Fujitsu Corporation

Akihisa Hayashida

Nobuo Iijima

Takanori Muramoto

Yoshihiro Tohyama

Hidenori Akatani

A method of producing semiconductor devices includes the steps of disposing an adhesive tape over a wafer such that an adhesive surface of said tape faces a top surface of said wafer, disposing a flexible urging member over the tape in a state that the flexible urging member causes a deformation by a gravity such that the flexible urging member causes a bulging in a downward direction toward the adhesive tape, moving the flexible urging member relatively to the adhesive tape in engagement with the adhesive tape such that the adhesive tape is deformed in conformity with the flexible urging member and the adhesive tape causes a bulging in a downward direction toward the wafer, and contacting the deformed adhesive tape on the top surface of the wafer.

Method of producing semiconductor devices including a step of dicing a

A tape-on-wafer mounting apparatus and method for mounting a dicing tape on a wafer. The wafer stage mounts a wafer in the hole, which is constructed such that, when the wafer is mounted there, the wafer top surface stands higher than the wafer stage surface, with the wafer surface on which chip circuits are fabricated faced down. The tape stage mounts a dicing tape on its ring with the tape surface on which adhesives are applied faced down. The tape pressing tool presses the tape stage on the wafer stage so that the tape presser, which is constructed such that vertical force exerted by it is the largest at its center and smaller with the increase in distance from the center, causes the dicing tape to stick to the wafer.

Growing community of inventors

Kawasaki, Japan

Akihisa Hayashida