Hitachi Cable, Inc.

Hitachi Metals, Ltd.

Hitachi Aloka Medical, Ltd.

Akihiro Hiruta

Yoshinori Sunaga

Yoshiaki Ishigami

Juhyun Yu

Masahiko Kobayashi

Hidetaka Kawauchi

Ryuta Takahashi

Hiroki Katayama

Masaki Ogura

Chihiro Ohkubo

Kouki Hirano

Koki Hirano

Kinya Yamazaki

Naoyuki Yamada

Izumi Fukasaku

Shinichi Inoue

Noribumi Kobayashi

Koji Kumagai

To efficiently cool an IC chip and a transmission module disposed on the same substrate, amounting structure of transmission module of the present invention includes a motherboard, a package substrate mounted on the motherboard, an IC chip and a plurality of connectors disposed on amounting surface of the package substrate, a plurality of transmission modules connected to the plurality of connectors, and module cooling members having a plurality of slits provided along an connector array direction. The connectors are disposed inside the slits of module cooling members, and the transmission modules can be connected to and disconnected from the connectors disposed through the slits. The transmission modules connected to the connectors are in contact with inside surfaces of the slits and thermally connected to the cooling members.

Mounting structure of transmission module

A radioactive ray detecting apparatus provides for reduction of the dead area or region where radioactive rays cannot be detected, even if disposing the radioactive ray detectors to be dense or crowded. The radioactive ray detecting apparatus satisfies the following relationships, when assuming that distance between semiconductor elements is 'XG1', while the distance from the semiconductor element of one of the radioactive ray detectors up to the semiconductor element of other radioactive ray detectors is 'XG2', and distance between the semiconductor elements alighted in a Y-direction is &#x201c;YG1&#x201d;, and a horizontal pitch of a predetermined pixel pitch to be used as the radioactive ray detector is &#x201c;a&#x201d; and a vertical pitch thereof is &#x201c;b&#x201d;, width of a surface of each of plural numbers of semiconductor elements is &#x201c;c&#x201d; and length thereof is &#x201c;d&#x201d;, respectively:&#x2212;(1+2)/21=2+(&#x2212;2)

Radioactive ray detecting apparatus

A flexible flat optical cable includes two flexible base sheets, one or more optical fiber core wires arranged between the base sheets and each comprising at least an optical fiber, and an adhesive layer provided between the base sheets to bond the base sheets. A non-adhesive region is formed on a surface of the base sheets or the adhesive layer adjacent, in a thickness direction of the base sheets, to at least a portion of the optical fiber core wires for allowing a portion of the optical fiber core wires to move in a direction intersecting with an axial direction of the optical fiber core wires.

Flexible flat optical cable

To provide a photoelectric composite wiring component combining both characteristics of low power consumption of transmission over electrical wiring and large transmission capacity of optical transmission over optical wiring, and exhibiting a high power efficiency for the transmission capacity. A mechanism for switching between transmission of a transmission signal over an electrical transmission path and that over an optical transmission path depending on the modulation rate or the transmission rate of the transmission signal is provided. When the modulation rate or the transmission rate of the transmission signal is low, power supply to an optical transmitting/receiving section is stopped and the signal is transmitted over the electrical transmission path, thus achieving low power consumption. When the modulation rate or the transmission rate of the transmission signal is high, the signal is transmitted over the optical transmission path, thus achieving a large transmission capacity.

Photoelectric composite wiring component and electronic apparatus using the photoelectric composite wiring component

A transmission/reception optical module has an optical transmission subassembly, an optical reception subassembly, and a circuit boardwherein the circuit boardis formed into one member by a rigid/flexible substrate. Circuit board main bodies, and an optical reception subassembly fixation regionare formed by rigid regionsA,, andP. An area provided between the circuit board main bodyand the optical reception subassemblyis composed of a flexible regionP. A part of the circuit board main bodyis composed of a flexible region

Transmission/reception optical module

A communication module mounted on a communication apparatus includes a communication apparatus main body including a plurality of slots, and being insertable into or removable from the slots, a plurality of apparatus side signal processing circuits for processing a communication signal which is transmitted to or received from the communication module, and a switch LSI for changing a destination of the communication signal. The communication module includes a switching portion for performing dividing the communication signal transmitted or received at a communication speed of the communication module, and combining the communication signals transmitted or received at a communication speed of an external apparatus, a connector including a plurality of input-output ports, each of the plurality of the input-output ports being connected to the external apparatus respectively, and a plurality of connecting terminals being connected to the communication apparatus main body when the communication module is inserted into the slots.

