Murata Manufacturing Co., Ltd.

Akihiro Ono

Mitsuru Odahara

Akihiro Motoki

Hideaki Matsushima

Yosuke Moriyama

Hiroya Ueyama

In a multilayer body including a plurality of laminated insulating material layers on which a plurality of coil patterns are provided, the plurality of coil patterns are connected to each other to form a coil having a coil axis parallel to a lamination direction. A pair of outer electrodes connected to the coil are disposed at both ends in the lamination direction. When a direction orthogonal to the lamination direction is defined in an up-down direction, the coil patterns are disposed within the multilayer body so as to be shifted to an upper side. At least a portion of a vertical projection image of the coil on a virtual plane orthogonal to the lamination direction does not overlap a vertical projection image of the outer electrodes on the virtual plane.

Chip inductor

A laminated coil component has an element body formed by laminating a plurality of ceramic layers, and a coil conductor disposed inside the element body. The coil conductor has coil pattern portions disposed on the plurality of the ceramic layers and including line portions and land portions disposed at ends of the line portions, and pattern connecting portions connecting the land portion to each other between the coil pattern portions arranged adjacently in a laminating direction of the ceramic layers. The land portions overlap with the line portions located on the opposite side of the pattern connecting portions in the laminating direction when viewed in the laminating direction such that the centers of the land portions do not overlap with the line portions located on the opposite side of the pattern connecting portions in the laminating direction when viewed in the laminating direction.

Laminated coil component

A multilayer coil component is provided to have high reliability and in which internal stress arising from the difference in firing shrinkage behavior and/or thermal expansion coefficient between ferrite layers and internal conductor layers is alleviated without forming conventional voids between the ferrite layers and the internal conductor layers. A method of manufacturing a multilayer coil includes a step of isolating interfaces between internal conductors and surrounding ferrite by allowing a complexing agent solution to reach interfaces between the internal conductors and the surrounding ferrite through side gap portions from side surfaces of a ferrite element including a helical coil. The complexing agent solution contains at least one selected from the group consisting of an aminocarboxylic acid, a salt of the aminocarboxylic acid, an oxycarboxylic acid, a salt of the oxycarboxylic acid, an amine, phosphoric acid, a salt of phosphoric acid, and a lactone compound.

Method of manufacturing multilayer coil component

An electronic component that can be prevented from being mounted on a circuit board with inclination, and a manufacturing method thereof are provided. An electronic component is mountable on a circuit board including a first land and a second land. The electronic component includes outer electrodes on a lower surface of a stack to be arranged along a direction and are connectable to the first land and the second land, respectively. With the electronic component mounted to the circuit board, respective contact surfaces of the outer electrodes to the first land and the second land have a structure being symmetric about a line parallel to the direction, and each respective contact surface is divided into a plurality of portions.

Electronic component and manufacturing method thereof

An electronic component that can be prevented from being shifted from a normal mount position and can be manufactured with a low cost is provided. The component is configured by stacking a plurality of insulating layers and a plurality of inner conductors provided on the respective insulating layers. The connection conductors have respective exposure portions that are each exposed between corresponding ones of the insulating layers at a surface of the stack. An outer electrode is formed, for example, by plating on the lower surface so that the exposure portions are covered with the outer electrode. The plurality of exposure portions do not have uniform thicknesses or are not arranged at uniform intervals in the stacking direction.

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Kyoto-fu, Japan

Akihiro Ono