhesive sheet. If such displacement occurs, the relative positional relationship between the chip and an interconnect to be connected to a specified position in a subsequent wiring step also changes by the displacement of the chip from the specified position. Another problem is that if adhesive deposits occur during peeling of the adhesive sheet and the surface of a package is contaminated with the adhesive deposits, adhesive components left on the surface of the chip can inhibit connection between the interconnect and the chip in a subsequent wiring step. To solve these problems, the present invention provides an adhesive sheet for semiconductor device fabrication that is attached to a substrateless semiconductor chip when the chip is encapsulated with resin. The adhesive sheet includes a base material layer and an adhesive layer. The adhesive layer has a specific adhesion strength and peel strength.

Heat-resistant adhesive sheet for substrateless semiconductor package fabrication and method for fabricating substrateless semiconductor package using the adhesive sheet

The process for producing an organic EL panel according to the present invention is a process for producing an organic electroluminescent panel by forming an organic electroluminescent element on an ultrathin glass plate by vacuum deposition method, including forming electrodes on the ultrathin glass plate, by temporarily fixing the ultrathin glass plate to a supporting plate via a double-sided adhesive tape having a thermal release adhesive layer formed at least on one face of the base material layer, containing heat-expandable microspheres that start expansion and/or foaming at temperature higher than the vacuum deposition temperature.

Process for producing organic electroluminescent panel

Disclosed is a heat-peelable pressure-sensitive adhesive sheet that can prevent the deformation of a pressure-sensitive adhesive layer due to pressurization in a pressing process and can be easily peeled off from the processed article. The heat-peelable pressure-sensitive adhesive sheet includes a substrate, and a heat-expandable pressure-sensitive adhesive layer arranged on or above at least one side of the substrate and containing a foaming agent, in which the heat-expandable pressure-sensitive adhesive layer has a shear modulus (23&#xb0; C.) in an unfoamed state of 7&#xd7;10Pa or more. The heat-expandable pressure-sensitive adhesive layer preferably has a shear modulus (95&#xb0; C.) in an unfoamed state of less than 7&#xd7;10Pa. The foaming agent in the heat-expandable pressure-sensitive adhesive layer preferably has a foam initiating temperature higher than 80&#xb0; C.

Heat-peelable pressure-sensitive adhesive sheet and method for processing adherend using the heat-peelable pressure-sensitive adhesive sheet

A heat-peelable pressure-sensitive adhesive sheet comprises: a base material; and a thermo-expandable pressure-sensitive adhesive layer containing thermo-expandable microspheres, the thermo-expandable pressure-sensitive adhesive layer having a surface to be adhered to an adherend, wherein the surface of the thermo-expandable pressure-sensitive adhesive layer before subjecting to heating has a centerline average roughness of greater than 0.4 &#x3bc;m, and has a convex portion resulting from the thermo-expandable microspheres.

Heat-peelable pressure-sensitive adhesive sheet

A heat-peelable adhesive sheet which shows small increase in the degree of contamination caused by a heat treatment for lowering an adhesive force is disclosed. The heat-peelable pressure sensitive adhesive sheet comprises a heat-expandable layer containing heat-expandable microspheres and expanding upon heating, and a non-heat expandable pressure-sensitive adhesive layer formed on at least one side thereof. The heat-peelable pressure-sensitive adhesive sheet can achieve the desired adhesive properties such as an excellent adhesive force before heating and also show a quick lowering of the adhesive force upon heating. Further, it shows small increase in the degree of contamination due to the treatment for lowering the adhesive force. Due to those characteristics, the heat-peelable pressure-sensitive adhesive sheet is practically applicable to, for example, the production of electronic parts made of thinner semiconductor wafers.

A pressure-sensitive adhesive label has a base having an information indication portion on its one surface thereof, and a pressure-sensitive adhesive layer formed on another surface of the base. After peeling a release liner, the label is stuck on an outer surface of a housing of the hard disk drive to reduce noise generated when the hard disk drive is driven. The release liner for coating the pressure-sensitive adhesive layer has an antistatic function and a cut line. The adhesive force of the adhesive layer is reduced by heating. The label has a surface density of not lower than 0.18 (kg/m).

Pressure-sensitive adhesive label for hard disk drive

A heat-peelable adhesive sheet which comprises a substrate and, formed on at least one side thereof, a heat-expandable layer containing heat-expandable microspheres and an adhesive layer comprising an adhesive substance and in which the substrate has heat resistance and stretchability can be used to cut an adherend so as to form and secure a sufficient space between the resultant cut pieces and can withstand a heat treatment for expanding the heat-expandable layer. Consequently, the adhesive sheet can heighten the operating efficiency and working efficiency in the step of separating and recovering the cut pieces.

Heat-peelable adhesive sheet

A heat-peelable pressure-sensitive adhesive sheet which ensures an efficient contact area even in case where the area of an adherend to be adhered is decreased and thus makes it possible to avoid adhesion failures such as chip-scattering or chipping. The heat-peelable pressure-sensitive adhesive sheet comprises a substrate and a heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres, formed on at least one side of the substrate, wherein the surface of the heat-expandable pressure-sensitive adhesive layer before heating has a center line average roughness of 0.4 &#x3bc;m or less.

An energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet having, on at least one side of a base material, an energy-beam-curable thermo-expandable viscoelastic layer containing thermo-expandable microspheres and a pressure-sensitive adhesive layer stacked in this order. The pressure-sensitive adhesive layer has a thickness of about 0.1 to 10 &#x3bc;m and can be formed from a pressure-sensitive adhesive. The energy-beam-curable thermo-expandable viscoelastic layer, on the other hand, can be formed from a tacky substance. The energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet according to the invention has adhesion enough to withstand a carrying step of an adherend, causes neither winding up of the adhesive nor chipping upon cutting and facilitates peeling and collection of cut pieces after cutting. In addition, it exhibits low contamination on the adherend after peeling.

Growing community of inventors

Osaka, Japan

Akihisa Murata