Kabushiki Kaisha Shinkawa

Nippon Steel Corporation

Shinkawa Ltd.

Ocv Intellectual Capital, LLC

Akihiro Nishimura

Nobuto Yamazaki

Shinichi Teraoka

Koji Sato

Yasunobu Suzuki

Shinichi Tamura

Hisao Ishida

Hideki Fujii

Kazuhiko Adachi

Akio Bando

Motohiko Kato

Seiichi Chiba

An austenitic stainless steel according to the present invention has a chemical composition containing, by mass %: C: 0.01 to 0.15%; Si: 2.0% or less; Mn: 3.0% or less; Cr: 10.0 to 20.0%; Ni: 5.0 to 13.0%; N: 0.01 to 0.30%; Nb: 0 to 0.5%; Ti: 0 to 0.5%; and V: 0 to 0.5%, with the balance: Fe and impurities, wherein an average grain size is 10.0 &#x3bc;m or less, a difference in value of an average lattice constant d(={d&#xd7;I+d&#xd7;I+d&#xd7;I+d&#xd7;I}/{I+I+I+I}) of an austenite phase between a surface portion and a center portion is 0.010 &#x212b; or more, and a value of a diffraction peak integrated intensity ratio r (=100&#xd7;&#x3a3;I/&#x3a3;I) at a surface is 95% or more.

Austenitic stainless steel

A ferritic stainless steel plate having a sheet thickness t of 5.0 to 12.0 mm, including a chemical composition consisting of, in mass percent, C: 0.001 to 0.010%, Si: 0.01 to 1.0%, Mn: 0.01 to 1.0%, P: 0.04% or less, S: 0.010% or less, Cr: 10.0 to 20.0%, Ni: 0.01 to 1.0%, Ti: 0.10 to 0.30%, V: 0.01 to 0.40%, Al: 0.005 to 0.3%, N: 0.001 to 0.02%, and as necessary, one or more of B, Mo, Cu, Mg, Sn, Sb, Zr, Ta, Nb, Hf, W, Co, Ca, REM, and Ga, with the balance being Fe and unavoidable impurities, wherein in a steel micro-structure, on a cross section parallel to a rolling direction, an area ratio of structures each satisfying: major grain diameter/minor grain diameter being 5.0 or more is 90% or more, and an average minor grain diameter of the structures is 100 &#x3bc;m or less.

Ferritic stainless steel sheet, hot coil, and automobile exhaust flange member

A ferritic stainless steel plate having a sheet thickness t of 5.0 to 12.0 mm, including a chemical composition consisting of, in mass percent, C: 0.001 to 0.010%, Si: 0.01 to 1.0%, Mn: 0.01 to 1.0%, P: 0.04% or less, S: 0.010% or less, Cr: 10.0 to 20.0%, Ni: 0.01 to 1.0%, Ti: 0.10 to 0.30%, V: 0.01 to 0.40%, Al: 0.005 to 0.3%, N: 0.001 to 0.02%, and as necessary, one or more of B, Mo, Cu, Mg, Sn, Sb, Zr, Ta, Nb, Hf, W, Co, Ca, REM, and Ga, with the balance being Fe and unavoidable impurities, wherein in a steel micro-structure, on a cross section parallel to a rolling direction, an area ratio of structures each satisfying: major grain diameter/minor grain diameter being less than 5.0 is 90% or more, and an average minor grain diameter of the structures is 55 &#x3bc;m or less. The ferritic stainless steel sheet is excellent in toughness and suitable for an automobile exhaust flange member and the like.

An apparatus is provided for producing continuous glass filaments by spinning molten glass through nozzles of a bushing and cooling the thus-spun filaments with fins joined to one or more cooled manifolds and arranged in a proximity of the nozzles. Each manifold is provided at at least three locations thereof with at least one inlet port and at least one outlet port for coolant, respectively, with a proviso that the total number of the inlet and outlet ports is the same as the number of the locations of the manifold. Without using a complex construction, this invention makes it possible to provide the fins with improved durability and to produce the glass filaments with improved quality. In particular, the present invention can be applied to large bushings each of which is equipped with a number of nozzles.

