Daicel Chemical Industries, Ltd.

Akihiro Inozuka

Kazushi Watanabe

A molding resin composition comprises 70 to 99.5 wt. % of a mixture A comprising (a) 5 to 95 wt. % of a polyamide and (b) 95 to 5 wt. % of a thermoplastic polyester and 0.5 to 30 wt. % of a copolymer B obtained from (c) 80 to 98 wt. % of an aromatic vinyl compound, (d) 19 to 1 wt. % of alpha, beta-unsaturated carboxylic acid compound and (e) 19 to 1 wt. % of an unsaturated epoxy compound. It may further comprise (f) 50 to 10 wt. % of glass fiber.

Growing community of inventors

Amherst, MA, United States of America

Akihiro Inozuka