Nec Corporation

Maftec Co., Ltd

Mitsubishi Chemical Corporation

Akihiro Yano

Yuji Kondo

Takashi Ishikawa

Tomoyuki Kobayashi

Masakuni Taguchi

Mitsuo Suzuki

Yusuke Kimura

Yusaku Hata

Kazunori Kawahara

Yuji Kondou

Hideyuki Shiraku

Nobuaki Takata

Provided is a method of installing a heat insulating block on a furnace shell which enables a heat insulating block to be firmly fixed to a furnace wall but does not require much time and costs for making the heat insulating block, and which further offers good workability at a site. The method of installing a heat insulating block on a furnace shell includes: inserting a beam of a fixture into a fold of an inorganic fiber aggregate mat that is folded up to form a heat insulating block; and fixing the fixture and a furnace shell to each other.

Method of installing heat insulating block on furnace shell, method of manufacturing heat insulating wall, heat insulating wall, industrial furnace, and set for installing heat insulating block

Provided is a roller shaft insulation member for reducing the heat which is conducted to the bearings by passing through the space between the roller insertion hole of a continuous annealing furnace and the roller, wherein the roller shaft insulation member of the continuous annealing furnace comprises an inorganic fiber blanket, which contacts or is near the outer circumferential surface of the roller and in which the content of 45 &#x3bc;m or larger shot is 3% or less. A continuous annealing furnace provided with said roller shaft insulation member is also provided.

Roller shaft portion thermal insulation member for continuous annealing furnace and continuous annealing furnace

A heat-insulating protective member for skid posts contains a needled blanket of inorganic fibers. At least some of the needled blanket has, disposed therein, an impregnation part where an oxide-precursor-containing liquid is adherent in an undried state. The impregnation part has a water content of 50-400 parts by mass per 100 parts by mass of the inorganic fibers of the impregnation part. The water content of the heat-insulating protective member is 50-400 parts by mass per 100 parts by mass of the inorganic fibers of the heat-insulating protective member. The oxide-precursor-containing liquid contains ingredients that, upon burning, yield a composition containing AlOand CaO. The oxide-precursor-containing liquid is adherent in an amount of 2-50 parts by mass in terms of oxide amount per 100 parts by mass of the inorganic fibers of the impregnation part. A molar ratio of Al/Ca, in the whole impregnation part is 10-330.

Heat-insulating protective member for skid post and method for applying the heat-insulating protective member for skid post

A manufacturing method for a flat panel display module includes forming a display section having a transparent substrate with a wiring line terminal section adjacent at least one edge. A light emitting section is a center section, with a sealing cap covering the light emitting section. The sealing cap is dimensioned such that an edge of said sealing cap nearest the wiring line terminal section lies inside the wiring line terminal section. A flexible printed circuit board is provided with a semiconductor device mounted thereon. The flexible printed circuit board is connected to the wiring line terminal section of the transparent substrate, and a frame is fixed around the transparent substrate.

Method for manufacturing a flat panel display module

A flat panel display module includes a transparent substrate, a light emitting section, a sealing cap, a flexible printed circuit board and a semiconductor device. The transparent substrate with a wiring line terminal section is formed on one of surfaces of the transparent substrate in at least one of opposing ends of the transparent substrate. The light emitting section is provided in a display region in a center section on the surface on which the wiring line terminal section of the transparent substrate is formed. The sealing cap is provided for a sealing region to cover the light emitting section such that ends of the sealing cap does not reach the ends of the transparent substrate or the wiring line terminal section of the transparent substrate. The flexible printed circuit board is connected to the wiring line terminal section and extending along the sealing cap of the transparent substrate. The semiconductor device is mounted on the flexible printed circuit board for the light emitting section.

Flat panel display module and method of manufacturing the same

A handy scanner equipped with rollers in a lower surface of a bottom plate thereof includes a bank portion protruding downward from the lower surface of the bottom plate and provided to surround a periphery of an FAP protruding downward from the same lower surface such that the FAP does not contact with a surface of an original. Downward protruding distances of the bank portion and rollers are determined such that at least a portion of the bank portion and the rollers can contact with a surface of an original simultaneously and, preferably, a difference in vertical level between lower ends of the bank portion and the FAP is set such that CTF of the handy scanner becomes 30% or more.

Handy type image scanner

A ceramic substrate for mounting a field emission cathode is secured on the lower surface of a metal flange for assembly of an electron lens of a cathode ray tube, and the mounting position of the field emission cathode on the ceramic substrate is determined with reference to the metal flange.

Field emission cathode supporting structure

There is provided a field emission electron source including (a) a substrate at least a surface of which is electrically conductive, (b) at least one conically shaped, electrically conductive emitter, the emitter being formed on the substrate, (c) an electrically insulating layer formed on the substrate for electrically insulating the substrate from a gate electrode, (d) a gate electrode formed on the electrically insulating layer, the gate electrode and the electrically insulating layer being formed with an opening in which the emitter is disposed, (e) a bonding pad formed on the electrically insulating layer and in electrical communication with the gate electrode, (f) a first metal layer formed on the bonding pad, and (g) a second metal layer formed on the first metal layer, the second metal layer having a higher melting point than that of the first metal layer. For instance, the first metal layer is made of Au--Sn alloy, and the second metal layer is made of Au--Si alloy, Au--Ge alloy, Au--K alloy, Al--Si alloy, Au or Al. In accordance with the above mentioned field emission electron source, a bonding pad has a metal surface including Au or Al as a principal component. Hence, even if Al wire or Au wire is used for wire-bonding, there can be obtained sufficiently high bonding strength between a bonding pad and a wire.

Enhancement in bonding strength in field emission electron source

A method of mounting a semiconductor device first forms a barrier layer on one surface of an semiconductor substrate made of Si. Then, a first Au layer is formed on the barrier layer. Accordingly, a semiconductor device is provided. The barrier layer is formed of metal for preventing mutual diffusion of Si in the Si semiconductor substrate with Au in the first Au layer at a high temperature of 600.degree. C. or higher. A step of acquiring a package substrate forms a metal coated layer on a base first and then forms a second Au layer on the surface of the metal coated layer. Then, the semiconductor device is placed on the package substrate with the first and second Au layers contacting with each other, and the semiconductor device and the package substrate are scrubbed against each other. Consequently, the first and second Au layers form Au--Au eutectic layer, thereby connect the semiconductor device to the package substrate.

Package having Au layer semiconductor device having Au layer

A semiconductor chip such as a cold cathode is mounted on a base plate using a conventional solder or like metallic eutectic material or conductive paste, and then secured to the base plate using an inorganic adhesive or like material, which is capable of being hardened at a temperature lower than the mounting temperature, and the bonding strength of which is not deteriorated even at higher temperatures.

Method of securing a semiconductor chip on a base plate and structure

A structure of a semiconductor accelerometer which includes a body having a mass, beams for supporting the mass and gauge resistors provided on the beams, upper and bottom covering members sandwiching the body so as to form apertures over and under the mass and at least one through hole provided in at least any one of said upper and bottom covering members. Preferably, the through hole is provided at a center portion of the upper covering member. A probe passes through the through hole and the mass is pressed down with the top of the probe by which a predetermined strain is caused at the beams having the gauge resistors. This permits a measurement of the characteristic of the output voltage to the variation of the mass in the vertical direction.

Growing community of inventors

Tokyo, Japan

Akihiro Yano