Communication module and communication apparatus

A communication module mounted on a communication apparatus which includes plural communication modules, plural apparatus side signal processing circuits for processing a communication signal which is transmitted to and received from the communication modules by a predetermined communication speed, and a switch LSI for changing a destination of the communication signal, includes a switching portion for at least one of dividing the communication signal transmitted and received in a communication speed of the communication modules and combining the communication signals transmitted and received in a communication speed of an external apparatus, and a connector comprising a plurality of ports, the connector being connected to the switching portion.

An optical transmission assembly consists of an upper cladding; a lower cladding; a specified width core formed between the upper cladding and the lower cladding; a surface light emitting device mounted on an upper surface of the upper cladding, a light emitting surface of the surface light emitting device facing the core; a reflective surface formed at a position in the core facing the light emitting surface of the surface light emitting device, and inclined in a longitudinal direction of the core; a shift area formed by which a beam from the light emitting surface of the surface light emitting device and the reflective surface are shifted in a width direction of the core relative to each other; and a light receiving device mounted on a lower surface of the lower cladding, a light receiving surface of the light receiving device facing the light emitting surface of the surface light emitting device through the shift area.

Optical transmission assembly

An optical transmission assembly consists of an upper cladding; a lower cladding; a core formed between the upper cladding and the lower cladding; a surface light emitting device mounted to an upper surface at one end of the upper cladding, a light emitting surface of the surface light emitting device facing the core and emitting wavelength &#x3bb;light thereto; a reflective surface formed in the core and at a position facing the light emitting surface of the surface light emitting device, and inclined in a longitudinal direction of the core; an inclined surface formed in the core and facing the reflective surface in a longitudinal direction of the core, and inclined in a thickness direction of the upper or lower cladding; a wavelength filter formed on the inclined surface and transmitting wavelength &#x3bb;light incident in a longitudinal direction of the core while reflecting wavelength &#x3bb;(&#x3bb;) light incident in the opposite longitudinal direction of the core to the incident direction of the wavelength &#x3bb;light, in a thickness direction of the lower cladding; and a light receiving device mounted on a lower surface of the lower cladding and facing the wavelength filter.

An optical fiber temperature sensing device has a sensor body; a light source housed in the sensor body; a temperature measuring optical fiber disposed outside the sensor body and extended to a temperature measurement site, wherein, when a light is emitted from the light source into the temperature measuring optical fiber, Stokes light intensity and anti-Stokes light intensity of backscattered light generated in the temperature measuring optical fiber are detected to determine a temperature at the temperature measurement site; a reference temperature optical fiber disposed inside the sensor body; and a controller that is operable to control an output of the light source by monitoring Stokes light intensity and anti-Stokes light intensity of backscattered light generated in the reference temperature optical fiber.

Optical fiber temperature sensing device

An optical transmitter for coupling and wavelength-multiplexing optical signals with a different wavelength has 3 or more light sources for emitting parallel optical signals with a different wavelength, and 2 kinds of optical components with a different optical signal reflectance arranged in an optical path of each light source for coupling into one the optical signals emitted from the light sources respectively. The reflectance or transmittance of each of the 2 kinds of optical components is set so that each optical signal has the same optical signal power when reflected off or transmitted through the optical components for being coupled together and output from the optical transmitter.

Optical wavelength division multiplexing transmitter

An optical sensor has: a sensing portion having an optical fiber to be disposed at a measurement point of temperature, distortion, pressure etc.; a light source to output a light to the sensing portion; and a photodetector to detect a backscattered light from the sensing portion. The sensing portion has a tape sheet and the optical fiber shaped into a corrugated form with a predetermined curvature. Alternatively, the sensing portion has a polymer optical waveguide with a core shaped into a corrugated form with a predetermined curvature.

Optical sensor, optical temperature-measuring device and measuring method using the optical sensor

A photoelectric conversion module with a cooling function has a semiconductor element to transmit/receive an optical signal, a stem to fix the semiconductor element, a cap to cover the semiconductor element, and a lead to apply an electrical signal to the semiconductor element or to transmit an electrical signal from the semiconductor element, wherein on the stem, there is provided a heat releasing device formed of a peltiert element, and a thermal conduction member for heat absorption and a thermal conduction member for heat release provided respectively on both sides of the peltiert element, and the semiconductor element is directly disposed on the thermal conduction member for heat absorption.

Photoelectric conversion module with cooling function

A photoelectric composite interconnection assembly having: a flexible substrate having an electric interconnection; and an electrical interface provided at both ends of the electric interconnection. A part of the electric interconnection is replaced by an optical transmission line.

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Hitachi, Japan

Akihiro Hiruta