Kishimoto Sangyo Co., Ltd.

Fine Polymers Corporation

Akihiro Terai

Takashi Yata

Shigeru Kamon

Shigemasa Suga

The invention has for its object the provision of a cleaner capable of removing particles and metal impurities present on the surface of a wafer without corrosion of wirings, gates or the like yet at normal temperature in a short period of time and with a one-pack type solution. To accomplish the above object, the invention provides a cleaner that is an aqueous solution containing phosphoric acid, hydrofluoric acid, and ammonia and/or amine, and having a pH ranging from 2 to 12, wherein the aqueous solution comprises 0.5 to 25 mass % of phosphoric acid, 0.1 to 10 mass % of ammonia and/or amine, and 5&#xd7;10to 5.0 mass % of hydrofluoric acid.

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Tokyo, Japan

Akihiro Terai