Panasonic Intellectual Property Management Co., Ltd.

Akihiro Yamauchi

Eiichiro Saito

Kouichi Aoki

Hiroharu Inoue

Yoshihiko Nakamura

Hiroaki Umehara

Takayoshi Ozeki

Yoshiaki Esaki

Tomoyuki Aoki

Hiroyuki Fujisawa

Kenichi Toshimitsu

Nobuo Shibata

Takashi Shinpo

Yuuji Tumuraya

A resin sheet according to the present disclosure includes an uncured product or semi-cured product of a thermosetting resin composition. A melt viscosity of the resin sheet is equal to or greater than 10 Pa·s and equal to or less than 2000 Pa·s when measured using a Koka flow tester under a measuring condition including 130° C. and 1 MPa and is equal to or greater than 6 Pa·s and equal to or less than 1200 Pa·s when measured using the Koka flow tester under a measuring condition including 130° C. and 4 MPa.

Resin sheet, prepreg, insulating resin member, and printed wiring board

A resin composition contains a thermosetting resin (A) and an inorganic filler (B). The inorganic filler (B) includes: a first filler (B); and a second filler (B) of a nanometer scale having a smaller particle size than the first filler (B). The first filler (B) includes an anhydrous magnesium carbonate filler (b) and an alumina filler (b). The proportion of the first filler (B) relative to a total solid content in the resin composition is equal to or greater than 50% by volume and equal to or less than 90% by volume. The proportion of the second filler (B) relative to the total solid content in the resin composition is equal to or greater than 0.1% by volume and equal to or less than 2.0% by volume.

Resin composition, resin film, metal foil with resin, prepreg, metal-clad laminate, and printed wiring board

A resin composition includes: a resin as Component (A); and an inorganic filler as Component (B). The Component (B) includes anhydrous magnesium carbonate as Component (b1) and aluminum oxide as Component (b2). Content of the Component (b1) falls within a range from 35% by volume to 65% by volume relative to 100% by volume of the Components (b1) and (b2) combined. Content of the Component (B) falls within a range from 60% by volume to 75% by volume relative to 100% by volume of the resin composition.

A metal foil with resin is a metal foil with resin including a metal foil and a resin layer disposed on the metal foil, resin layer being obtained by half-curing a resin composition. The resin composition contains a first component that is a polymer, a second component that is a polyarylene ether copolymer, and a third component that is an epoxy resin. The first component has structures represented by formulae (1) and (2) below, with no unsaturated bond between carbon atoms. The third component has two or more epoxy groups per molecule. The second component is compatible with the first component, and the third component is incompatible with the first component. In the formulae (1) and (2), a ratio between x and y is x:y=0:1 to 0.35:0.65, R1 represents hydrogen atom or methyl group, and R2 represents hydrogen atom or an alkyl group. 

Metal foil with resin, and metal-clad laminate and circuit board using same

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Osaka, Japan

Akihiro Yamauchi