Toshiba Mitsubishi-electric Industrial Systems Corporation

Tmeic Corporation

Akihiro Ichinose

Yoshihito Yamada

Hiroshi Kobayashi

In an ultrasonic joining apparatus according to the present disclosure, an ultrasonic joining apparatus control board controls an operation of a lead set unit and a tension adjustment unit including a dancer roller to perform joining tension control processing. The joining tension control processing includes steps of: making a lead wire housing mechanism perform a rewinding driving of rewinding a lead wire in a lead cassette when the dancer roller reaches a lower limit adjustment position in a tension adjustment range; and making the lead wire housing mechanism perform a delivery driving of sending out the lead wire from the lead cassette when the dancer roller reaches an upper limit adjustment position in the tension adjustment range.

Ultrasonic joining apparatus

A lead wire storage mechanism stores most of a lead wire such that the lead wire can be taken out from a tip end portion. A tension adjusting mechanism including a dancer roller and two lifting and lowering guide rollers is formed with a partial space that is to be a part of a hand travel space at a time of a preparation state. A lead wire guide mechanism including an opening and closing lead guide is formed with a partial space that is to be a part of the hand travel space at the time of the preparation state. A lead wire grasping and moving mechanism can execute a grasping operation for grasping a tip end portion of the lead wire with a grasping part, and a grasping part moving operation for moving the grasping part through the hand travel space.

Lead wire pulling out mechanism

In an ultrasonic bonding method, three ultrasonic bonding head units are disposed above a bonding target. At this time, initial heights in the three ultrasonic bonding head units are set to different heights from each other. Thereafter, a batch multiple lowering operation by a lifting-lowering servomotor and ultrasonic vibration operations by the three ultrasonic bonding head units are executed. At this time, a lowering speed Vof the batch multiple lowering operation, an operation time T(min) of the ultrasonic vibration operation, and an adjustment gap length &#x394;g among the initial heights are set to satisfy {T&#x3c;&#x394;g/V

Ultrasonic bonding method

First and second operations are executed under control of a peeling inspection control apparatus functioning as a peeling and grasping control unit. In the first operation, a processed surface contact state in which a processed outer peripheral surface of a contact roller and a surface of a lead wire are in contact with each other is maintained, and contact roller rotation operation is executed in which the contact roller is moved on the surface of the lead wire while the contact roller is being rotated. During execution of the first operation, a tip portion of the lead wire is peeled from a glass substrate. Thereafter, in the second operation, grasping operation is executed in which the tip portion of the lead wire peeled from the glass substrate is grasped by a grasping mechanism.

Peeling and grasping apparatus, peeling inspection apparatus, and ultrasonic vibration bonding system

An ultrasonic vibration welding apparatus includes an air cylinder that is coupled to an ultrasonic welding head unit and executes a pressurizing operation of pressurizing on the ultrasonic welding head unit, and a lifting-lowering servomotor that executes a lifting-lowering operation including a lowering operation of lowering the ultrasonic welding head unit and the air cylinder at once, as components separate from each other.

Ultrasonic vibration welding apparatus

A bonding tool that executes an ultrasonic vibration processing of applying ultrasonic vibration to an application portion on a lead wire from a direct contact tip portion and a pair of press mechanisms having a pair of press rollers capable of performing a rotational operation. The pair of press mechanisms executes a press processing of pressing both sides of the application portion on the lead wire by the pair of press rollers at a time of execution of the ultrasonic vibration processing by the bonding tool and a movement processing of executing a rotational operation performed by the pair of press rollers to move the pair of press rollers on the lead wire while pressing the lead wire at a time of non-execution of the ultrasonic vibration processing.

Ultrasonic vibration bonding apparatus

A bonding tool as the tool for ultrasonic bonding includes a plurality of protrusion portions in a protrusion region at a contact tip portion. The plurality of protrusion portions are equally spaced at a longitudinal direction interval in an X direction as the longitudinal direction of the protrusion region, and an X direction outermost protrusion portion positioned outermost in the X direction is disposed separately from a side edge of the protrusion region in the X direction by a longitudinal direction side edge distance. The plurality of protrusion portions are disposed so that a first disposition condition {0.349&#x2264;EX (the longitudinal direction side edge distance/DX (the longitudinal direction interval)&#x2264;0.510} is satisfied.

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Tokyo, Japan

Akihiro Ichinose