Murata Manufacturing Co., Ltd.

Murata Manufacturingco., Ltd.

Akihiro Motoki

Makoto Ogawa

Kenichi Kawasaki

Shunsuke Takeuchi

Toshiyuki Iwanaga

Tatsuo Kunishi

Masahito Saruban

Shigeyuki Kuroda

Syunsuke Takeuchi

Seiichi Nishihara

Shuji Matsumoto

Takehisa Sasabayashi

Yoshihiko Takano

Yoji Yamamoto

Seiichi Matsumoto

Takayuki Kayatani

Junichi Saito

Hideyuki Kashio

Seiji Katsuta

Akihiro Yoshida

Yasuaki Kainuma

Wataru Ogawa

Mitsuru Odahara

Kiyoyasu Sakurada

Atsushi Ishida

Takashi Noji

Akihiro Ono

Satoshi Kodama

Toshihiko Kobayashi

Kenji Masuko

Tatsuya Nagaoka

Atsuko Saito

Toshinobu Fujiwara

Kunihiko Hamada

Ichiro Nakamura

Norihiro Yoshikawa

Yoshinori Ueda

Takumi Taniguchi

Jun Nishikawa

Akira Saito

Shoichi Higuchi

Takeaki Tamayama

Katsumori Nagamiya

Tomoyuki Kuwano

Teruyo Katayama

Tatsunori Kobayashi

A circuit block assembly is provided that includes circuit blocks that each include a circuit board and a semiconductor element that is disposed on a first main surface of the circuit board. Moreover, each of the circuit blocks includes a metal heat spreader that is connected to the semiconductor element directly or by a thermally conductive member interposed therebetween. A thermally conductive sheet is provided that is thermally connected to the heat spreader. The thermally conductive sheet has a specific electrical resistance higher than a specific electrical resistance of the heat spreader.

Circuit block assembly

An electronic component includes an electronic component body and an external electrode. The external electrode is disposed on the electronic component body. The external electrode includes a Pd plating layer and a Ni plating layer. The Pd plating layer defines an outermost layer. The Ni plating layer is disposed inside the Pd plating layer. The Ni plating layer is partly exposed from the Pd plating layer.

Electronic component and electronic component-mounted structure

A monolithic ceramic electronic component includes a ceramic body including a stack of ceramic layers. Inner electrodes are disposed within the ceramic body and include exposed portions at the end surfaces of the ceramic body. A pair of outer electrodes is arranged on the end surfaces of the ceramic body so as to extend from the end surfaces to the main surfaces and side surfaces of the ceramic body. Each of the outer electrodes includes a lower electrode layer provided on the ceramic body, an intermediate electrode layer located on the lower electrode layer and defined by a plated Ni layer, and an upper electrode layer located on the intermediate electrode layer and defined by a plated Pd layer. A thickness of the intermediate electrode layer on the main surfaces and the side surfaces of the ceramic body is larger than a thickness of the intermediate electrode layer on the end surfaces of the ceramic body.

Monolithic ceramic electronic component

In order to prevent the ingress of moisture into a void section of a component main body of a ceramic electronic component, at least the component main body of the ceramic electronic component is provided with water repellency using a water repellent agent. The water repellent agent is dissolved in a supercritical fluid such as, a supercritical COfluid, as a solvent to provide at least the component main body with water repellency. After providing the water repellency, the water repellent agent on the outer surface of the component main body is removed. As the water repellent agent, a silane coupling agent may be used.

Method for producing ceramic electronic component

A monolithic ceramic electronic component includes a component body and outer electrodes. The component body includes a plurality of stacked ceramic layers and a plurality of inner electrodes which extend between the ceramic layers, which contain Ni, and which include exposed ends exposed on predetermined surfaces of the component body. The outer electrodes are electrically connected to the exposed ends of the inner electrodes and are formed on the predetermined surfaces of the component body by plating. The inner electrodes include Mg&#x2014;Ni coexistence regions where Mg and Ni coexist.

In a method of forming a plating layer for an external terminal electrode by applying, for example, copper plating to an end surface of a component main body with respective ends of internal electrodes exposed, and then applying a heat treatment at a temperature of about 1000&#xb0; C. or more in order to improve the adhesion strength and moisture resistance of the external terminal electrode, the plating layer may be partially melted to decrease the bonding strength of the plating layer. In the step of applying a heat treatment at a temperature of about 1000&#xb0; C. or more to a component main body with plating layers formed thereon, the average rate of temperature increase from room temperature to the temperature of about 1000&#xb0; C. or more is set to about 100&#xb0; C./minute or more. This average rate of temperature increase maintains a moderate eutectic state in the plating layer and ensures a sufficient bonding strength of the plating layer.

