Fujikura Limited

International Business Machines Corporation

Akihiro Takamiya

Yuji Saito

Mohammad Shahed Ahamed

Makoto Takahashi

Masataka Mochizuki

Koichi Mashiko

Hiroaki Agata

Tsuyoshi Ogawa

Noriyuki Takada

Tetsuya Kobayashi

Kazuhiko Goto

Fumitoshi Kiyooka

Youji Kawahara

Yoshihiro Nagaki

Tadashi Sano

Thang Toan Nguyen

Katsuo Eguchi

An optical transceiver includes a case including a heat sink, one or more heat generating bodies disposed in the case, one or more heat conducting portions protruding from an inner wall surface of the case and thermally contacting the one or more heat generating bodies, and a heat pipe that transfers heat from the one or more heat conducting portions to the heat sink.

Optical transceiver

A cooling structure for a portable electronic device is provided, configured to accommodate, within a case having a sealing structure, a substrate on which a heat-generating component that generates heat during operation is mounted, and provided with a heat sink that diffuses the heat from the heat-generating component to a place away from the heat-generating component. The heat sink is integrated into an inner surface of an area corresponding to a front cover of the case or an inner surface of an area corresponding to a rear cover of the case, and a flat heat pipe flattened by being compressed in a thickness direction of the case is disposed such that one end is attached by being sandwiched between the heat-generating component and the heat sink while another end is arranged in close contact with the heat sink.

Cooling structure for portable electronic device

In a heat spreading module for a portable electronic device configured such that a heat pipe is attached along a metal plate with which a heating element is brought into close contact, and heat of a heated region of the metal plate with which the heating element is brought into close contact is transferred to a place on the metal plate apart from the heated region by the heat pipe, the heat pipe is configured such that a container is formed of a pipe, a portion of the container arranged on the heated region is a heated portion, and a portion of the container apart from the heated region is a heat dissipation portion that dissipates heat to the metal plate, and the heated portion is formed in a flat shape, and the heat dissipation portion is formed to be thicker than the heated portion having the flat shape.

Heat spreading module for portable electronic device

A vapor chamber, in which a condensable fluid, which evaporates and condenses depending on a state of input and radiation of a heat, is encapsulated in a hollow and flat sealed receptacle as a liquid phase working fluid; and in which the wick for creating the capillary pressure by moistening by the working fluid is arranged in said sealed receptacle, comprising: a wick for creating a great capillary pressure by being moistened by said working fluid, which is arranged on the evaporating part side where the heat is input from outside; and a wick having a small flow resistance against the moistening working fluid, which is arranged on the condensing part side where the heat is radiated to outside.

Vapor chamber

An electronic device cooler for cooling an exothermic member arranged in a case, including an air compressor configured to compress adiabatically air in the case to an elevated temperature. Also included is a heat pipe configured to discharge heat from the air adiabatically compressed to the elevated temperature to an outside of said case, and an expansion turbine configured to expand adiabatically the air having heat discharged by the heat pipe to a reduced temperature.

Cooler for electronic devices

Growing community of inventors

Tokyo, Japan

Akihiro Takamiya