Fujifilm Corporation

Akihiro Mukaiyama

Takamichi Fujii

In a method for etching a piezoelectric film and a manufacturing method thereof, a piezoelectric film is formed on a substrate on which a lower electrode is formed, a metal film having a thickness of 20 nm to 300 nm is formed, a patterned resist film is formed, the metal film is etched with a first etchant to which the piezoelectric film has etching resistance, and the piezoelectric film is etched with a second etchant to which the metal film has etching resistance.

Method for etching piezoelectric film and method for manufacturing piezoelectric element

A method of manufacturing a micro structure, includes the steps of: preparing separate first and second substrates, the first substrate having a first surface on which a first structural body having a first height and a second structural body having a second height greater than the first height of the first structural body are arranged, the second substrate having a second surface; then placing the first and second substrates to cause the first and second surfaces to face each other across the first and second structural bodies; and then bonding the first and second substrates to each other while compressing the second structural body in a height direction thereof between the first and second surfaces to cause the second structural body to have a height defined by the first structural body.

Method of manufacturing micro structure, and substrate structure

A flow channel structure includes: a first substrate in which a first flow channel section is arranged; a first adhesive layer which is arranged on the first substrate; a first noble metal layer containing gold and arranged over the first adhesive layer on the first substrate; a second substrate in which a second flow channel section is arranged; a second adhesive layer arranged on the second substrate; a second noble metal layer containing gold and arranged over the second adhesive layer on the second substrate; and an Au tubular structure disposed between the first and second noble metal layers which face to each other across the Au tubular structure, the Au tubular structure having a hollow portion serving as a connecting flow channel section which connects the first and second flow channel sections, a gold content of the Au tubular structure being not lower than 90 at. %.

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Kanagawa, Japan

Akihiro Mukaiyama