Laminated ceramic electronic component and manufacturing method therefor

A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600&#xb0; C. or more.

Method for manufacturing multilayer electronic component

An electronic component including an electronic component element with an external electrode, a Ni plating film on the external electrode, and a Sn plating film covering the Ni plating film. The Sn plating film has Sn&#x2014;Ni alloy flakes therein, the Sn&#x2014;Ni alloy flakes are present in the range from a surface of the Sn plating film on the Ni plating film to 50% or less of the thickness of the Sn plating film, and when Sn is removed from the Sn plating film to leave only the Sn&#x2014;Ni alloy flakes, an observed planar view of a region occupied by the Sn&#x2014;Ni alloy flakes falls within the range from 15% to 60% of the observed planar region.

Electronic component and manufacturing method therefor

A multilayer ceramic electronic component including thin external terminal electrodes each having a superior bonding force to a ceramic base body is provided. In order to form the external terminal electrodes, after Cu plating films are deposited on exposed portions of internal electrodes by direct plating on a ceramic base body, a Cu liquid phase, an O-containing liquid phase, and a Cu solid phase are generated between the Cu plating film and the ceramic base body by a heat treatment, so that Cu oxides are dispersed in the Cu plating film, at least near an interface with the ceramic base body. Since the Cu oxides function as an adhesive, a bonding force of the Cu plating film to the ceramic base body can be increased, and hence the external terminal electrode having a superior bonding force to the ceramic base body can be obtained.

Method for manufacturing a multilayer ceramic electronic component

A monolithic ceramic electronic component includes an outer electrode including a first plating layer formed directly on a component body by electroless plating so as to cover an exposed portion distribution region including exposed portions of a plurality of inner electrodes and a second plating layer formed by electrolytic plating so as to cover the first plating layer. An amount of extension of the first plating Eand an amount of extension of the second plating Esatisfy the relationship E/(E+E)&#x2266;20%, where Erepresents a distance from an edge of the exposed portion distribution region to an edge of the first plating layer, and Erepresents a distance from the edge of the first plating layer to an edge of the second plating layer.

In a method of manufacturing a laminate type electronic component, while the distance between adjacent exposed ends of a plurality of internal electrodes is adjusted preferably to be about 50 &#x3bc;m or less, a plurality of conductive particles composed of Pd, Pt, Cu, Au, or Ag are provided on the surface of a component main body. The conductive particles have an average particle size of about 0.1 nm to about 100 nm, which are distributed in island-shaped configurations over the entire surface of the component main body, while the average distance between the respective conductive particles is adjusted to fall within the range of about 10 nm to about 100 nm. The component main body is subjected to electrolytic plating such that plating growth develops in and around a region including the respective exposed ends of the plurality of internal electrodes.

Laminate type electronic component and manufacturing method therefor

An electronic component, preferably in the form of a laminated ceramic capacitor, which suppresses the growth of whiskers and has excellent solderability, includes an electronic component element in the shape of, for example, a rectangular parallelepiped. External electrodes of terminal electrodes are located on first and second end surfaces of the electronic component element. First plated films including plated Ni are located on the surfaces of the external electrodes. Second plated films are located on the surfaces of the first plated films. The second plated films have stacked structures including first plated layers and second plated layers. The second plated layers have lower degrees of densification than the first plated layers.

Electronic component

A multilayer coil component is provided to have high reliability and in which internal stress arising from the difference in firing shrinkage behavior and/or thermal expansion coefficient between ferrite layers and internal conductor layers is alleviated without forming conventional voids between the ferrite layers and the internal conductor layers. A method of manufacturing a multilayer coil includes a step of isolating interfaces between internal conductors and surrounding ferrite by allowing a complexing agent solution to reach interfaces between the internal conductors and the surrounding ferrite through side gap portions from side surfaces of a ferrite element including a helical coil. The complexing agent solution contains at least one selected from the group consisting of an aminocarboxylic acid, a salt of the aminocarboxylic acid, an oxycarboxylic acid, a salt of the oxycarboxylic acid, an amine, phosphoric acid, a salt of phosphoric acid, and a lactone compound.

Method of manufacturing multilayer coil component

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Fukui, Japan

Akihiro Motoki