Mitsubishi Electric Corporation

Akihiro Matsusue

Koichi Nakamura

Yutaka Yoneda

Nobuo Ohata

Tomohiro Maegawa

Hiroaki Ichinohe

Hidekazu Kodera

Takuro Shinada

Hiromitsu Itamoto

Yoshiyuki Kamo

Kento Mori

An optical sensor module comprises a substrate, a photodetector which detects light and is fixed to the substrate and a lens holding member, to which a lens is fixed, which is fixed to the substrate at a position surrounding the photodetector, and the lens is fixed in the state in which an outer circumference of the lens is covered by a material itself of the lens holding member, and a part of an outer edge of the lens is exposed at a side of an outer surface of the lens holding member or at a side of an inner surface of the lens holding member.

Optical sensor module and manufacturing method thereof

A first conductive pattern () is provided on an upper surface of the submount (). A GND pattern () is provided on a lower surface of the submount (). A lower surface electrode () of a capacitor () is bonded to the first conductive pattern () with solder (). An upper surface electrode () of the capacitor () is connected to a light emitting device (). A terminating resistor () is connected to the first conductive pattern (). The first conductive pattern () has a protruding portion () which protrudes outside from the capacitor () in planar view. A width of the protruding portion () is narrower than a width of the capacitor ().

Optical semiconductor device

A semiconductor device according to the present invention includes: a semiconductor element; a first metal body having a die pad to which the semiconductor element is mounted, the semiconductor element being mounted on a die bond surface of the die pad; a second metal body which has a wire bond pad connected to a signal electrode of the semiconductor element via a wire, and is provided on the same side as the die bond surface such that the second metal body is separated from the first metal body and covered by the first metal body, the second metal body forming a transmission line together with the first metal body; and a molding resin holding the first metal body and the second metal body such that a surface of the first metal body opposite to the die bond surface is exposed.

Semiconductor device and antenna device

A wavelength-multiplexing optical communication module includes: a substrate; a plurality of light sources on the substrate; a plurality of joint materials separately disposed on the substrate at positions respectively corresponding to the plurality of light sources; and a plurality of optical components fixed on the substrate by means of the plurality of joint materials respectively, wherein the substrate includes a plurality of forming portions which respectively form peripheries of the plurality of joint materials into shapes of circles or regular polygons having an even number of vertices.

Wavelength-multiplexing optical communication module

A metallic ring is located on a multilayer ceramic substrate. An optical semiconductor laser is located on the multilayer ceramic substrate, inside the metallic ring. A metallic cap with a window is joined to the metallic ring. The metallic cap covers the optical semiconductor laser. An external heat sink is joined to an external side surface of the metallic cap. These features make it possible to improve high-frequency characteristics, producibility, and heat dissipation.

Semiconductor package

An optical module and a manufacturing method improve positioning accuracy between parts. A barrel and a lens holder are prepared, the lens holder is fitted into a cylindrical portion from a collar portion side of the barrel, and the barrel and the lens holder are assembled. In one case, the barrel and the lens holder are assembled with a brazing material. The assembled barrel and lens holder are heated, and the brazing material is melted to braze the barrel and the lens holder. Lens glass is sandwiched between metal dies and a lens is press-molded using a pressing apparatus. In one case, positioning of press molding uses the barrel which has a small linear expansion coefficient.

Optical module and manufacturing method thereof

A lens cap for an optical module includes: a barrel of a metal material; and a press lens of glass and held in the barrel. The coefficient of linear expansion of the glass is 6 to 8 ppm/K, and the coefficient of linear expansion of the metal material is at least 10 ppm/K at 150&#xb0; C. to 800&#xb0; C. and no more than 8 ppm/K at up to 100&#xb0; C. or below.

Lens cap for optical module, optical module, and method for manufacturing lens cap for optical module

A wiring is located on a multilayer ceramic substrate. A ceramic block is located on the multilayer ceramic substrate. Electronic parts, including a semiconductor laser, are located on a surface of the ceramic block. A wiring located on the surface of the ceramic block connects some of the electronic parts to the wiring. A metallic cap with a glass window is located on the multilayer ceramic substrate. This metallic cap covers the ceramic block and the electronic parts, including the semiconductor laser.

Growing community of inventors

Tokyo, Japan

Akihiro Matsusue