Growing community of inventors

Tokyo, Japan

Akihiro Terasaka

Average Co-Inventor Count = 4.44

ph-index = 1

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 2

Akihiro TerasakaMasahiko Shimizu (3 patents)Akihiro TerasakaToshiki Kitazawa (2 patents)Akihiro TerasakaYuichi Yui (2 patents)Akihiro TerasakaHomare Yamato (2 patents)Akihiro TerasakaYasunobu Ishida (2 patents)Akihiro TerasakaKoichi Hasegawa (1 patent)Akihiro TerasakaMakoto Moriya (1 patent)Akihiro TerasakaJun Eto (1 patent)Akihiro TerasakaHiromichi Akiyama (1 patent)Akihiro TerasakaAkihisa Okuda (1 patent)Akihiro TerasakaShoya Mano (1 patent)Akihiro TerasakaMakoto Ishida (1 patent)Akihiro TerasakaKenji Wada (1 patent)Akihiro TerasakaYuki Kani (1 patent)Akihiro TerasakaShogo Otobe (1 patent)Akihiro TerasakaYoshifusa Tobata (1 patent)Akihiro TerasakaAkihiro Terasaka (6 patents)Masahiko ShimizuMasahiko Shimizu (72 patents)Toshiki KitazawaToshiki Kitazawa (11 patents)Yuichi YuiYuichi Yui (9 patents)Homare YamatoHomare Yamato (6 patents)Yasunobu IshidaYasunobu Ishida (2 patents)Koichi HasegawaKoichi Hasegawa (53 patents)Makoto MoriyaMakoto Moriya (26 patents)Jun EtoJun Eto (18 patents)Hiromichi AkiyamaHiromichi Akiyama (16 patents)Akihisa OkudaAkihisa Okuda (15 patents)Shoya ManoShoya Mano (10 patents)Makoto IshidaMakoto Ishida (9 patents)Kenji WadaKenji Wada (8 patents)Yuki KaniYuki Kani (6 patents)Shogo OtobeShogo Otobe (2 patents)Yoshifusa TobataYoshifusa Tobata (1 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Mitsubishi Heavy Industries Limited (6 from 4,618 patents)


6 patents:

1. 12350890 - Composite material bonding apparatus and composite material bonding method

2. 12214577 - Composite structure manufacturing method and composite structure manufacturing device

3. 12059852 - Composite material molding method and composite material molding device

4. 12017424 - Fitting method and repair method

5. 11945179 - Method and device for molding laminate

6. 10456961 - Bonding apparatus and bonding method

Please report any incorrect information to support@idiyas.com
idiyas.com
as of
12/5/2025
Loading…