Sharp Kabushiki Kaisha Corporation

Mitsui Takeda Chemicals, Inc.

Mitsui Takada Chemicals Inc.

Akihiro Imai

Taiji Morimoto

Makoto Kanbe

Shigeki Tanaka

Sachio Igarashi

Ryoh Ueda

Motoaki Fukayama

Kazuaki Imamura

An array board includes a glass substrate including a display area and a non-display area, an organic insulation film disposed over a range of the display area and the non-display area, an array board side alignment film disposed on the organic insulation film, a film forming area restricting portion disposed in the non-display area and recessed in a part of the surface of the organic insulation film, and an alignment film material storing portion disposed closer to the display area than the film forming area restricting portion in the non-display area and recessed in a part of the organic insulation film. An angle formed by at least a part of a surface of the alignment film material storing portion and a normal line of the glass substrate is greater than an angle formed by a side surface of the film forming area restricting portion and the normal line.

Display component and display device

The solvent-free two-component adhesive composition of the present invention is prepared by a polyol component (A) and a polyisocyanate component (B), wherein the composition comprises at least one polyol component having crystallinity and selected from the group consisting of a polyester polyol, a polyether polyol, a polycarbonate polyol and a polyurethane polyol in an amount of 3 to 50% by weight relative to the total weight of the components (A) and (B). The adhesive composition has the initial viscosity of about 100 to 1,500 mPa&middot;s (in particular, 100 to 1,000 mPa&middot;s) at 70&deg; C. immediately after the components (A) and (B) are mixed together, and the increasing ratio of viscosity after the composition is stood at 70&deg; C. for 10 minutes to the initial viscosity of 120% or less. According to the present invention, a composite laminated film having the good external appearance can be produced simply and effectively.

Solvent-free two-component curable adhesive composition

The solvent-free two-component adhesive composition of the present invention comprises a polyol component (A) and a polyisocyanate component (B), and the viscosity of the mixture at 80&deg; C. immediately after the point of time the components (A) and (B) are mixed together is 900 mPa&middot;s or higher. The component (A) may be a polyol having a number average molecular weight of 800 or larger, or a mixture thereof, and the viscosity of the component (B) at 25&deg; C. may be 20,000 mPa&middot;s or higher. The composition may be used for laminating metal foil of 5 to 15 m thickness with a plastic film. By using the composition of the present invention, the occurrence of blocking due to the seepage of the adhesive from metal foil is prevented. The present invention includes a process of lamination using the same.

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Osaka, Japan

Akihiro Imai