Asahi Glass Company, Limited

Akihiro Hishinuma

Kenji Imakita

Yasuko Osaki

Katsuyoshi Nakayama

Hideaki Hayashi

Masamichi Tanida

Toshihisa Okada

Shiro Ohtaki

Shinji Honda

Kazuyoshi Orihara

Takashi Ootsuki

Rui Yanagawa

To provide a reflective frame for a light-emitting element, which can be preferably used for a light-emitting device having a metal member on which a light-emitting element is mounted, whereby the light extraction efficiency, the reliability and the productivity, etc. can be improved. A reflective frame for a light-emitting element, which is made of a sintered body comprising a glass material and a ceramic powder; and the sintered body is one fired at at most 900&#xb0; C. and has a porosity of at most 15% and an average reflectance at a wave length of from 400 to 700 nm being at least 86% when the thickness is 1 mm.

Reflective frame for light-emitting element, substrate for light-emitting element and light-emitting device

Provided is a light-emitting device provided with a light reflection layer which has a high light reflectivity and which is less susceptible to deterioration of the reflectivity due to corrosion, and having an improved light extraction efficiency. A light-emitting device comprising a substrate having a conductor layer formed on its surface and a light-emitting element disposed on the conductor layer, characterized in that an overcoat layer is formed between the conductor layer and the light-emitting element, and the overcoat layer is a borosilicate glass which comprises, as represented by mol % based on oxides, from 62 to 84% of SiO, from 10 to 25% of BO, from 0 to 5% of AlOand from 0 to 5% in total of at least one of NaO and KO, provided that the total content of SiOand AlOis from 62 to 84%, and may contain from 0 to 10% of MgO and at least one of CaO, SrO and BaO in a total content of at most 5%.

Light-emitting device

To provide a light emitting diode package of which the height of protrusion of a thermal via is decreased without decreasing the flexural strength of an insulating substrate. A light emitting diode package comprising a light emitting diode element mounted on a substrate, wherein the substrate is obtained by firing a glass ceramic composition containing a powder of glass containing, as represented by mole percentage, from 57 to 65% of SiO, from 13 to 18% of BO, from 9 to 23% of CaO, from 3 to 8% of AlOand from 0.5 to 6% of at least one of KO and NaO in total, and a ceramic filler.

Light emitting diode package

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Koriyama, Japan

Akihiro Hishinuma