Murata Manufacturing Co., Ltd.

Akihiro Nomura

Hidekiyo Takaoka

Kosuke Nakano

Muneyuki Daidai

Shinji Otani

Tetsuo Takeshima

Osamu Yokokura

Takeshi Kishimoto

Suguru Nakano

Masayuki Fujino

Yuji Kishida

Koutarou Mishima

A carbon paste that includes at least a carbon filler, and a thermosetting resin including a phenoxy resin. The phenoxy ratio X in the thermosetting resin is within a range of 20 Wt %&#x2264;X&#x2264;70 Wt %, and the carbon filler content ratio Y with respect to a total of the carbon filler and the thermosetting resin is within a range of 30 Wt %&#x2264;Y&#x2264;70 Wt %.

Carbon paste and capacitor element for a solid electrolytic capacitor using carbon paste

A solid electrolytic capacitor that includes a valve action metal base, an insulating layer, a solid electrolyte layer, a carbon layer and an electrode layer sequentially formed in one of two parts of the valve action metal base. The electrode layer is formed from a conductive paste that includes at least a conductive filler, a thermosetting resin containing a phenoxy resin, and a curing agent.

Conductive paste and solid electrolytic capacitor including the same

An electronic device has a printed substrate having land electrodes and a chip-type electronic component having external electrodes formed on a surface of a component element body. The land electrodes and the external electrodes are bonded via a solder to form electrode bonding parts. A thermosetting resin is filed between the electrode bonding parts. The bonding material contains solder particles having a melting point T1, a thermosetting resin having a curing temperature T2 that is higher than the melting point T1, and an activating agent having an activation temperature T3 that is lower than the curing temperature T2. The viscosity of the contained components except the solder particles at the melting point T1 is 0.57 Pa&#xb7;s or less, and the melting point T1 and the activation temperature T3 satisfy T1&#x2212;T3&#x3c;50&#xb0; C.

Electronic device, bonding material, and method for producing electronic device

A conductive resin composition which allows a resin electrode which is favorable in terms of shape and adhesion to a ceramic device to be formed reliably, and a chip-type electronic component including resin electrodes formed with the conductive resin component are described. The conductive resin composition contains a linear bifunctional epoxy resin having a molecular weight of 11000 to 40000 and a terminal glycidyl group, a conductive silver powder, and a solvent, and has a yield value of 3.6 Pa or less. In addition, the conductive powder can have a surface attached to a fatty acid or a salt thereof, and the ratio of the fatty acid or salt thereof to the conductive powder is 0.5 wt % or less. Furthermore, the conductive powder can be spherical, and the ratio of the conductive powder in solids constituting the conductive resin composition can be 42 to 54 vol %.

Conductive resin composition and chip-type electronic component

An electroconductive bonding material contains a thermosetting resin, a low-melting-point metal powder which is melted at a temperature equal to or lower than the thermosetting temperature of the thermosetting resin, a high-melting-point metal powder which is not melted at a temperature equal to or lower than the thermosetting temperature of the thermosetting resin and which reacts with the low-melting-point metal powder to form a reaction product having a high melting point of 300&#xb0; C. or higher during heat-hardening of the thermosetting resin, and a reducing substance which removes an oxide formed on the surface of the high-melting-point metal powder. The total content of the low-melting-point metal powder and the high-melting-point metal powder is 75% to 88% by weight, and the particle size ratio D/Dof the average particle size Dof the low-melting-point metal powder to the average particle size Dof the high-melting-point metal powder is 0.5 to 6.0. Thereby, an electroconductive bonding material is provided which has good conduction properties and high connection strength even when reflow heat treatment is repeatedly carried out or thermal shock accompanied with a rapid temperature change is applied to the electroconductive bonding material, and an electronic apparatus using such an electroconductive bonding material.

Electroconductive bonding material and electronic apparatus

An electronic chip component includes a package provided with external electrodes having excellent heat resistance and adhesion. In the electronic chip component, a package includes heat-resistant resin molding, and the external electrodes are provided on the surface of the package. The resin molding include a polymeric material having polar groups of at least one of an ether group, an ester group, a hydroxyl group, a carbonyl group, an amido group, and an imido group. The external electrodes have a multilayer structure having at least two layers including a lowermost layer containing a conductive film formed by baking conductive paste composed of a resin composition and metal particles at a low temperature, the resin composition including a compound having a trifunctional or higher functional group in one molecule. Each of the external electrodes includes an uppermost layer including a metal plate having good solderability.

Electronic chip component

A piezoelectric acoustic component includes a diaphragm having a substantially rectangular piezoelectric plate including front and back surfaces, an electrode disposed on the front surface, a substantially rectangular metal plate bonded to the back surface of the substantially rectangular piezoelectric plate directly or via an electrode disposed on the back surface of the substantially rectangular piezoelectric plate, an insulating cap having an upper wall, four side walls extending from the upper, a pair of support members arranged to support the diaphragm at the inside of the two of four sides walls opposed to each other, and a plate shaped substrate having a first electrode section and a second electrode section. The diaphragm is disposed the insulating cap. Two of four side edges of the diaphragm are opposed to each other and fixed to the pair of support members. A gap is formed between the other two of four side edges of the diaphragm and the cap and is sealed by elastic sealing material. An acoustic space is provided between the diaphragm and the upper wall of the insulating cap. An opening edge of the four side walls of the insulating cap is bonded to the substrate. The metal plate is electrically connected to the first electrode section. The electrode disposed on the front surface of the substantially rectangular piezoelectric plate is electrically connected to the second electrode section.

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Nagaokakyo, Japan

Akihiro Nomura