Continuous glass filaments manufacturing equipment

A tab tape bonder including a bonding device which bonds semiconductor chips, etc. to a tab tape, a first roller driver which feeds the tab tape into the bonding device, a detector which detects holes or perforations formed in the tab tape fed by the first roller driver, and a controller which controls the feeding pitch of the tab tape by the first roller driver in accordance with the detection results obtained by the detector.

Tape bonding apparatus

In a bonder tool cleaning mechanism in a bonding machine, a coarse grindstone, a finishing grindstone and a wire brush are provided on a cleaning section, and when a bonding tool is moved above the cleaning section and then moved down to come into contact with the grindstones and brush, the cleaning section oscillates horizontally so that grindstones and brush clean the bonding tool.

Bonder tool cleaning mechanism

Method for bonding inner leads installed on a tab tape, which is fed in one direction in a bonding line, to electrodes of semiconductor elements via ultrasonic vibrations applied to a bonding tool mounted at one end of horn is performed in such a manner that the direction in which the ultrasonic vibrations are applied to the bonding tool is in the range of 30 to 60 degrees, preferably 45 degrees, with respect to the direction in which the tab tape is fed so that the bonding tool oscillates in such angles.

Method for bonding semiconductor elements to a tab tape

Method of forming bumps out of wire on the electrode of a semiconductor element is executed by setting a tip end underneath a vertically movable wedge, lowering the wedge to press the tip end of the wire against the semiconductor element, securely connecting the tip end to the electrode, and then pulling the wire away from the electrode to cut the wire, leaving the tip end on the electrode.

Method for forming bump on semiconductor elements

Method of manufacturing semiconductor elements equipped with leads which are connected to electrodes and formed of wires including the steps of positioning each semiconductor element on a bonding stage, feeding a tip end of the wire under a bonding tool so that the bonding tool presses the tip end against the electrode to bond it to the electrode, shifting the bonding tool to away from the tip end and pressing the wire against wire-cutting section of the bonding stage, and pulling the wire away from the bonding tool to cut the wire.

Method for manufacturing semiconductor elements equipped with leads

A bonding method for bonding inner leads on a film to electrodes of semiconductor elements is performed by the steps of: individually positioning the film and semiconductor elements at a predetermined bonding position; individually recognizing the positions of the inner leads and electrodes; selecting a combination of one inner lead and one electrode which are positionally shifted relative to each other; correcting relative position of the inner lead and electrode which are positionally shifted so that the inner lead and electrode are aligned; the inner lead and electrode are bonded; relative positions of remaining inner leads and elctrodes are aligned; and the inner leads and elctrodes are individually connected by bonding.

Bonding method

An apparatus for connecting or bonding leads of solid-state devices to lead frames, etc. in which a solid-state device punched out of a film carrier by a punch is first picked up and held by a suction-adhesion head. A raising and lowering arm is then driven longitudinally and laterally so that the suction-adhesion head with the solid-state device thereon is moved to a position over a first bonding station. Then, the raising and lowering arm is lowered via a vertical driving mechanism, and the solid-state device held by the suction-adhesion head is pressed against a specified lead frame. A first bonding tool is lowered and simultaneously bonds the leads on two opposite sides of the solid-state device to the lead frame. Then, the first bonding tool is raised, and the suction-adhesion head is raised and moves back to a position over the punch. The lead frame to which two sides of the solid-state device have been thus bonded is fed, and at a second bonding position, the leads on the other two opposite sides of the solid-state device are bonded to the lead frame by a second bonding tool.

Apparatus for connecting external leads

An inner lead bonder for bonding dies to leads of carrier tape with improved positional accuracy and improved work efficiency. In the inner lead bonder, dies are fed to a die positioning spot one at a time and positioned. Then, said positioned die is carried to a bonding position. On the other hand, leads of a carrier tape are fed to the bonding position and positioned at the spot above the aforesaid die. Thereafter, the leads of the carrier tape are pressed onto the die and bonded by using a bonding tool. This inner lead bonder is characterized in that it includes a rotary table with the size covering the die positioning point and the bonding position, and after positioning the die on the rotary table, the rotary table is rotated in order to bring the die positioned as mentioned above to the bonding position to place the die at a proper position for bonding.

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Tokyo, Japan

Akihiro Nishimura