Microsoft Technology Licensing, LLC

Ebara Corporation

Akihiro Tsukada

Mudit Agrawal

Kazuo Shimizu

Shinro Ohta

Apparatus and methods of biometric object spoof detection are configured to receive at least first and second images, including a biometric object, respectively captured at a first and second time in response to a first and second incident light. The first and second incident light is emitted from at least one light source at substantially a same wavelength, but with different sets of illumination characteristics. Further, the apparatus and method are configured to respectively determine a first set and a corresponding second set of reflection intensity features respectively based on at least a part of the first and second images, and to determine a set of reflection intensity difference features based on an intensity difference therebetween. Additionally, the apparatus and methods are configured to classify the biometric object as being a fake object or a real object based on at least one of the reflection intensity difference features.

Biometric object spoof detection based on image intensity variations

A first image set that includes a plurality of 2D images of an eye of a user is collected. Two or more sets of corresponding pixels are generated from the plurality of 2D images. One or more 3D features of an iris of the user is extracted based on repeatable differences in reflectance among each set of corresponding pixels. A test set of 3D features for a submitted eye is generated based on a second image set, the second image set including a plurality of 2D images of the submitted eye. Based on a comparison of the one or more extracted 3D features and the test set of 3D features, an indication is made as to whether the second image set is representative of the user's eye.

Iris recognition based on three-dimensional signatures

A polishing apparatus has a polishing table having a polishing surface, a top ring for holding a workpiece to be polished and pressing the workpiece against the polishing surface on the polishing table, and a film thickness measuring device embedded in the polishing table. The film thickness measuring device includes a light source for applying light having a predetermined wavelength to a surface of the workpiece, a spectroscope for separating light reflected from the surface of the workpiece, and a charge coupled device array for capturing light separated by the spectroscope. The polishing apparatus also has a controller operable to analyze information captured by the charge coupled device array over the entire surface of the workpiece to obtain a film thickness at a desired point on the surface of the workpiece.

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Tokyo, Japan

Akihiro Tsukada